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Dive into the research topics where N. T. M. Hai is active.

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Featured researches published by N. T. M. Hai.


New Journal of Chemistry | 2006

Surface redox chemistry of adsorbed viologens on Cu(100)

Duc-Thanh Pham; Knud Gentz; Caroline Zörlein; N. T. M. Hai; Sung-Lin Tsay; Barbara Kirchner; Simone Kossmann; K. Wandelt; Peter Broekmann

The surface redox-chemistry of adsorbed viologens is studied by means of cyclic voltammetry (CV) in combination with in situ scanning tunneling microscopy (STM). 1,1′-Dibenzyl-4,4′-bipyridinium molecules (DBV2+) adsorb on a chloride modified Cu(100) electrode surface under formation of a laterally well ordered 2D array of supramolecular cavitand ensembles. Each cavitand consists at least of 4 individual DBV2+ sub-units which are arranged in a certain circular manner making this supramolecular cavitand chiral. Both possible enantiomeric forms are found in two mirror domains at the surface. Reducing the di-cationic DBV2+(ads) species to the corresponding radical mono-cation DBV•+(ads) causes a phase transition from the pre-existing DBV2+(ads) cavitand phase to a stripe pattern following a nucleation and growth mechanism. DBV•+(ads) species are adsorbed with their main molecular axis parallel to the surface in a side-on adsorption geometry. Enhanced intermolecular π–π-interactions are identified as the main driving force for the formation of 1D oligomer and polymer chains as the characteristic structural motif of the DBV•+(ads) phase. These structural motifs are generally independent of the electronic and structural substrate properties. Chloride desorption through the viologen film is discussed as the reason for an order–disorder transition within the viologen film at even more negative potentials.


Physical Chemistry Chemical Physics | 2009

Electrochemical reactions at a porphyrin–copper interface

N. T. M. Hai; Tom Vosch; Steven De Feyter; Peter Broekmann; K. Wandelt

The structure and reactivity of a Cu(100) single crystal electrode surface covered with free base meso-tetra (N-methyl-4-pyridinium) porphyrin (abbreviated as H(2)TMPyP) as a function of electrode potential have been investigated with cyclic voltammetry (CV), electrochemical scanning tunneling microscopy (ECSTM), and UV-Vis and Raman spectroscopy. The well-ordered self-assembled layer of the porphyrin is consistent with the adsorption of the reduced porphyrin species after the first two-electron reduction step. The copper dissolution reaction in the presence of the stable self-assembled porphyrin layer starts at step edges on both upper and lower terraces and coincides with the preferential oxidation of reduced porphyrin species at step sites. The dissolved copper cations are incorporated into the free base porphyrin molecules leading to the formation of CuTMPyP. As a consequence this new species accumulates in the solution with time and a copper redeposition in the cathodic potential scan is lacking.


Electrochimica Acta | 2011

Classification of suppressor additives based on synergistic and antagonistic ensemble effects

Peter Broekmann; Alexander Fluegel; C. Emnet; Marco Arnold; C. Roeger-Goepfert; A. Wagner; N. T. M. Hai; Dieter Mayer


Journal of Physical Chemistry B | 2006

X-ray diffraction and STM study of reactive surfaces under electrochemical control: Cl and I on Cu(100).

Sascha Huemann; N. T. M. Hai; Peter Broekmann; K. Wandelt; Hubert Zajonz; H. Dosch; Frank Uwe Renner


Journal of the American Chemical Society | 2005

Synthesis of Chiral Self-Assembling Rhombs and Their Characterization in Solution, in the Gas Phase, and at the Liquid−Solid Interface

Kyung Seok Jeong; Sun Young Kim; Ueon Sang Shin; Michael Kogej; N. T. M. Hai; Peter Broekmann; Nakcheol Jeong; Barbara Kirchner; Markus Reiher; Christoph A. Schalley


Journal of Physical Chemistry C | 2012

Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives

N. T. M. Hai; Jan Odermatt; Valentine Grimaudo; Karl Krämer; Alexander Fluegel; Marco Arnold; Dieter Mayer; Peter Broekmann


Electrochimica Acta | 2012

Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating

N. T. M. Hai; T.T.M. Huynh; Alexander Fluegel; Marco Arnold; Dieter Mayer; Werner Reckien; Thomas Bredow; Peter Broekmann


Electrochimica Acta | 2012

Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating

N. T. M. Hai; Karl Krämer; Alexander Fluegel; Marco Arnold; Dieter Mayer; Peter Broekmann


Electrochimica Acta | 2013

On the role of halides and thiols in additive-assisted copper electroplating

Thi Mien Trung Huynh; Florian Weiss; N. T. M. Hai; Werner Reckien; Thomas Bredow; Alexander Fluegel; Marco Arnold; Dieter Mayer; Hubert Keller; Peter Broekmann


Journal of The Electrochemical Society | 2013

Quasi-Reversible Interaction of MPS and Chloride on Cu(100) Studied by In Situ STM

Thi Mien Trung Huynh; N. T. M. Hai; Peter Broekmann

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Sascha Huemann

European Synchrotron Radiation Facility

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