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Dive into the research topics where N.X. Nguyen is active.

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Featured researches published by N.X. Nguyen.


IEEE Transactions on Microwave Theory and Techniques | 2000

Power performance and scalability of AlGaN/GaN power MODFETs

Egor Alekseev; Dimitris Pavlidis; N.X. Nguyen; Chanh Nguyen; David E. Grider

The scalability of power performance of AlGaN/GaN MODFETs with large gate periphery, as necessary for microwave power devices, is addressed in this paper. High-frequency large-signal characteristics of AlGaN/GaN MODFETs measured at 8 GHz are reported for devices with gatewidths from 200 /spl mu/m to 1 mm. 1-dB gain compression occurred at input power levels varying from -1 to +10 dBm as the gatewidth increased, while gain remained almost constant at -17 dB. Output power density was /spl sim/1 W/mm for all devices and maximum output power (29.9 dBm) occurred in devices with 1-mm gates, while power-added efficiency remained almost constant at /spl sim/30%. The large-signal characteristics were compared with those obtained by dc and small-signal S-parameters measurements. The results illustrate a notable scalability of AlGaN/GaN MODFET power characteristics and demonstrate their excellent potential for power applications.


24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu | 2002

Reliability of commercial InP HBTs under high current density lifetests

Kevin Feng; N.X. Nguyen; Chanh Nguyen

GCS has successfully developed a high performance and manufacturable 4-inch InP HBT technology for commercial pure-play foundry services. In this paper, we demonstrated that with our proprietary device design and process technology, GCSs InP HBTs show potentially excellent reliability under lifetests at current densities of 100kA/cm/sup 2/ or higher. The V/sub be/s at both low and high current densities have little shift up to 4000hrs under 150kA/cm/sup 2/, which indicates that the C-doped InP HBT is potentially much more stable compared to Be-doped InP HBT for high current density operation. The emitter resistance also shows very stable behavior over the stress time under high current density stresses.


Solid-state Electronics | 1999

GaN MODFET microwave power technology for future generation radar and communications systems

D.E. Grider; N.X. Nguyen; Chanh Nguyen

Abstract In order to gain a better understanding of the role that GaN MODFET technology will play in future generation radar and communications systems, a comparison of the state-of-the-art performance of alternative microwave power technologies will be reviewed. The relative advantages and limitations of each technology will be discussed in relation to system needs. Device results from recent MBE-grown GaN MODFETs will also be presented. In particular, 0.25 μm gate GaN MODFETs grown by MBE have been shown to exhibit less than 5% variation in maximum drain current density (Idmax) from the center to the edge of a 2 inch wafer. This level of uniformity is a substantially higher than that normally found in MOCVD-grown GaN devices (∼28% variation). In addition, evidence is also presented to demonstrate the excellent reproducibility of MBE-grown GaN MODFETs.


international microwave symposium | 1999

Large-signal characteristics of AlGaN/GaN power MODFETs

Egor Alekseev; Dimitris Pavlidis; N.X. Nguyen; Chanh Nguyen; David E. Grider

This work addresses the scalability of power performance of AlGaN/GaN MODFETs with large gate periphery, as necessary for microwave power devices. High-frequency large-signal characteristics of AlGaN/GaN MODFETs have been studied for devices with gate widths from 0.2 to 1 mm. 1-dB gain compression occurred at input power levels varying from -1 to +10 dBm as the gate width increased, while gain remained almost constant at /spl sim/17 dB. Output power density was maximum (1.3 W/mm) for devices with 0. 6 mm gates and maximum output power (29.9 dBm) occurred in devices with 1 mm gates, while power-added-efficiency remained almost constant at /spl sim/30%.


Proceedings GaAs Reliability Workshop, 2003. | 2003

Investigation of reliability for C-doped InP/InGaAs/InP HBTs under high current density operation

Kevin Feng; N.X. Nguyen; Chanh Nguyen

Abstrad In this paper, we demonstrated that with our proprietary device design and process technology, GCS’s InP HBTs show excellent reliability under high current density lifetests. Both Va. and emitter resistance are very stable during ISOkA/cm’ stressing, which indicates that the Cdoped InP HBT is potentially much more stable compared lo Be-doped InP HBT for high current density operation. No low activation energy (<O.SeV) failure mode was found for out C-doped InP HBTs. The extracted activation energy is greater than 0.97eV. The estimated MTTF at 125°C is over 3 million hours for device operating at 150kAicmz current density.


Electronics Letters | 1999

Drain current compression in GaN MODFETs under large-signal modulation at microwave frequencies

Chanh Nguyen; N.X. Nguyen; D.E. Grider


Electronics Letters | 2000

High performance microwave power GaN/AlGaN MODFETs grown by RF-assisted MBE

N.X. Nguyen; Miroslav Micovic; W.-S. Wong; P. Hashimoto; L.-M. McCray; Paul Janke; Chanh Nguyen


Electronics Letters | 2000

Robust low microwave noise GaN MODFETs with 0.60 dB noise figure at 10 GHz

N.X. Nguyen; Miroslav Micovic; W.-S. Wong; P. Hashimoto; Paul Janke; D.S. Harvey; Chanh Nguyen


Electronics Letters | 2000

GaN/AlGaN high electron mobility transistors with f τ of 110 GHz

Miroslav Micovic; N.X. Nguyen; Paul Janke; W.-S. Wong; P. Hashimoto; L.-M. McCray; Chanh Nguyen


Electronics Letters | 1998

High performance GaN/AlGaN MODFETs grown by RF-assisted MBE

Chanh Nguyen; N.X. Nguyen; M. Le; D.E. Grider

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