Nadeem Hasan Rizvi

New developments and applications in the production of 3D microstructures by laser micromachining

Micro-machining techniques using pulsed lasers are currently being applied world-wise in many diverse industrial application areas including biomedical devices, printers, flat-panel displays, semiconductors devices and telecommunication systems. In particular, the use of excimer lasers has been at the forefront of the new developments in the manufacture of complex micro-structures for the production of micro-optical-electro-mechanical-systems units such as nozzles, optical devices and sensors. This paper reviews the fundamentals of excimer laser micromachining techniques and details recent developments which have enhanced the capabilities of these approaches. Application areas where these techniques are of interest are highlighted.

Excimer laser patterning of thick and thin films for high-density packaging

Excimer laser projection methods have ben developed to directly create high resolution electrical circuits in both thin nd thick-film metallic layers in order to form robust, compact multi-chip module interconnection devices, miniature sensor elements, miniature flexible printed circuits, antennas etc at high sped and low cost. Patterning over small or large areas is possible at high speed using simple step and repeat or more complex synchronous mask and workpiece scanning methods. Ablation rates depend strongly upon the thickness of the metal layer varying from complete metal removal with 1 laser shot for thin films to multiple 10s of shots for films to a few J/cm2 for screen printed polymer thick films or thick sputtered films. Multiple layer interconnect circuits and complex advanced sensor devices have been successfully fabricated using these excimer laser metal film patterning methods together with laser via drilling and patterning of dielectric layers using a laser tool with appropriate level to level alignment and mask changing and scanning facilities.

Applications of laser ablation to microengineering

Applications of pulsed laser ablation to the manufacture of micro- electro-mechanical systems (MEMS) and micro-opto-electro-mechanical systems (MOEMS) devices are presented. Laser ablative processes used to manufacture a variety of microsystems technology (MST) components in the computer peripheral, sensing and biomedical industries are described together with a view of some future developments.

Development of an industrial femtosecond laser micromachining system

Within the research project FEMTO, supported by the European Commission, a compact diode-pumped titanium:sapphire laser has been developed which matches the requirements of industrial systems, like compact dimensions and stable laser operation. To achieve this, the laser has been specially designed to be integrated directly into the machining system. For best process speed combined with optimal cutting quality, focus has been laid upon high repetition rates at moderate pulse energies. Typical average output powers are around 1.5W and repetition rates of up to 5 kHz. Accompanying to the laser development, a micro-machining system has been designed to meet the requirements of femtosecond laser micro-machining. In parallel to the machine development, machining processes have been investigated and optimized for different applications. The machining of delicate medical implants has been demonstrated as well as the machining system for general micro-machining of sensitive and delicate materials has been proven. Therefore, the developed machine offers the potential to boost the use of femtosecond lasers in industrial operation.

Laser micromachining: new developments and applications

Excimer laser micromachining has developed into a mature production method and many industrial applications such as the drilling of ink-jet printer nozzles, production environments. The important concepts of excimer laser micromachining systems are described and the novel methods which have been developed in this area are presented. In particular, techniques for the production of complex, multi- level 3D microstructures are described and examples of such features are used to illustrate the relevant applications. Furthermore, some initial micromachining result from a sub- nanosecond, solid-state fiber laser are presented to highlight the rapidly-growing area of laser micro processing using ultra-short pulse lasers.

Excimer laser micromachining system for the production of bioparticle electromanipulation devices

Multi-level micro-electrode structures have been produced using excimer laser ablation techniques to obtain devices for the electro-manipulation of bioparticles using traveling electric field dielectrophoresis effects. The system sued to make these devices operates with a krypton fluoride excimer laser at a wavelength of 248 nm and with a repetition rate of 100Hz. The laser illuminates a chrome-on-quartz laser at a wavelength of 248nm and with a repetition rate of 100Hz. The laser illuminates a chrome-on-quartz mask which contains the patterns for the particular electrode structure being made. The masks then imaged by a high-resolution lens onto the sample. Large areas of the mask pattern are transferred to the sample by using synchronized scanning of the mask and workpiece with sub-micron precision. Electrode structures with typical sizes of approximately 10 micrometers are produced and a multi-level device is built up by ablation of electrode patterns and layering insulators. To produce a traveling electric field suitable for the manipulation of bioparticles, a linear array of 10 micrometers by 200 micrometers micro- electrodes, placed at 20 micrometers intervals, is used. The electric field is created by energizing each electrode with a sinusoidal voltage 90 degrees out of phase with that applied to the adjacent electrode. On exposure to the traveling electric field, bioparticles become electrically polarized and experience a linear force and so move along the length of the linear electrode array. The speed and direction of the particles is controlled by the magnitude and frequency of the energizing signals. Such electromanipulation devices have potential uses in a wide range of biotechnological diagnostic and processing applications.

Micromachining of industrial materials with ultrafast lasers

The use of femtosecond-pulse titanium sapphire lasers for micromachining applications is described, with particular emphasis on the advantages and disadvantages of this technology for existing and emerging microfabrication applications. The effects of micromachining in different materials such as silicon, diamond and glass are presented and the results are compared with those from other laser sources. The relevance to emerging applications is discussed.The use of femtosecond-pulse titanium sapphire lasers for micromachining applications is described, with particular emphasis on the advantages and disadvantages of this technology for existing and emerging microfabrication applications. The effects of micromachining in different materials such as silicon, diamond and glass are presented and the results are compared with those from other laser sources. The relevance to emerging applications is discussed.

Manufacture of miniature bioparticle electromanipulators by excimer laser ablation

Multilevel microelectrode structures have been produced using excimer laser ablation techniques to obtain devices for the electro-manipulation of bioparticles using traveling electric field dielectrophoresis effects. The system used to make these devices operates with a krypton fluoride excimer laser at a wavelength of 248 nm and with a repetition rate of 100 Hz. The laser illuminates a chrome-on-quartz mask which contains the patterns for the particular electrode structure being made. The mask is imaged by a high- resolution lens onto the sample. Large areas of the mask pattern are transferred to the sample by using synchronized scanning of the mask and workpiece with sub-micron precision. Electrode structures with typical sizes of approximately 10 micrometers are produced and a multi-level device is built up by ablation of electrode patterns and layered insulators. To produce a traveling electric field suitable for the manipulation of bioparticles, a linear array of 10 micrometers by 200 micrometers microelectrodes, placed at 20 micrometers intervals, is used. The electric field is created by energizing each electrode with a sinusoidal voltage 90 degree(s) out of phase with that applied to the adjacent electrode. On exposure to the traveling electric field, bioparticles become electrically polarized and experience a linear force and so move along the length of the linear electrode array. The speed and direction of the particles is controlled by the magnitude and frequency of the energizing signals. Such electromanipulation devices have potential uses in a wide range of biotechnological diagnostic and processing applications. Details of the overall laser projection system are presented together with data on the devices which have been manufactured so far.

Laser micromachining of optical biochips

Optical biochips may incorporate both optical and microfluidic components as well as integrated light emitting semiconductor devices. They make use of a wide range of materials including polymers, glasses and thin metal films which are particularly suitable if low cost devices are envisaged. Precision laser micromachining is an ideal flexible manufacturing technique for such materials with the ability to fabricate structures to sub-micron resolutions and a proven track record in manufacturing scale up. Described here is the manufacture of a range of optical biochip devices and components using laser micromachining techniques. The devices employ both microfluidics and electrokinetic processes for biological cell manipulation and characterization. Excimer laser micromachining has been used to create complex microelectrode arrays and microfluidic channels. Excimer lasers have also been employed to create on-chip optical components such as microlenses and waveguides to allow integrated vertical and edge emitting LEDs and lasers to deliver light to analysis sites within the biochips. Ultra short pulse lasers have been used to structure wafer level semiconductor light emitting devices. Both surface patterning and bulk machining of these active wafers while maintaining functionality has been demonstrated. Described here is the use of combinations of ultra short pulse and excimer lasers for the fabrication of structures to provide ring illumination of in-wafer reaction chambers. The laser micromachining processes employed in this work require minimal post-processing and so make them ideally suited to all stages of optical biochip production from development through to small and large volume production.

193-nm excimer laser microstepper system

An excimer laser microstepper, intended for R and D studies of 193nm lithography, is described. System details such as the laser performance, beam transport, wafer handling and photoresist processes are outlined.