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Nakamura Shinya

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Publication

Featured researches published by Nakamura Shinya.

Archive | 2007

Epoxy resin composition and electronic part device

Nakamura Shinya; Katayose Mitsuo

Archive | 2005

Curable resin composition and electronic component device

Nakamura Shinya; Hanada Kayoko; Katayose Mitsuo

Archive | 2011

Epoxy resin based molding material for use in sealing, and electronic components and devices

Hamada Mitsuyoshi; Nakamura Shinya; Masuda Tomoya; Takemiya Keizo; Baba Tooru

Archive | 2008

NEW CURABLE RESIN, METHOD FOR PRODUCING THE SAME, EPOXY RESIN COMPOSITION AND ELECTRONIC PART DEVICE

Masuda Tomoya; Nakamura Shinya

Archive | 2010

EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE USING THE SAME

Masuda Tomoya; Nakamura Shinya

Archive | 2003

EPOXY RESIN COMPOSITION FOR SEALING USE AND ELECTRONIC COMPONENT DEVICE

Takahashi Yoshihiro; Nakamura Shinya; Ikezawa Ryoichi; Akimoto Takayuki; Katayose Mitsuo

Archive | 2006

EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, EPOXY RESIN COMPOSITION AND ELECTRONIC PART APPARATUS

Nakamura Shinya; Katayose Mitsuo; Uchida Keiichi

Archive | 2006

NEW COMPOUND AND MANUFACTURING METHOD THEREOF, AND CURABLE RESIN, EPOXY RESIN COMPOSITION AND ELECTRONIC PARTS DEVICE COMPRISING THE NEW COMPOUND

Nakamura Shinya; Katayose Mitsuo; Uchida Keiichi

Archive | 2017

PRIOR-SUPPLY TYPE UNDERFILL MATERIAL, CURED PRODUCT OF THE SAME, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING THE SAME

Inoue Hidetoshi; Masuda Tomoya; Nakamura Shinya

Archive | 2017

PRIOR-SUPPLY TYPE UNDERFILL MATERIAL, CURED PRODUCT OF PRIOR-SUPPLY TYPE UNDERFILL MATERIAL, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE

Inoue Hidetoshi; Masuda Tomoya; Nakamura Shinya

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Collaboration

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Katayose Mitsuo

Hitachi

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Akimoto Takayuki

Hitachi

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Ikezawa Ryoichi

Hitachi

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