Naohide Wakita

Shock-problem free flcds and mechanism of alignment destruction by mechanical shock

Abstract The mechanism of alignment destruction of FLCDs by a mechanical shock is discussed and a radical solution for the problem is suggested. It is cleared by computer simulation that the alignment destruction is caused by shear between both substrates when a panel is deformed. Against a general concept that stiffer panels can resist more shock, we found that very thin and light panels with a flexible substrate like a plastic film are free from such shock-problem. The reason why AFLCDs is more durable against shock than FLCDs is also discussed.

Multi-color projection display

Abstract A large size, ultra-high resolution display has been demanded for the computer systems such as CAD and workstation. In order to realize the demand beyond the ability of CRT, the laser-addressing liquid crystal projection displays have already been in practical use. However, those type of projection displays have a disadvantage that it takes a few minutes to redraw the entire screen.

AC-field-stabilized matrix ferroelectric LCD

Abstract Using a newly developed driving method for AC-field-stabilized matrix ferroelectric LCDs, high contrast and flickerless displays are obtained in 1000 line multiplexing for rubbed and oblique-evaporated panels, each of them possessing 640 × 400 pixels of size 12 inch, 4 μm thick. In this paper, the novel driving method, the display performance, and dependancy of the AC stabilizing effect on cell thickness, are described.

Display. Special Contribution from IDW'99. Reflective Three-Layer GH-LC Panel Fabricated by using Lithographic LC/Resist Composite Films.

We developed a process for fabricating reflective three-layer LCD panels using a new material. The material is an LC/resist composite that has high resolution when applied to patterning LC layers by using conventional photolithographic processes. We fabricated for the first time a 2-inch matrix panel having three GH-LC layers on a substrate using this process.