Publication


Featured researches published by Naoki Fukutomi.


electronic components and technology conference | 1994

Transfer laminate circuit process for fine pitch wiring technology

Yoshiaki Tsubomatsu; Yasunobu Yoshidomi; Hirohito Ohhata; Toshio Yamazaki; Naoki Fukutomi

The transfer laminate circuit (TLC) process is presented which has a vast potential for extending the wiring density of laminated multichip modules (MCM-Ls) to a level of deposited MCMs (MCM-Ds). In this paper, factors affecting the resolution of wiring patterns produced by TLC process are studied and a feasibility of making fine pitch wiring patterns is demonstrated.<<ETX>>


Archive | 1995

Fabrication process of semiconductor package and semiconductor package

Naoki Fukutomi; Yoshiaki Tsubomatsu; Fumio Inoue; Toshio Yamazaki; Hirohito Ohhata; Shinsuke Hagiwara; Noriyuki Taguchi; Hiroshi Nomura


Archive | 1989

Process for producing printed wiring board

Hiroshi Takahashi; Shin Takanezawa; Masao Kanno; Toshiro Okamura; Naoki Fukutomi; Hiroyoshi Yokoyama; Hideo Watanabe; Hajime Yamazaki; Hiroyuki Wakamatsu; T. Takahashi


Archive | 1992

Fabrication process of wiring board

Naoki Fukutomi; Hajime Nakayama; Yoshiaki Tsubomatsu; Kouichi Kaitou; Yasunobu Yoshidomi; Yoshihiro Takahashi


Archive | 1995

Semiconductor package manufacturing method and semiconductor package

Naoki Fukutomi; Yoshiaki Tsubomatsu; Fumio Inoue; Toshio Yamazaki; Hirohito Ohhata; Shinsuke Hagiwara; Noriyuki Taguchi; Hiroshi Nomura


Archive | 1998

Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device

Naoki Fukutomi; Yoshiaki Wakashima; Susumu Naoyuki; Akinari Kida


Archive | 1994

Wiring board for electrical tests with bumps having polymeric coating

Naoki Fukutomi; Hidehiro Nakamura; Hajime Nakayama; Yoshiaki Tsubomatsu; Masanori Nakamura; Kouichi Kaitou; Atsushi Kuwano; Itsuo Watanabe; Masahiko Itabashi


Archive | 1987

Process for producing high-density wiring board

Akinari Kida; Naoki Fukutomi; Yoshiaki Tsubomatsu; Takuya Yasuoka


Archive | 1969

METHOD FOR CONNECTING CONDUCTORS

Yo Maeda; Satoshi Suzuki; Yoshilharu Nakamura; Yorimitu Masubuchi; Tamotsu Ueyama; Naoki Fukutomi; Hiroshi Takahashi


Archive | 1993

Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board

Takashi Yamadera; Kazumasa Takeuchi; Ritsuko Obata; Naoki Fukutomi; Kazuko Suzuki

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