Naoya Kanda | Researchain

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Archive | 1988

Connecting structure of electronic part and electronic device using the structure

Takanobu Noro; Kunio Matsumoto; Muneo Oshima; Naoya Kanda; Suguru Sakaguchi; Akira Murata

Archive | 2001

Semiconductor module and method of making the device

Yoshihide Yamaguchi; Takao Terabayashi; Hiroyuki Tenmei; Hiroshi Hozoji; Naoya Kanda

Archive | 2002

Method of fabricating a wafer level chip size package utilizing a maskless exposure

Yoshihide Yamaguchi; Hiroyuki Tenmei; Hiroshi Hozoji; Naoya Kanda

Archive | 1990

Method and apparatus for forming a multiple-element thin film based on ion beam sputtering

Naoya Kanda; Yasushi Ishikawa; Kunio Matsumoto; Hiroshi Asao

Archive | 2001

Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices

Yoshihide Yamaguchi; Takao Terabayashi; Hiroyuki Tenmei; Hiroshi Hozoji; Naoya Kanda

Archive | 2001

Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure

Yoshihide Yamaguchi; Hiroyuki Tenmei; Kosuke Inoue; Noriyuki Oroku; Hiroshi Hozoji; Shigeharu Tsunoda; Naoya Kanda; Madoka Minagawa; Ichiro Anjo; Asao Nishimura; Kenji Ujiie; Akira Yajima

Archive | 1988

Module and a substrate for the module

Kunio Matsumoto; Takanobu Noro; Naoya Kanda

Archive | 1988

Electronic device plated with gold by means of an electroless gold plating solution

Jiro Ushio; Osamu Miyazawa; Akira Tomizawa; Hitoshi Yokono; Naoya Kanda; Naoko Matsuura; Setsuo Ando; Hiroaki Okudaira

Archive | 2007

Paper tag identified by using radiofrequency and method of manufacturing the same

Kosuke Inoue; Naoya Kanda; Hiroshi Honma

Archive | 2002

Semiconductor device and structure for mounting the same

Yoshihide Yamaguchi; Shigeharu Tsunoda; Hiroyuki Tenmei; Hiroshi Hozoji; Naoya Kanda

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