Necmettin Maraşlı

Experimental determination of interfacial energies for solid Sn in equilibrium with Sn-Mg-Zn liquid

The equilibrated grain boundary groove shapes of solid Sn in equilibrium with Sn-Mg-Zn liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn were determined from the observed grain boundary groove shapes. The thermal conductivity of the eutectic solid phase for Sn-8.12 at% Mg-4.97 at% Zn alloy and the thermal conductivity ratio of the liquid phase to the solid phase for Sn-8.12 at% Mg-4.97 at% Zn alloy at eutectic temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn in equilibrium with Sn-Mg-Zn liquid were determined to be (8.3 ± 0.6)×10-8 Km, (118.5 ± 14.2)×10-3 Jm-2 and (225.1 ± 29.3)×10-3 J m-2 respectively from observed grain boundary groove shapes. A comparison of present results for solid Sn in the Sn-8.12 at% Mg-4.97 at% Zn alloy with the results obtained in previous works for similar solid Sn in equilibrium with different binary or ternary liquid was made.

Microstructural, mechanical, and electrical characterization of directionally solidified Al–Cu–Mg eutectic alloy

The composition of an Al–Cu–Mg ternary eutectic alloy was chosen to be Al–30 wt% Cu–6 wt % Mg to have the Al2Cu and Al2CuMg solid phases within an aluminum matrix (α-Al) after its solidification from the melt. The alloy Al–30 wt % Cu–6 wt % Mg was directionally solidified at a constant temperature gradient (G = 8.55 K/mm) with different growth rates V, from 9.43 to 173.3 μm/s, by using a Bridgman-type furnace. The lamellar eutectic spacings (λE) were measured from transverse sections of the samples. The functional dependencies of lamellar spacings λE (

Microstructural, mechanical and electrical characterization of directionally solidified Al–Si–Mg eutectic alloy

{\lambda _{A{l_2}CuMg}}

Solid–liquid interfacial energy of solid succinonitrile solution in equilibrium with succinonitrile–neopentylglycol eutectic liquid

λAl2CuMg and

The measurements of electrical and thermal conductivity variations with temperature and phonon component of the thermal conductivity in Sn–Cd–Sb, Sn–In–Cu, Sn–Ag–Bi and Sn–Bi–Zn alloys

{\lambda _{A{l_2}Cu}}

Experimental measurements of some thermophysical properties of solid CdSb intermetallic in the Sn–Cd–Sb ternary alloy

λAl2Cu in μm), microhardness HV (in kg/mm2), tensile strength σT (in MPa), and electrical resistivity ρ (in Ω m) on the growth rate V (in μm/s) were obtained as