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Dive into the research topics where Nicole D. Kerness is active.

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Featured researches published by Nicole D. Kerness.


international electron devices meeting | 2013

3D heterogeneous integration for analog

Arkadii V. Samoilov; Khanh Tran; Nicole D. Kerness; Joy T. Jones; Peter McNally; Stanley Barnett; Tyler Parent; Joseph P. Ellul; Anu Srivastava; Kiyoko Ikeuchi; Tie Wang; Tiao Zhou

We illustrate capabilities of 3D integration for analog applications through both wafer-level and packaging technologies. Examples of wafer-level 3D integration include integrated capacitors and optical sensors. Integrated Si capacitors demonstrate the highest reported capacitor density of C=1 μF/mm2 (=1,000 fF/μm2) and the figure of merit (FOM) C*Vbd=11 C/m2 (Vbd is the breakdown voltage). Through-Si vias can be used to combine passive and active die into a single stack. Addition of optical layers to the Bipolar CMOS DMOS (BCD) process allows light detection in the visible and infrared range. 3D package-level integration is illustrated by embedding of multiple active and passive components in one package.


Archive | 2012

Method for detecting gestures using a multi-segment photodiode and one or fewer illumination sources

David Skurnik; Nevzat Akin Kestelli; Ilya K. Veygman; Anand Chamakura; Christopher F. Edwards; Nicole D. Kerness; Pirooz Parvarandeh; Sunny Kweisun Hsu


Archive | 2011

Optical gesture sensor using a single illumination source

David Skurnik; Nevzat Akin Kestelli; Ilya K. Veygman; Anand Chamakura; Christopher F. Edwards; Nicole D. Kerness; Pirooz Parvarandeh; Sunny Kweisun Hsu


Archive | 2011

LIGHT SENSOR HAVING IR CUT AND COLOR PASS INTERFERENCE FILTER INTEGRATED ON-CHIP

Prashanth Holenarsipur; Zhihai Wang; Nicole D. Kerness


Archive | 2014

LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE WITH LENS FORMED THEREIN

Nicole D. Kerness; Arkadii V. Samoilov; Zhihai Wang; Joy T. Jones


Archive | 2013

MULTICHIP WAFER LEVEL PACKAGE (WLP) OPTICAL DEVICE

Nicole D. Kerness; Joy T. Jones; Christopher F. Edwards; Arkadii V. Samoilov; Phillip J. Benzel; Richard I. Olsen; Peter R. Harper


Archive | 2011

Light sensor having IR cut interference filter with color filter integrated on-chip

Zhihai Wang; Nicole D. Kerness; Stanley Barnett


Archive | 2012

LIGHT SENSOR HAVING IR SUPPRESSION FILTER AND TRANSPARENT SUBSTRATE

Nicole D. Kerness; Arkadii V. Samoilov; Zhihai Wang; Joy T. Jones


Archive | 2012

LIGHT SENSOR HAVING TRANSPARENT SUBSTRATE AND THROUGH-SUBSTRATE VIAS

Nicole D. Kerness; Arkadii V. Samoilov; Zhihai Wang; Joy T. Jones


Archive | 2014

Light sensor having transparent substrate and diffuser formed therein

Nicole D. Kerness; Arkadii V. Samoilov; Zhihai Wang; Joy T. Jones

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