Nicole Lindenmann

Surface plasmon polariton absorption modulator.

A new compact electrically controlled surface plasmon polariton (SPP) absorption modulator operating at communication wavelengths is introduced. The modulator is controlled by changing the free carrier density and thereby the propagation loss of the SPP.

Photonic wire bonding: a novel concept for chip-scale interconnects.

Photonic integration requires a versatile packaging technology that enables low-loss interconnects between photonic chips in three-dimensional configurations. In this paper we introduce the concept of photonic wire bonding, where polymer waveguides with three-dimensional freeform geometries are used to bridge the gap between nanophotonic circuits located on different chips. In a proof-of-principle experiment, we demonstrate the fabrication of single-mode photonic wire bonds (PWB) by direct-write two-photon lithography. First-generation prototypes allow for efficient broadband coupling with average insertion losses of only 1.6 dB in the C-band and can carry wavelength-division multiplexing signals with multi-Tbit/s data rates. Photonic wire bonding is well suited for automated mass production, and we expect the technology to enable optical multi-chip systems with enhanced performance and flexibility.Photonic integration has witnessed tremendous progress over the last years, and chip-scale transceiver systems with Terabit/s data rates have come into reach. However, as on-chip integration density increases, efficient off-chip interfaces are becoming more and more crucial. A technological breakthrough is considered indispensable to cope with the challenges arising from large-scale photonic integration, and this particularly applies to short-distance optical interconnects. In this letter we introduce the concept of photonic wire bonding, where transparent waveguide wire bonds are used to bridge the gap between nanophotonic circuits located on different chips. We demonstrate for the first time the fabrication of three-dimensional freeform photonic wire bonds (PWB), and we confirm their viability in a multi-Terabit/s data transmission experiment. First-generation prototypes allow for efficient broadband coupling with overall losses of only 1.6 dB. Photonic wire bonding will enable flexible optical multi-chip assemblies, thereby challenging the current paradigm of highly-complex monolithic integration.

Single-laser 32.5 Tbit/s Nyquist WDM transmission

Single-laser 32.5 Tbit/s 16QAM Nyquist-WDM transmission with 325 carriers over 227 km at a net spectral efficiency of 6.4 bit/s/Hz is reported.

Connecting Silicon Photonic Circuits to Multicore Fibers by Photonic Wire Bonding

Photonic wire bonding is demonstrated to enable highly efficient coupling between multicore fibers and planar silicon photonic circuits. The technique relies on in-situ fabrication of three-dimensional interconnect waveguides between the fiber facet and tapered silicon-on-insulator waveguides. Photonic wire bonding can easily compensate inaccuracies of core placement in the fiber cross-section, does not require active alignment, and is well suited for automated fabrication. We report on the design, on fabrication, and on characterization of photonic wire bonds. In a proof-of-principle experiment, a four-core fiber is coupled to a silicon photonic chip, leading to measured coupling losses as small as 1.7 dB.

Photonic waveguide bonds - A novel concept for chip-to-chip interconnects

Photonic waveguide bonds (PWB) enable three-dimensional chip-to-chip interconnects. We demonstrate for the first time a PWB link between integrated silicon-on-insulator waveguides. The viability of the concept is demonstrated by data transmission experiments.

Photonic wire bonding for single-mode chip-to-chip interconnects

Photonic wire bonds (PWB) enable single-mode chip-to-chip interconnects that are suitable for mass production. We demonstrate for the first time a single-mode PWB link between two different nanophotonic silicon-on-insulator chips.

Low-loss photonic wire bond interconnects enabling 5 Tbit/s data transmission

Photonic wire bonding enables flexible single-mode chip-to-chip interconnects with average losses of only 2.5 dB over a spectral range from 1270 nm to 1580 nm. Flawless transmission is demonstrated for a 5.25 Tbit/s data stream.

Connecting silicon photonic circuits to multi-core fibers by photonic wire bonding

A four-core fiber is coupled to a silicon photonic chip by photonic wire bonding. The technique does not require active alignment and is well suited for automated fabrication. Measured coupling losses amount to 1.7 dB.

Broadband low-loss interconnects enabled by photonic wire bonding

Low-loss photonic wire bonds (PWB) enable inter-chip connections with average losses of 1.6 dB in the whole C-band. The underlying technique allows for flexible automatic fabrication of single-mode chip-to-chip interconnects.

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Efficient coupling of III-V light sources to silicon photonic circuits is one of the key challenges of integrated optics. Important requirements are low coupling losses, as well as small footprint and high yield of the overall assembly, along with the ability to use automated processes for large-scale production. In this paper, we demonstrate that photonic wire bonding addresses these challenges by exploiting direct-write two-photon lithography for in-situ fabrication of three-dimensional freeform waveguides between optical chips. In a series proof-of-concept experiments, we connect InP-based horizontal-cavity surface emitting lasers (HCSEL) to passive silicon photonic circuits with insertion losses down to 0.4 dB. To the best of our knowledge, this is the most efficient interface between an InP light source and a silicon photonic chip that has so far been demonstrated. Our experiments represent a key step in advancing photonic wire bonding to a universal integration platform for hybrid photonic multi-chip assemblies that combine known-good dies of different materials to high-performance hybrid multi-chip modules.