Nilesh Tralshawala

Lateral heat flow method for thickness independent determination of thermal diffusivity

A pulsed transient thermography method is described where a high-intensity light pulse is used to heat a long, uniform stripe on the surface of a plate. A high spatial resolution, high frame rate focal plane array infrared camera is used to monitor surface temperature. We explain the theoretical model and data analysis framework used to experimentally determine all three thermal diffusivity components from the temperature measurements. The analysis does not require any fitting to the temperature profile and is based on the creation of thermal time-of-flight (tof) images from the temperature data and the relationship between tof and the distance from the stripe edge. The in-plane components of thermal diffusivity are obtained without the need for thickness information. Experimental validation of this procedure was carried out using anisotropic carbon fiber reinforced polymer composites.

LATERAL HEAT FLOW INFRARED THERMOGRAPHY FOR THICKNESS INDEPENDENT DETERMINATION OF THERMAL DIFFUSIVITY IN CFRP

In conventional infrared thermography, determination of thermal diffusivity requires thickness information. Recently GE has been experimenting with the use of lateral heat flow to determine thermal diffusivity without thickness information. This work builds on previous work at NASA Langley and Wayne State University but we incorporate thermal time of flight (tof) analysis rather than curve fitting to obtain quantitative information. We have developed appropriate theoretical models and a tof based data analysis framework to experimentally determine all components of thermal diffusivity from the time‐temperature measurements. Initial validation was carried out using finite difference simulations. Experimental validation was done using anisotropic carbon fiber reinforced polymer (CFRP) composites. We found that in the CFRP samples used, the in‐plane component of diffusivity is about eight times larger than the through‐thickness component.