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Dive into the research topics where Nisit Tantavichet is active.

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Featured researches published by Nisit Tantavichet.


Journal of The Electrochemical Society | 2002

Low and High Frequency Pulse Current Plating of Copper onto a Rotating Disk Electrode

Nisit Tantavichet; Mark Pritzker

A comprehensive mathematical model for galvanostatic pulse plating has been developed and compared with the experimentally obtained electrode response during the deposition of copper from a sulfuric acid solution onto a rotating disk electrode. The model incorporates diffusional, convective, and migrational transport, electrode kinetics, and homogeneous reaction and capacitance effects due to the electrical double layer (dl) and the adsorption of an intermediate. The effect of the electrical dl at both low and high frequency pulse plating has been investigated. The model has been fit to the electrode potentials monitored during electrodeposition via a digital oscilloscope and been found to agree very well quantitatively with the experimental data over the frequency range from 50 Hz to 50 kHz, although the agreement decreases somewhat at the highest frequency. Analysis of the model shows that the effect of the pseudocapacitance due to the adsorption of a Cu + intermediate plays a major role during pulse plating, while the effect of electrical dl capacitance is significant at low frequencies, but becomes very small at high frequencies.


Journal of The Electrochemical Society | 2003

Low- and High-Frequency Pulse Current and Pulse Reverse Plating of Copper

Nisit Tantavichet; Mark Pritzker

A model for galvanostatic pulse plating via pulse current (PC) and pulse reverse (PR) modes has been developed and compared with experimentally obtained electrode responses during copper deposition from a CuSO 4 -H 2 SO 4 solution onto a rotating disk electrode. In addition to all forms of mass transport, electrode kinetics, and homogeneous reactions, the model incorporates capacitance effects due to double-layer charging and adsorption of an intermediate. Two important modifications from our previous model have been made: fully transient rather than steady-state electrode kinetics and a series rather than parallel connection between the adsorption pseudocapacitance and faradaic reactions. The model provides excellent quantitative agreement with the experimental results for both PR and PC plating for the entire range of conditions studied and shows considerable improvement over the previous version, particularly for PR plating. Fitting the model to some of the experimental data reveals that the double-layer capacity varies inversely with the square root of frequency for pulses of 500 Hz or more. Electrode responses do not totally become dc-like at frequencies as high as 50 kHz. Furthermore, at high enough frequencies (≥5 kHz) during PR plating, the electrode potentials do not rise above the open-circuit potential during the reverse-time, indicating that copper dissolution does not occur and leading to a response similar to that observed during high-frequency PC plating.


Transactions of The Institute of Metal Finishing | 2006

Aspects of copper electrodeposition from acidic sulphate solutions in presence of thiourea

Nisit Tantavichet; Mark Pritzker

Abstract This study focuses on clarifying certain aspects of copper electrodeposition from acidic sulphate solutions containing thiourea (TU). Examination by X-ray photoelectron spectroscopy (XPS) confirms the presence of TU on the deposit and reveals that the additive is incorporated in the coating throughout the course of plating. Polarisation experiments conducted in 0·1M CuSO4− 1·0M H2SO4 solutions at numerous TU concentrations particularly below 20 μM show that the electrode response during copper deposition changes qualitatively as the additive level is increased above 6 μM. These electrode responses are discussed in light of the knowledge of this system and used to propose a mechanism that is more consistent with the observed behaviour than previous explanations. In the presence of 20 μM TU, the coating remains bright as it grows to at least 10 μm thick, but then roughens with further growth to 25 μm. This trend is linked to the early stage formation of needle like protrusions or nodules that receive higher current than surrounding areas and eventually coarsen. Estimates of the maximum amount of TU depleted from solution during plating indicate that this alone cannot explain the loss of its levelling capability in later stages.


Journal of Applied Electrochemistry | 2001

Electropolymerized poly(2-vinylpyridine) coatings as ion-exchange polymer modified electrodes

Nisit Tantavichet; Mark Pritzker; Charles M. Burns

The effects of pH and of the nature and concentration of the electrolyte on the electrochemical behaviour of the Fe(CN)3−/4−6 charge-transfer reaction at a poly(2-vinylpyridine)-coated electrode formed by electropolymerization have been studied. Cyclic voltammetry during the Fe(CN)3−6 incorporation process was combined with measurement of the saturated concentration of the Fe(CN)3−6 confined in the films to investigate the electrochemical behaviour and the fundamental nature of the ion-exchange polymers. The poly(2-vinylpyridine) films formed by electropolymerization were found to have better properties (i.e., larger amount of Fe(CN)3−6 can be incorporated at various pH values and films are more chemically stable under acidic conditions) as polymer-modified electrodes than those formed by solvent evaporation. Of the various anions studied, ClO−4 was found to be distinct from the others (Cl−, NO−3, Br− and SO2−4). On the one hand, the polymer films exposed to ClO−4 are more dense and rigid than those exposed to other anions and show relatively little electroactivity. On the other hand, when the films are exposed to increasing concentrations of Cl−, the films become more swollen, thereby reducing the resistance within the film and enhancing the rate of charge-transfer from the outer film surface to the electrode surface.


Electrochimica Acta | 2005

Effect of plating mode, thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions

Nisit Tantavichet; Mark Pritzker


International Journal of Hydrogen Energy | 2014

Electrodeposition of nickel–copper alloys to use as a cathode for hydrogen evolution in an alkaline media

Krit Ngamlerdpokin; Nisit Tantavichet


Journal of Applied Polymer Science | 2001

Proton uptake by poly(2-vinylpyridine) coatings

Nisit Tantavichet; Mark Pritzker; Charles M. Burns


Electrochimica Acta | 2009

Influence of the interaction between chloride and thiourea on copper electrodeposition

Nisit Tantavichet; Somsak Damronglerd; Orawan Chailapakul


Journal of Applied Electrochemistry | 2009

Preparation of Pt–Co alloy catalysts by electrodeposition for oxygen reduction in PEMFC

Yupa Saejeng; Nisit Tantavichet


Journal of Applied Electrochemistry | 2006

Copper electrodeposition in sulphate solutions in the presence of benzotriazole

Nisit Tantavichet; Mark Pritzker

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Mali Hunsom

Chulalongkorn University

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Yupa Saejeng

Chulalongkorn University

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