Nobuaki Miyamoto

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor

Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same

Method for fabricating double-sided wiring board

Substrate for electronic apparatus, manufacturing method thereof, electronic apparatus, and manufacturing method thereof

Influence of Electroless Gold Plating Thickness on Wire Bondability and Ball Solderability on Tape Substrate for BGA Packages

Substrate for electronic device and its manufacturing method, as well as electronic device and its manufacturing method

Gold Plating Thickness and Soldering Reliability of Solder Balls for Electroless Gold Plated TAB Tape Carrier

Surface-treated copper foil, carrier-provided copper foil, printed wiring board, print circuit board, copper clad laminate sheet and method of producing printed wiring board

表面処理銅箔、キャリア付銅箔、基材、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法