Nobukazu Kondo
Hitachi
Network
Latest external collaboration on country level. Dive into details by clicking on the dots.
Publication
Featured researches published by Nobukazu Kondo.
asian solid state circuits conference | 2008
Tadahiro Kuroda; Masayuki Mizuno; Ramchan Woo; Nobukazu Kondo; Yukihiro Urakawa; Masayuki Miyamoto; Koyu Asai; Shintaro Yamamichi; Jae Dong Kim
Up to now, SiP integration is widely used to increase chip integration density as well as flexibility of combination in heterogeneous devices. Emerging integration and stacking technologies such as 3D integration, TSV (Through Silicon Via), die-to-die proximity communications, EAD (Embedded Active Devices) are becoming greater attention. If we call the first generation SiP integration as “SiP1.0”, what is “SiP2.0” ? When and how is it practical? Each panelists will give their anticipation of future SiP, or “SiP2.0”. This panel talk is not an “A vs. B” type of debate, but more like an evening talk where each panelist presents their visions on the next generation SiP.
Archive | 2002
Nobukazu Kondo; Seiji Kaneko; Koichi Okazawa; Hideaki Gemma; Tetsuya Mochida; Takehisa Hayashi
Archive | 1991
Nobukazu Kondo; Takashi Maruyama; Keiichi Isamu; Hiroaki Aotsu
Archive | 2001
Masataka Okayama; Tomohisa Kohiyama; Nobukazu Kondo; Kazutoshi Katoh; Kazuaki Tanaka; Yoshihiro Harada
Archive | 1997
Itaru Nonomura; Takeo Tomokane; Nobukazu Kondo; Kazuaki Tanaka
Archive | 1995
Nobukazu Kondo; Seiji Kaneko; Hideaki Gemma; Tetsuhiko Okada; Kazuhiko Komori; Koichi Okazawa
Archive | 2003
Kazushige Hiroi; Nobukazu Kondo; Kazuchika Ogiwara; Tooru Yokozawa; Takeo Tomokane
Archive | 1997
Nobukazu Kondo; Seiji Kaneko; Koichi Okazawa; Hideaki Gemma; Tetsuya Mochida; Takehisa Hayashi
Archive | 2003
Hiroi Kazushige; Nobukazu Kondo; Tsutomu Hara; Tooru Yokozawa; Kazuchika Ogiwara; Masaya Umemura; Shinichiro Okamura
Archive | 1996
Masataka Okayama; Tomohisa Kohiyama; Nobukazu Kondo; Kazutoshi Katoh; Kazuaki Tanaka; Yoshihiro Harada
