Norbert Urbansky

Investigation of long throw PVD of titanium films from polycrystalline targets with texture

The influence of target properties on the deposition of titanium films by long throw sputtering has been studied using Monte Carlo simulation. The precise knowledge and consideration of existing textures is shown to be a necessary prerequisite for the correct prediction of deposition rates and the radial dependence of film thickness as well. The experimental investigation of target textures has been carried out both by electron backscatter diffraction and X-ray diffraction. The results are compared and discussed.

Advanced Hi-Fill® for interconnect liner applications

Ti/TiN liner and barrier deposition for low contact resistance tungsten plug interconnect metallisation schemes represent a major challenge for current and future aspect ratios of interconnect vias. For Ti, bottom coverage is important to minimise contact and via resistance and for TiN, good sidewall coverage is required to maintain the integrity of the W fill process. This paper describes the fundamental operation and characterisation of a novel ionised dual metal/metal nitride deposition chamber--Advanced Hi-Fill®. Discussed is the incorporation of Advanced Hi-Fill® technology into a BEOL production environment. Production data for via level interconnects manufactured in a 0.17-µm logic product as well as contact level for a 0.14-µm DRAM product is presented.

Extendibility of ultra throw Ti-barriers passivated in nitrogen

Abstract This study involves evaluation of a Ti liner deposited by long throw (i.e. Hi-fill ® and ULTRA) and comparison of different cooling regimes using Ar and N 2 as atmosphere in the case of ULTRA. The use of N 2 -based cooling led to a surface passivation against oxidation. Therefore the effective Ti-thickness could be reduced by a factor of 1.5. Surface analysis and electrical results are discussed within the paper.