Olivier Dalverny

Reliability of lead-free solder in power module with stochastic uncertainty

Abstract The weak point for Insulated-Gate Bipolar Transistor (IGBT) modules in terms of reliability is thermal fatigue in solder joints due to the thermal stress induced by constitutive materials with different coefficients of thermal expansion (CTE). Now, many researches aimed to define accurate finite element simulation with constitutive equations of material behavior and fatigue failure relation connecting the inelastic strain and the number of cycles before failure. Even when these relations are clearly identified, the validation of the finite element model is difficult due to the scatter of input data. In fact, fatigue life of solder joints strongly depends on geometric shape, solders behavior (due to the process) and applied load. The aim of this article is to estimate the probability of failure of power module with structural reliability methods by considering geometric, material and loading variables as random variables. Since in a non-linear context, the finite element calls are expensive in terms of computer run time, an FE strategy is proposed here to replace conventional 3D mesh of layer by 3D-shell. To reduce computation time, response surface method, which approximates the output strain with respect to input random variable (RV) with the design of experiment (DOE) procedure, is used to perform reliability analysis. This reponse surface allows at the end to perform Monte Carlo random simulation process for fitting Weibull and fatigue life distribution on the output inelastic strain.

Lifetime and Reliability Assessment of AlN Substrates Used in Harsh Aeronautic Environments Power Switch Modules

This paper presents a Finite Elements Modelling (FEM) based methodology dedicated to the evaluation of the lifetime and the reliability of assemblies involving brittle materials under cyclic loading. It focuses on the particular case of metal bonded Aluminium Nitride (AlN) substrates used in power electronic switch modules. The ceramic fracture criterion was formulated according to the weakest link concept, under Weibulls approach. The materials parameters were determined by running three points bending tests. In order to check the relevancy of the proposed methodology, a non linear thermomechanical Finite Elements Model allowed computing the number of thermal cycles before substrate brittle fracture within a test vehicle, which was then compared to experimental results. Once validated, the methodology was applied to two different configurations of a power switch module, designed for harsh environment aeronautic applications. The corresponding external loading profile was considered to compute and monitor the evolution of the maximal principal stresses within the ceramic substrates whole volumes. Their lifetimes and reliabilities was finally assessed and compared to the applications requirements.

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications

Abstract This work examines the thermal fatigue effects on different configurations of power modules used in harsh aeronautical environment. They are used in various applications where the temperature cycling due to the working environment is the most limiting fact. In this case, it is highlighted that the topology assembly choice is a critical point to reach the lifetime required for the final application. In addition, it is proposed to correlate the probabilistic finite elements calculus to the experimental accelerated ageing tests on test vehicle, in order to determine the best configuration of assembling stack consisting of baseplate/RoHS solder/metallized substrate.

Experimental characterization of the mechanical behavior of two solder alloys for high temperature power electronics applications

An experimental investigation of two potential candidate materials for the diamond die attachment is presented in this framework. These efforts are motivated by the need of developing a power electronic packaging for the diamond chip. The performance of the designed packaging relies particularly on the specific choice of the solder alloys for the die/substrate junction. To implement a high temperature junction, AuGe and AlSi eutectic alloys were chosen as die attachment and characterized experimentally. The choice of the AlSi alloy is motivated by its high melting temperature Tm (577°C), its practical elaboration process and the restrictions of hazardous substances (RoHS) inter alia. The AuGe eutectic solder alloy has a melting temperature (356°C) and it is investigated here for comparison purposes with AlSi. The paper presents experimental results such as SEM observations of failure facies which are obtained from mechanical shear as well as cyclic nano-indentation results for the mechanical hardening/softening evaluation under cyclic loading paths.

Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations

Vibration-induced solder joint fatigue is a main reliability concern for aerospace and military industries whose electronic equipment used in the field is required to remain functional under such loading. Due to the RoHS directive which eventually will prevent lead from being utilized in electronic systems, there is a need for a better understanding of lead-free mechanical behavior under vibration conditions. This study reports the durability of Sn3.0Ag0.5Cu (SAC305) solder joints subjected to harmonic solicitations at three specific temperatures (-55°C, 20°C and 105°C). A test assembly is designed and consists in a single daisy-chained 1152 I/O ball grid array (FBGA1152) package assembled on a flame retardant (FR-4) printed circuit board (PCB). The vibration levels are imposed by a controlled deflection at the center of the board at its natural frequency. The electric continuity is monitored to determine the number of cycles to failure of each sample. Mode shape measurements with a scanning vibrometer are also conducted and correlated with Finite Element Analysis (FEA) to ensure accurate calculation of stress within the critical solder balls at the corners of the component. The failed specimens are then cross-sectioned in order to determine failure modes. A comparison of SAC305 durability with SnPb36Ag2 solder is given, along with a set of lifetime measurements for two complementary assemblies: 68 I/O Leadless Chip Carrier (LCC68) and 324 I/O Plastic Ball Grid Array (PBGA324). It turns out that SAC305 outperforms SnPb36Ag2 and the effect of temperature on the mechanical durability of SAC305 appears to be minor. Failure analysis points out different failure modes such as ductile and brittle cracks at the interface between the solder bulk and the component, along with pad cratering-induced copper trace failures. FEA calculations provide data to estimate the high cycle fatigue (HCF) behavior of SAC305 solder under harmonic vibrations.

Effects of the Unified Viscoplastic Formulation and Temperature Terms on the Thermomechanical Behavior of Soldering Materials

Solder materials are critical packaging compounds and due to usually weakest melting temperature among packaging constitutive materials, thus, they are frequently subjected to a multitude of physical phenomena: creep, fatigue and combined hardening effects. The complexity and interaction of such factors must be considered in suitable way in the mechanical behavior modeling using the appropriate material behavior laws. The choice of the mechanical model depends on several factors such as the complexity of constitutive equations to be integrated, the availability and suitability of implementation in the FE codes, the number of parameters to be identified, the capability of the model to represent the most common physical features of the material… Following these observations and in order to deal with these critical remarks, comparisons between the most common unified viscoplastic models should be done in the local and finite element levels for the decision upon the most efficient model. That is the aim of this paper with application to a tin based solder token as the test material.

Identification of Materials Properties Using Displacement Field Measurement

The aim of this work is to identify parameters driving constitutive equations of materials with displacement field measurements carried out by image stereo-correlation during an unidirectional tensile test. We evaluate two identification techniques. The first one is the virtual fields method which consists in writing the principle of virtual work with particular virtual fields. It is generally used in the case of linear elasticity and it requires a perfect knowledge of the model in terms of boundary condition since the virtual fields used must be kinematically admissible. This method allows to determine parameters by a direct and fast calculation, without iterations. The second method is the finite element model updating method. It consists in finding constitutive parameters that achieve the best match between finite element analysis quantities and their experimental counterparts. This method is more adaptable than the virtual field method but it needs to spend more calculation time.

Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling

Temperature-induced solder joint fatigue is a main reliability concern for aerospace and military industries whose electronic equipment used in the field is required to remain functional under harsh loadings. Due to the RoHS directive which eventually will prevent lead from being utilized in electronic systems, there is a need for a better understanding of lead-free thermomechanical behavior when subjected to temperature variations. As solder joints mechanical properties are dependent of their microstructural characteristics, developing accurate solder joint fatigue models means to correctly capture the microstructural changes that undergo the solder alloy during thermal cycling. This study reports the Sn3.0Ag0.5Cu (SAC305) solder joints microstructural evolution during damaging temperature cycles. Electron BackScatter Diffraction (EBSD) analysis was conducted to assess the SAC305 microstructure corresponding to a specific damage level. Investigated microstructural features included the β-Sn grain size and crystallographic orientation, as well as the grain boundary misorientation and Ag3Sn intermetallic compound (IMC) size. As-reflowed and damaged components were also mechanically characterized using nanoindentation technique. The microstructural analysis of SAC305 solder joints prior to thermal cycling showed a highly textured microstructure characteristic of hexa-cyclic twinning with two β-Sn morphologies consisting of preferentially orientated macrograins known as Karas beach ball, along with smaller interlaced grains. The main observation is that recrystallization systematically occurred in SAC305 solder joints during thermal cycling, creating a high population of misoriented grain boundaries leading to intergranular crack initiation and propagation in the high strain regions. The recrystallization process is accompanied with a progressive loss of crystallographic texture and twinning structure. Ag3Sn IMCs coalescence is another strong indicator of SAC305 solder damage since the bigger and more spaced the IMCs are the less dislocation pinning can prevent recrystallization from occurring.

Non destructive investigation of defects in composite structures by full- field measurement methods

This paper presents different interests of non destructive full-field measurement. More precisely, it focuses on the characterization and the comparison of the X-ray tomography and two methods of infrared thermography in order to define the defect detection limits and to precise the specific application fields for each technique on multi-layered and sandwich composite structures. The obtained results are qualitatively and quantitatively analyzed.

Validation of Mechanical Damage Monitoring on Aluminium Freestanding Thin Films Using Electrical Measurements

This paper describes a new technique allowing the monitoring of damage in metallic freestanding thin films during micro-tensile test by using electrical characterization. After a presentation of the set-up, results obtained on Aluminium thin coatings by using two calculation methods for damage variable are presented and commented.