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Pape Heinz Dipl Phys

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Publication

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Archive | 1995

Heat sink with integrated fastening system

Pape Heinz Dipl Phys; Luckner Uwe Dipl Ing

Archive | 1992

Plastic housing containing encapsulated semiconductor chips - has chips protruding on all sides beyond metal islands below

Pape Heinz Dipl Phys

Archive | 1981

Optical pumping system for laser and maser matching spectrums - uses fluorescent elements fitted with metallic, dielectric or diffusive reflectors

Pape Heinz Dipl Phys

Archive | 1981

Optical line printer - has light transmitted through fluorescent optical fibres to modulators controlling transfer to photo conducting drum

Krueger Hans Dipl Phys; Pape Heinz Dipl Phys; Quella Ferdinand Dr

Archive | 1992

Plastic casing for semiconductor chip - fixed to lead frame by intermediate layer to reduce stresses

Pape Heinz Dipl Phys

Archive | 1980

VERFAHREN ZUR SAMMLUNG VON LICHT UND VORRICHTUNG ZUR DURCHFUEHRUNG EINES SOLCHEN VERFAHRENS

Quella Ferdinand Dr Ing; Pape Heinz Dipl Phys

Archive | 1998

Anschlußrahmen für ein mikroelektronisches Bauteil, Verfahren zu dessen Herstellung und den Anschlußrahmen umfassendes mikroelektronisches Bauteil

Pape Heinz Dipl Phys

Archive | 1992

Encapsulated integrated circuit chip mfr. - using centrifugal action on droplets of liq. polymer applied over top and shorter sides, to improve IC reliability

Pape Heinz Dipl Phys; Roemer Bernd Dipl Ing

Archive | 1982

Fluorescent activated segment display - has display plate of transparent carrier with suspended fluorescing particles

Krueger Hans Dipl Phys; Pape Heinz Dipl Phys; Quella Ferdinand Dr

Archive | 1981

VORRICHTUNG ZUR MEHRFARBIGEN OPTISCHEN DARSTELLUNG VON INFORMATIONEN

Pape Heinz Dipl Phys; Quella Ferdinand Dr Ing

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Krueger Hans Dipl Phys

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Quella Ferdinand Dr

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Quella Ferdinand Dr Ing

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Luckner Uwe Dipl Ing

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Petter Franz Dipl Ing

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Roemer Bernd Dipl Ing

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