Parisa Harati

Multi-100 GbE and 400 GbE Interfaces for Intra-Data Center Networks Based on Arrayed Transceivers With Serial 100 Gb/s Operation

We demonstrate a 2 × 100 Gb/s transmitter and a 4 × 100 Gb/s receiver as the key components for multi-100-GbE and 400-GbE optical interfaces in future intradata center networks. Compared to other approaches, the two devices can provide significant advantages in terms of number of components, simplicity, footprint, and cost, as they are capable of serial operation with nonreturn-to-zero on-off keying format directly at 100 Gb/s. The transmitter is based on the monolithic integration of a multimode interference coupler with two Mach-Zehnder modulators on an electro-optic polymer chip, and the hybrid integration of this chip with an InP laser diode and two multiplexing and driving circuits. The receiver on the other hand is based on the hybrid integration of a quad array of InP photodiodes with two demultiplexing circuits. Combining the two devices, we evaluate their transmission performance over standard single-mode fibers without dispersion compensation and achieve a BER of 10-10 after 1000 m and a BER below 10-8 after 1625 m at 2 × 80 Gb/s, as well as a BER below 10-7 after 1000 m at 2 × 100 Gb/s. Future plans including the development of tunable 100 GbE interfaces for optical circuit-switched domains inside data center networks are also discussed.

Tunable 100 Gbaud Transmitter Based on Hybrid Polymer-to-Polymer Integration for Flexible Optical Interconnects

We introduce a hybrid integration platform based on the combination of passive and electro-optic polymers. We analyze the optical and physical compatibility of these materials and describe the advantages that our hybrid platform is expected to have for the development of transmitters in terms of operation flexibility and speed. We combine our platform with InP electronics and develop a transmitter with 22-nm tunability in the C-band and potential for serial non-return-to-zero on-off-keying operation directly at 100 Gb/s. We investigate its transmission performance at 80 and 100 Gb/s using dispersion uncompensated standard single-mode fiber and demonstrate bit-error rate (BER) lower than 10-10 at 80 Gb/s after 1625 m, lower than 10-10 at 100 Gb/s after 500 m, lower than 10-9 at 100 Gb/s after 1000 m, and BER 10-7 at the same rate after 1625 m. We also employ the transmitter inside an experimental setup, which aims to emulate an optical circuit switched (OCS) domain of an intradata center network, and demonstrate at 100 Gb/s the way, in which its wavelength tunability can resolve contentions and improve the flexibility and the efficiency of the network. Finally, we outline our next plans, including the development of flexible and ultra-fast transmitters for coherent systems using the same polymer-to-polymer integration platform.

Impedance-engineered low power MZM / driver assembly for CFP4-size pluggable long haul and metro transceiver

A differential impedance-engineered 32 Gbit/s SiGe driver co-designed with an InP-based MZ-Modulator is demonstrated, showing record low 185 mW power consumption. The small footprint and low power is targeting towards CFP4-sized coherent transceivers. Results on IQ-Modulators will be presented.

Passive and electro-optic polymer photonics and InP electronics integration

Hybrid photonic integration allows individual components to be developed at their best-suited material platforms without sacrificing the overall performance. In the past few years a polymer-enabled hybrid integration platform has been established, comprising 1) EO polymers for constructing low-complexity and low-cost Mach-Zehnder modulators (MZMs) with extremely high modulation bandwidth; 2) InP components for light sources, detectors, and high-speed electronics including MUX drivers and DEMUX circuits; 3) Ceramic (AIN) RF board that links the electronic signals within the package. On this platform, advanced optoelectronic modules have been demonstrated, including serial 100 Gb/s [1] and 2x100 Gb/s [2] optical transmitters, but also 400 Gb/s optoelectronic interfaces for intra-data center networks [3]. To expand the device functionalities to an unprecedented level and at the same time improve the integration compatibility with diversified active / passive photonic components, we have added a passive polymer-based photonic board (polyboard) as the 4th material system. This passive polyboard allows for low-cost fabrication of single-mode waveguide networks, enables fast and convenient integration of various thin-film elements (TFEs) to control the light polarization, and provides efficient thermo-optic elements (TOEs) for wavelength tuning, light amplitude regulation and light-path switching.

MMIC chipset for 300 GHz indoor wireless communication

This contribution presents a full chip set dedicated to high data rate indoor wireless communication at a carrier frequency of 300 GHz. The analog frontend consists of a three-chip solution, namely a transmitter, receiver and local oscillator frequency multiplier. The active millimeter-wave monolithic integrated circuits are realized in a GaAs-based metamorphic high electron mobility transistor technology. The transmitter MMIC achieves a maximum output power of 3.6 dBm and an RF frequency range of 270 to 314 GHz. The receiver MMIC shows 11.4 dB conversion gain without IF amplification in an RF frequency range from 292 to 314 GHz.

E-band downlink wireless data transmission for future satellite communication

Wireless transmission of broadband complex modulated data up to a bit rate of 6Gbit/s in E-band downlink frequency over a record distance of 36.7km is presented. The received signal quality is monitored for the transmitter working in both linear and saturation region. The overall link performance is evaluated in terms of error vector magnitude (EVM) and signal to noise ratio (SNR). The 6Gbit/s QPSK signal was received with an EVM of –11.48dB corresponding to an SNR of 11.46dB and a theoretical BER value of 5 × 10–3, when the last stage power amplifier in the Tx chain was operating near saturation region. Further, the atmospheric losses are derived from the measurements and compared with the theoretical values calculated from the ITU models for the atmospheric losses due to the dry air and water vapor.

Is E-Band Satellite Communication Viable?: Advances in Modern Solid-State Technology Open Up the Next Frequency Band for SatCom

The Russians launched the first artificial Earth satellite, Sputnik 1, into an elliptical low-Earth orbit (LEO) in October 1957. Through its four external antennas, Sputnik 1 broadcast radio beacons at 20.005 and 40.01 MHz to study the density of the atmosphere and the radio-wave propagation through the ionosphere. This historic event represents the advent of the satellite age. Since then, satellites have become an integral part of global navigation, Earth observation, broadcasting, and communication systems. The latter complements conventional wired and wireless terrestrial communication and provides an effective platform to relay radio signals between two arbitrary points on or near the Earth. Satellite communication offers end users a high level of flexibility. Irrespective of the geological coordinate, the user can benefit from a broad spectrum for various applications, from two-way voice and data communication to video conferencing.

A wideband phase detector SiGe HBT MMIC for multi-gigabit synchronous receivers

This paper reports a phase detector MMIC operating in the frequency range of DC to 40 GHz, with an average power conversion gain of 11 dB with wideband input matching. The MMIC is realized in 0.25 μm SiGe HBT technology. The phase detector is dedicated to form a Costas loop for broadband binary phase shift keyed signals.