Paul R. Hoffman | Researchain

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electronic components and technology conference | 1995

Thermal and electrical characterization of the metal ball grid array (MBGA)

D. Solomon; Paul R. Hoffman; G. Brathwaite; P. Robinson; T. Madelung

The Ball Grid Array (BGA) package is becoming an attractive alternative to high lead count packaging technology due to its improved I/O density and better thermal and electrical performance. In this paper, thermal and electrical performance analysis of the Metal Ball Grid Array (MBGA/sup TM/* package) is presented. Results of measurements, two and three dimensional field solutions and finite element calculations are shown.

electronic components and technology conference | 1994

Development of a high performance TQFP package

Paul R. Hoffman; Dexin Liang; D. Mahulikar; A. Parthasarathi

A TQFP (Thin Quad Flat Pack) package has been developed that has very superior electrical and thermal performance when compared to a plastic molded TQFP package. The high performance TQFP is based on Olins MQUAD technology; a packaging scheme where the plastic mold compound is replaced by an anodized aluminum base and lid adhesively sealed to the leadframe. The package uses the same IR or VPR board mounting profile as a plastic package, weighs the same as a plastic package, and is dimensionally equivalent to a plastic package.<<ETX>>

Archive | 1994