Peide Han
Taiyuan University of Technology
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Publication
Featured researches published by Peide Han.
Transactions of Nonferrous Metals Society of China | 2014
Zhiqin Wen; Yuhong Zhao; Hua Hou; Nan Wang; Li Fu; Peide Han
Abstract The Ni (001) surface, Ni 3 Nb (001) surface and Ni (001)/Ni 3 Nb (001) interfaces were studied using the first-principles pseudopotential plane-wave method. The adhesion work, thermal stability and electronic structure of Ni/Ni 3 Nb (001) interfaces were calculated to expound the influence of atom termination and stacking sequence on the interface strength and stability. Simulated results indicate that Ni and Ni 3 Nb (001) surface models with more than eight atomic layers exhibit bulk-like interior. The (Ni+Nb)-terminated interface with hollow site stacking has the largest cohesive strength and critical stress for crack propagation and the best thermal stability among the four models. This interfacial Ni and the first nearest neighbor Nb atoms form covalent bonds across the interface region, which are mainly contributed by Nb 4d and Ni 3d valence electrons. By comparison, the thermal stability of Ni/Ni 3 Nb (001) interfaces is worse than Ni/Ni 3 Al (001) interface, implying that the former is harder to form. But the Ni/Ni 3 Nb interface can improve the mechanical properties of Ni-based superalloys.
Computational Materials Science | 2012
Xiaochao Zhang; Lijun Zhao; Caimei Fan; Zhenhai Liang; Peide Han
Physica B-condensed Matter | 2012
Zhi-wei Huang; Yuhong Zhao; Hua Hou; Peide Han
Intermetallics | 2014
Hua Hou; Zhiqin Wen; Yuhong Zhao; Li Fu; Nan Wang; Peide Han
Physica B-condensed Matter | 2012
Xiaochao Zhang; Lijun Zhao; Caimei Fan; Zhenhai Liang; Peide Han
Intermetallics | 2014
Haicheng Xuan; Fenghua Chen; Peide Han; D. H. Wang; Y. W. Du
Intermetallics | 2014
Haicheng Xuan; Peide Han; D. H. Wang; Y. W. Du
Journal of Alloys and Compounds | 2014
Haicheng Xuan; Peide Han; D. H. Wang; Y. W. Du
Applied Physics A | 2015
Haicheng Xuan; Yongjia Zhang; H. Li; Peide Han; D. H. Wang; Y. W. Du
Computational Materials Science | 2013
Zhiqin Wen; Hua Hou; Yuhong Zhao; Xiaomin Yang; Li Fu; Nan Wang; Peide Han