Peter A. Engel

Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1

This volume opens with a sweeping overview of the physical design of electronic systems-methodology, technology, and future challenges-thermally induced failures in electronic systems. Subsequent chapters examine the causes for thermally induced failures of electronic components and the techniques used to analyze and prevent such failures. It gives a comprehensive bibliograhy of project managers and lead engineers, packaging engineers and mechanical analysts, consultants, and academic, industrial, and government laboratory researchers.

Structural Analysis of Printed Circuit Board Systems

This is a discussion of the building blocks of electronic circuits - the microchips, transistors, resistors, condensers and the boards that support them - from the point of view of mechanics. After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

Finding the Constitutive Relation for a Specific Elastomer

The main purpose of this study was to determine a suitable strain energy function for a specific elastomer. A survey of various strain energy functions proposed in the past was made. For natural rubber, there were some specific strain energy functions which could accurately fit the experimental data for various types of deformations. The process of determining a strain energy function for the specific elastomer was then described. The second-order invariant polynomial strain energy function (James et al., 1975) was found to give a good fit to the experimental data of uniaxial tension, uniaxial compression, equi-biaxial extension, and pure shear. A new form of strain energy function was proposed; it yielded improved results. The equi-biaxial extension experiment was done in a novel way in which the moire techniques (Pendleton, 1989) were used. The obtained strain energy functions were then utilized in a finite element program to calculate the load-deflection relation of an electrometric spring used in an electrical connector.

Tribology and Mechanics of Magnetic Storage Devices

The increasing demand for high-density highly reliable magnetic recording requires a fundamental understanding of the tribology and mechanics of the interface between the magnetic head and the recording medium. This work offers a systematic compilation of current knowledge of tribology and mechanics as applied to magnetic storage devices. It treats all practical aspects, including surface roughness, friction, interface temperatures, wear, lubrication, lubricants and surface finishing. It incorporates ample experimental data and relevant properties of materials and surfaces, making the book useful for engineers and scientists working in the field. Intended for practicing engineers who need to solve reliability or tribology problems quickly, the volume should also be useful for research workers, academic engineers and graduate students in tribology and mechanics. Most of the theoretical results presented are broadly applicable in many areas of mechanical engineering.