Philip D. Schumaker

Ian M. Mcmackin; Jin Choi; Philip D. Schumaker; Van Nguyen; Frank Y. Xu; Ecron Thompson; Daniel A. Babbs; S. V. Sreenivasan; Michael P. C. Watts; Norman E. Schumaker

Step and FlashTM Imprint Lithography (S-FILTM) process is a step and repeat nano-replication technique based on UV curable low viscosity liquids. Molecular Imprints, Inc. (MII) develops commercial tools that practice the S-FIL process. The current status of the S-FIL tool and process technology is presented in this paper. The specific topics that are covered include: • Residual layer control • Etch process development • Patterning of lines, contacts and posts • CD control • Defect and process life • Alignment and magnification control

Anshuman Cherala; Philip D. Schumaker; Babak Mokaberi; Kosta Selinidis; Byung Jin Choi; Mario J. Meissl; Niyaz Khusnatdinov; Dwayne L. LaBrake; S. V. Sreenivasan

Jet and flash imprint lithography steppers have demonstrated unprecedented capability for patterning of sub-25-nm features for semiconductor manufacturing. A critical requirement for such patterning is the ability to overlay one layer of a device to a previously printed layer. In this paper, the design and development of a nanoprecision mask magnification/shape control system (MSCS) for the unique requirements of imprint-based overlay is presented. Imprint specific topics such as in-liquid overlay and distortions, and on-tool overlay metrology are discussed. The MSCS presented here has demonstrated 10-nm mix and match overlay (mean + 3 sigma) capability that approaches performance of state-of-the-art photolithography tools.

Jung Han Choi; Ian M. Mcmackin; Philip D. Schumaker; Van Nguyen; Frank Y. Xu; Daniel A. Babbs; S.V. Sreenivasan; Michael P. C. Watts; Norman E. Schumaker

The Step and Flash/sup TM/ Imprint Lithography (S-FIL/sup TM/) process is a step and repeat nanoreplication technique based on UV curable low viscosity liquids. This article discusses various process capability of S-FIL including imprint resolution and line edge roughness; field-to-field CD control; imprinted film thickness uniformity; process life and defect data; and overlay alignment accuracy.

Pankaj B. Lad; Ian M. Mcmackin; Van N. Truskett; Norman E. Schumaker; Sidlgata V. Sreenivasan; Duane Voth; Philip D. Schumaker; Edward B. Fletcher

Pawan Kumar Nimmakayala; Tom H. Rafferty; Alireza Aghili; Byung-Jin Choi; Philip D. Schumaker; Daniel A. Babbs; Van N. Truskett

Christopher Ellis Jones; Niyaz Khusnatdinov; Stephen C. Johnson; Philip D. Schumaker; Pankaj B. Lad

Sidlgata V. Sreenivasan; Philip D. Schumaker; Ian M. Mcmackin

Sidlgata V. Sreenivasan; Philip D. Schumaker

Pawan Kumar Nimmakayala; Byung-Jin Choi; Tom H. Rafferty; Philip D. Schumaker

Byung-Jin Choi; Pawan Kumar Nimmakayala; Philip D. Schumaker