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Dive into the research topics where Phillip Celaya is active.

Publication


Featured researches published by Phillip Celaya.


Archive | 1997

Electronic component assembly having an encapsulation material and method of forming the same

Phillip Celaya; John R. Kerr


Archive | 1997

Microelectronic package including a polymer encapsulated die, and method for forming same

Francis J. Carney; George Amos Carson; Phillip Celaya; Harry Fuerhaupter; Frank Tim Jones; Donald H. Klosterman; Cynthia M. Melton; James H. Knapp; Keith E. Nelson


Archive | 1999

Microelectronic package including a polymer encapsulated die

Francis J. Carney; George Amos Carson; Phillip Celaya; Harry Fuerhaupter; Frank Tim Jones; Donald H. Klosterman; Cynthia M. Melton; James H. Knapp; Keith E. Nelson


Archive | 2009

Method for manufacturing a semiconductor component and structure therefor

Phillip Celaya; James P. Letterman; Robert L. Marquis


Archive | 2006

Semiconductor package structure having multiple heat dissipation paths and method of manufacture

Stephen St. Germain; Phillip Celaya; Roger M. Arbuthnot; Francis J. Carney


Archive | 2004

Multi-chip semiconductor connector assemblies

Francis J. Carney; Phillip Celaya; Joseph K. Fauty; James P. Letterman; Stephen St. Germain; Jay A. Yoder


Archive | 2007

Multi-chip semiconductor connector and method

Francis J. Carney; Phillip Celaya; Joseph K. Fauty; James P. Letterman; Stephen St. Germain; Jay A. Yoder


Archive | 2004

Multi-chip semiconductor connector assembly method

Francis J. Carney; Phillip Celaya; Joseph K. Fauty; James P. Letterman; Stephen St. Germain; Jay A. Yoder


Archive | 2013

DUAL-FLAG STACKED DIE PACKAGE

Frank Tim Jones; Phillip Celaya


Archive | 2014

METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT AND STRUCTURE

James P. Letterman; Phillip Celaya; Robert L. Marquis

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