Piyanuch Sommani

Surface Processing and Modification of Polymers by Water Cluster Ion Beam

A water cluster ion beam was irradiated on a poly(methyl methacrylate) (PMMA) surface to examine the possibility of applying the water cluster ion beam technique to the surface processing and modification of polymers. The sputtering yields of PMMA substrates irradiated with water cluster ion beams increased with acceleration voltage and dose of the water cluster ion beam. The threshold acceleration voltage of sputtering was approximately 3 kV. The X‐ray photoelectron spectroscopy (XPS) analysis of the PMMA surface irradiated with the water cluster ion beam suggested the degradation of the PMMA side chains. The XPS spectrum of the surface of the sputtered particle catcher at 45° backward direction showed approximately the same shape as the XPS spectrum of the PMMA surface irradiated with the water cluster ion beam.

Surface Modification of Silicone Rubber for Adhesion Patterning of Mesenchymal Stem Cells by Water Cluster Ion Beam

Biocompatibility of silicone rubber sheet (SR) was improved by the water cluster ion irradiation for adhesion patterning of mesenchymal stem cells (MSCs). The water cluster ions were irradiated at acceleration voltage of 6 kV and doses of 1014–1016 ions/cm2. The effect of ion dose on changes in wettability and surface atomic bonding state was observed. Compared to the unirradiated SR, about four‐time smoother surface on the irradiated one was observed. Water contact angle decreased with an increase in the ion dose up to 1×1015 ions/cm2. With an increase in ion dose, XPS showed decrease of atomic carbon due to lateral sputtering effect and increase of atomic oxygen due to surface oxidation. After 7 days in vitro culture, the complete adhesion pattern of the rat MSCs was obtained on the irradiated SR at dose of 1×1015 ions/cm2, corresponding to the low contact angle of 87°. At low dose, the partial pattern on the irradiated region was observed instead.