Is this you? Create Your Porfile
Avatar

Ploesl Andreas

Osram Opto Semiconductors GmbH

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Ploesl Andreas is active.

Explore More

Publication

Featured researches published by Ploesl Andreas.

Archive | 2004

Reflektierendes Schichtsystem mit einer Mehrzahl von Schichten zur Aufbringung auf ein III/V-Verbindungshalbleitermaterial

Kraeuter Gertrud; Wirth Ralph; Ploesl Andreas; Zull Heribert

Archive | 2006

Halbleiterchip mit einer Lötschichtenfolge und Verfahren zum Löten eines Halbleiterchips

Grolier Vincent; Illek Stefan; Ploesl Andreas

Archive | 2006

Verfahren zur Herstellung eines Dünnfilmhalbleiterchips

Ploesl Andreas; Stein Wilhelm

Archive | 2004

Verfahren zur Herstellung einer temperbarer Mehrschichtkontaktbeschichtung, insbesondere einer temperbaren Mehrschichtkontaktmetallisierung

Stein Wilhelm; Janes Stefan; Heindl Alexander; Ploesl Andreas; Wegleiter Walter

Archive | 2007

EPITAXIAL SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND LED THIN-FILM CHIP AND MANUFACTURING METHOD THEREOF

Ploesl Andreas; Kraeuter Gertrud; Butendeich Rainer

Archive | 2004

Trägerschicht für eine Halbleiterschichtenfolge und Verfahren zur Herstellung von Halbleiterchips

Hahn Berthold; Illek Stefan; Groetsch Stefan; Ploesl Andreas

Archive | 2002

Optoelectronic semiconductor chip has recesses formed in active layer such that cross-sectional area of the recesses decreases with increasing depth into active layer from bonding side

Ploesl Andreas; Streubel Klaus; Wegleiter Walter; Wirth Ralph; Illek Stefan

Archive | 2009

Method for manufacturing of LED utilized as projection light source in e.g. automotive area, involves joining metallic layers so that extensive covalent or metallic bond is formed between layers, and removing developing substrate

Ploesl Andreas

Archive | 2004

Production of an optoelectronic semiconductor chip has a layer based on gallium nitride applied on the upper side of the semiconductor body or semiconductor arrangement

Ploesl Andreas; Eisert Dominik; Voelkl Johannes

Archive | 2002

Fabrication of semiconductor layers for thin-film semiconductor components, by applying useful layer with semiconductor layers to carrier, applying auxiliary carrier remote from carrier by connecting layer, and stripping away the carrier

Ploesl Andreas; Hahn Berthold; Eisert Dominik; Kaiser Stephan

Explore More

Collaboration

Dive into the Ploesl Andreas's collaboration.

Top Co-Authors
Avatar

Illek Stefan

Osram Opto Semiconductors GmbH

View shared research outputs
Top Co-Authors
Avatar

Kraeuter Gertrud

Osram Opto Semiconductors GmbH

View shared research outputs
Top Co-Authors
Avatar

Eisert Dominik

Osram Opto Semiconductors GmbH

View shared research outputs
Top Co-Authors
Avatar

Hahn Berthold

Osram Opto Semiconductors GmbH

View shared research outputs
Top Co-Authors
Avatar

Stein Wilhelm

Osram Opto Semiconductors GmbH

View shared research outputs
Top Co-Authors
Avatar

Wegleiter Walter

Osram Opto Semiconductors GmbH

View shared research outputs
Top Co-Authors
Avatar

Wirth Ralph

Osram Opto Semiconductors GmbH

View shared research outputs
Top Co-Authors
Avatar

Groetsch Stefan

Osram Opto Semiconductors GmbH

View shared research outputs
Top Co-Authors
Avatar

Grolier Vincent

Osram Opto Semiconductors GmbH

View shared research outputs
Top Co-Authors
Avatar

Janes Stefan

Osram Opto Semiconductors GmbH

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge