Pradip Bose

An Analysis of Efficient Multi-Core Global Power Management Policies: Maximizing Performance for a Given Power Budget

Chip-level power and thermal implications will continue to rule as one of the primary design constraints and performance limiters. The gap between average and peak power actually widens with increased levels of core integration. As such, if per-core control of power levels (modes) is possible, a global power manager should be able to dynamically set the modes suitably. This would be done in tune with the workload characteristics, in order to always maintain a chip-level power that is below the specified budget. Furthermore, this should be possible without significant degradation of chip-level throughput performance. We analyze and validate this concept in detail in this paper. We assume a per-core DVFS (dynamic voltage and frequency scaling) knob to be available to such a conceptual global power manager. We evaluate several different policies for global multi-core power management. In this analysis, we consider various different objectives such as prioritization and optimized throughput. Overall, our results show that in the context of a workload comprised of SPEC benchmark threads, our best architected policies can come within 1% of the performance of an ideal oracle, while meeting a given chip-level power budget. Furthermore, we show that these global dynamic management policies perform significantly better than static management, even if static scheduling is given oracular knowledge

The impact of technology scaling on lifetime reliability

The relentless scaling of CMOS technology has provided a steady increase in processor performance for the past three decades. However, increased power densities (hence temperatures) and other scaling effects have an adverse impact on long-term processor lifetime reliability. This paper represents a first attempt at quantifying the impact of scaling on lifetime reliability due to intrinsic hard errors, taking workload characteristics into consideration. For our quantitative evaluation, we use RAMP (Srinivasan et al., 2004), a previously proposed industrial-strength model that provides reliability estimates for a workload, but for a given technology. We extend RAMP by adding scaling specific parameters to enable workload-dependent lifetime reliability evaluation at different technologies. We show that (1) scaling has a significant impact on processor hard failure rates - on average, with SPEC benchmarks, we find the failure rate of a scaled 65nm processor to be 316% higher than a similarly pipelined 180nm processor; (2) time-dependent dielectric breakdown and electromigration have the largest increases; and (3) with scaling, the difference in reliability from running at worst-case vs. typical workload operating conditions increases significantly, as does the difference from running different workloads. Our results imply that leveraging a single microarchitecture design for multiple remaps across a few technology generations will become increasingly difficult, and motivate a need for workload specific, microarchitectural lifetime reliability awareness at an early design stage.

Power-aware microarchitecture: design and modeling challenges for next-generation microprocessors

The ability to estimate power consumption during early-stage definition and trade-off studies is a key new methodology enhancement. Opportunities for saving power can be exposed via microarchitecture-level modeling, particularly through clock-gating and dynamic adaptation. In this paper we describe the approach of using energy-enabled performance simulators in early design. We examine some of the emerging paradigms in processor design and comment on their inherent power-performance characteristics.

The Case for Lifetime Reliability-Aware Microprocessors

Ensuring long processor lifetimes by limiting failures due to wear-out related hard errors is a critical requirement for all microprocessor manufacturers. We observe that continuous device scaling and increasing temperatures are making lifetime reliability targets even harder to meet. However, current methodologies for qualifying lifetime reliability are overly conservative since they assume worst-case operating conditions. This paper makes the case that the continued use of such methodologies will significantly and unnecessarily constrain performance. Instead, lifetime reliability awareness at the microarchitectural design stage can mitigate this problem, by designing processors that dynamically adapt in response to the observed usage to meet a reliability target. We make two specific contributions. First, we describe an architecture-level model and its implementation, called RAMP, that can dynamically track lifetime reliability, responding to changes in application behavior. RAMP is based on state-of-the-art device models for different wear-out mechanisms. Second, we propose dynamic reliability management (DRM) - a technique where the processor can respond to changing application behavior to maintain its lifetime reliability target. In contrast to current worst-case behavior based reliability qualification methodologies, DRM allows processors to be qualified for reliability at lower (but more likely) operating points than the worst case. Using RAMP, we show that this can save cost and/or improve performance, that dynamic voltage scaling is an effective response technique for DRM, and that dynamic thermal management neither subsumes nor is subsumed by DRM.

Exploiting Structural Duplication for Lifetime Reliability Enhancement

Increased power densities (and resultant temperatures) and other effects of device scaling are predicted to cause significant lifetime reliability problems in the near future. In this paper, we study two techniques that leverage microarchitectural structural redundancy for lifetime reliability enhancement. First, in structural duplication (SD), redundant microarchitectural structures are added to the processor and designated as spares. Spare structures can be turned on when the original structure fails, increasing the processors lifetime. Second, graceful performance degradation (GPD) is a technique which exploits existing microarchitectural redundancy for reliability. Redundant structures that fail are shut down while still maintaining functionality, thereby increasing the processors lifetime, but at a lower performance. Our analysis shows that exploiting structural redundancy can provide significant reliability benefits, and we present guidelines for efficient usage of these techniques by identifying situations where each is more beneficial. We show that GPD is the superior technique when only limited performance or cost resources can be sacrificed for reliability. Specifically, on average for our systems and applications, GPD increased processor reliability to 1.42 times the base value for less than a 5% loss in performance. On the other hand, for systems where reliability is more important than performance or cost, SD is more beneficial. SD increases reliability to 3.17 times the base value for 2.25 times the base cost, for our applications. Finally, a combination of the two techniques (SD+GPD) provides the highest reliability benefit.

Lifetime reliability: toward an architectural solution

Developing and maintaining industrywide standards for lifetime reliability is a critical task for all microprocessor manufacturers. Although technology scaling continues to provide significant performance benefits, increasingly smaller feature sizes and increasing power densities are accelerating the onset of wearout-based failures, thus shortening processor life. Microarchitects have traditionally treated processor lifetime reliability as a manufacturing problem, best left to device and process engineers. In current processors, manufacturers enforce lifetime reliability, or qualify it, during device design, circuit layout, manufacture, and chip test. This reliability qualification, which is application-oblivious, is based on estimates of worst case temperature and processor utilization. However, most applications will run at lower temperature and utilization, resulting in higher reliability and longer processor lifetimes than required. As a result, current reliability qualification methodologies are overly conservative, unnecessarily increasing cost or decreasing performance. Sustaining this approach will likely be infeasible in future scaled systems.

Thermal-aware task scheduling at the system software level

Power-related issues have become important considerations in current generation microprocessor design. One of these issues is that of elevated on-chip temperatures. This has an adverse effect on cooling cost and, if not addressed suitably, on chip reliability. In this paper we investigate the general trade-offs between temporal and spatial hot spot mitigation schemes and thermal time constants, workload variations and microprocessor power distributions. By leveraging spatial and temporal heat slacks, our schemes enable lowering of on-chip unit temperatures by changing the workload in a timely manner with Operating System(OS) and existing hardware support.

Addressing failures in exascale computing

We present here a report produced by a workshop on ‘Addressing failures in exascale computing’ held in Park City, Utah, 4–11 August 2012. The charter of this workshop was to establish a common taxonomy about resilience across all the levels in a computing system, discuss existing knowledge on resilience across the various hardware and software layers of an exascale system, and build on those results, examining potential solutions from both a hardware and software perspective and focusing on a combined approach. The workshop brought together participants with expertise in applications, system software, and hardware; they came from industry, government, and academia, and their interests ranged from theory to implementation. The combination allowed broad and comprehensive discussions and led to this document, which summarizes and builds on those discussions.

Dynamically tuning processor resources with adaptive processing

By using adaptive processing to dynamically tune major microprocessor resources, developers can achieve greater energy efficiency with reasonable hardware and software overhead while avoiding undue performance loss. Adaptive processors require few additional transistors. Further, because adaptation occurs only in response to infrequent trigger events, the decision logic can be placed into a low-leakage state until such events occur.

An Adaptive Issue Queue for Reduced Power at High Performance

Increasing power dissipation has become a major constraint for future performance gains in the design of microprocessors. In this paper, we present the circuit design of an issue queue for a superscalar processor that leverages transmission gate insertion to provide dynamic low-cost configurability of size and speed. A novel circuit structure dynamically gathers statistics of issue queue activity over intervals of instruction execution. These statistics are then used to change the size of an issue queue organization on-the-fly to improve issue queue energy and performance. When applied to a fixed, full-size issue queue structure, the result is up to a 70% reduction in energy dissipation. The complexity of the additional circuitry to achieve this result is almost negligible. Furthermore, self-timed techniques embedded in the adaptive scheme can provide a 56% decrease in cycle time of the CAM array read of the issue queue when we change the adaptive issue queue size from 32 entries (largest possible) to 8 entries (smallest possible in our design).