Prakash Basnyat

Understanding light-induced degradation of c-Si solar cells

We discuss results of our investigations toward understanding bulk and surface components of light-induced degradation (LID) in low-Fe c-Si solar cells. The bulk effects, arising from boron-oxygen defects, are determined by comparing degradation of cell parameters and their thermal recovery, with that of the minority-carrier lifetime (τ) in sister wafers. We found that the recovery of t in wafers takes a much longer annealing time compared to that of the cell. We also show that cells having SiN:H coating experience a surface degradation (ascribed to surface recombination). The surface LID is seen as an increase in the q/2kT component of the dark saturation current (J02). The surface LID does not recover fully upon annealing and is attributed to degradation of the SiN:H-Si interface. This behavior is also exhibited by mc-Si cells that have very low oxygen content and do not show any bulk degradation.

Characterizing damage on Si wafer surfaces cut by slurry and diamond wire sawing

We have measured and compared surface roughness and the degree of damage for wafers cut by three different sawing techniques - slurry, Ni-based diamond wire, and resin-based diamond wire sawing. The local damage was determined by angle polishing followed by defect etching, TEM, SEM/EBSD imaging and Raman imaging. It showed that each of the cutting processes produces a thin layer of amorphous Si at the surface and dislocation loops that can go about 1 μm deep below the surface. A new approach was used to quantify the average damage over a large area. We determined the effective surface recombination (SRV) as a function of depth. Because the effective SRV is a function of the carrier loss close to the surface, it is well-suited to define damage distribution at and below the surface. Wafers with surface damage were step etched in (HF:HNO3:CH3COOH::1:1:5), and the effective lifetime was measured with a Sinton system after each etching step, with iodine-ethanol passivation. The SRV plots as a function of depth, representing depth distribution of the damage, were compared for large groups of wafers cut by each technique. Our results show that for optimized cutting, all three cutting methods produce damage depth of about 5μm (each surface). However, the degree of damage is higher for slurry cut wafers.

Some challenges in making accurate and reproducible measurements of minority carrier lifetime in high-quality Si wafers

Measurement of the minority carrier lifetime (τ) of high-quality wafers (having bulk minority carrier lifetime, τb > few milliseconds) requires surface passivation with very low surface recombination velocity, typically <; 1cm/s. Furthermore, for mapping large (e.g., 156 x156 mm) wafers, the passivation must also be stable and uniform over the entire wafer surfaces. These are very demanding requirements and it is a common experience that they are very difficult to achieve. Yet, they are necessary for performing defect analyses of the current N-type wafers. To understand the problems associated with these measurements, we have studied effect of wafer preparation (cleaning procedures, handling) and the passivation characteristics (stability, sensitivity to light, thickness of the passivation medium required for stable passivation) for many commonly used passivation media-iodine-ethanol (IE), quinhydrone-methanol (QHM), aluminum oxide (Al2O3), amorphous-silicon (a-Si), and silicon dioxide (SiO2). Here, we will discuss main factors that influence the accuracy and repeatability of lifetime measurements.

Dissolution of Oxygen Precipitate Nuclei in n-Type CZ-Si Wafers to Improve Their Material Quality: Experimental Results

We present experimental results which show that oxygen-related precipitate nuclei (OPN) present in p-doped, n-type, Czochralski wafers can be dissolved using a flash-annealing process, yielding very high quality wafers for high-efficiency solar cells. Flash annealing consists of heating a wafer in an optical furnace to temperature between 1150 and 1250 °C for a short time. This process produces a large increase in the minority carrier lifetime (MCLT) and homogenizes each wafer. We have tested wafers from different axial locations of two ingots. All wafers reach nearly the same high value of MCLT. The OPN dissolution is confirmed by oxygen analysis using Fourier transform infrared spectra and injection-level dependence of MCLT.

Analyses of diamond wire sawn wafers: Effect of various cutting parameters

We have evaluated surface characteristics of diamond wire cut (DWC) wafers sawn under a variety of cutting parameters. These characteristics include surface roughness, spatial frequencies of surface profiles, phase changes, damage depth, and lateral non-uniformities in the surface damage. Various cutting parameters investigated are: wire size, diamond grit size, reciprocating frequency, feed rate, and wire usage. Spatial frequency components of surface topography/roughness are influenced by individual cutting parameters as manifested by distinct peaks in the Fourier transforms of the Dektak profiles. The depth of damage is strongly controlled by diamond grit size and wire usage and to a smaller degree by the wire size.

Bulk defect generation during B-diffusion and oxidation of CZ wafers: Mechanism for degrading solar cell performance

We describe results of our experimental study to investigate the effect of B diffusion and drive-in/oxidation on minority carrier lifetime of the wafer. We have observed that B diffusion generates stacking faults that can be attributed to injection of Si interstitials into the wafer by formation of a boron rich layer at the wafer surface. These Si interstitials are also believed to enhance interactions between the native point defects and impurities (such as O, Fe) in the wafers during subsequent processing leading to the development of swirl patterns. Spatial variation of the lifetime degradation follows the point defect interactions and impurity segregation/precipitation. Lifetime can be partially recovered by Phosphorous (P) gettering. The overall effect on the cell performance due to Si interstitial generation, impurity/point defect interactions, and P-gettering is briefly discussed.

Using minority carrier lifetime measurement to determine saw damage characteristics on Si wafer surfaces

The damage on the Si wafer surfaces, caused by ingot cutting, is determined from measurement of minority carrier lifetime (τeff). Samples are sequentially etched to remove thin layers from each surface and lifetime is measured after each etch step. The thickness-removed at which the lifetime reaches a peak value corresponds to the damage depth. This technique also allows the depth distribution of the damage to be quantified in terms of surface recombination velocity (SRV). An accurate measurement of τeff requires corrections to optical reflection, and transmission to account for changes in the surface morphology and in the wafer thickness.

A high throughput, noncontact system for screening silicon wafers predisposed to breakage during solar cell production

We describe a non-contact, on-line system for screening wafers that are likely to break during solar cell/module fabrication. The wafers are transported on a conveyor belt under a light source, which illuminates the wafers with a specific light distribution. Each wafer undergoes a dynamic thermal stress whose magnitude mimics the highest stress the wafer will experience during cell/module fabrication. As a result of the stress, the weak wafers break, leaving only the wafers that are strong enough to survive the production processes. We will describe the mechanism of wafer breakage, introduce the wafer system, and discuss the results of the time-temperature (t-T) profile of wafers with and without microcracks.

Simulation Results: Optimization of Contact Ratio for Interdigitated Back-Contact Solar Cells

In the fabrication of interdigitated back contact (IBC) solar cells, it is very important to choose the right size of contact to achieve the maximum efficiency. Line contacts and point contacts are the two possibilities, which are being chosen for IBC structure. It is expected that the point contacts would give better results because of the reduced recombination rate. In this work, we are simulating the effect of contact size on the performance of IBC solar cells. Simulations were done in three dimension using Quokka, which numerically solves the charge carrier transport. Our simulation results show that around 10% of contact ratio is able to achieve optimum cell efficiency.

Editorial: Photovoltaic Materials and Devices 2014

An ever increasing demand on energy has fostered many new generation technologies, which include photovoltaics. In recent years, photovoltaic industry has grown very rapidly. The installed capacity of PV for 2013 was about 37 GW and 2014 sales are expected to be around 45 GW. However, there has been excess production for last several years, which is responsible in part for the low prices (about 60 c/W). To lower the PV energy costs further, a major strategy appears to be going to high efficiency solar cells. This approach is favored (over lower cost/lower efficiency) because cell efficiency has a very large influence on the acceptable manufacturing cost of a PV module. Hence, the PV industry is moving toward developing processes and equipment to manufacture solar cells that can yield efficiencies >20%. Therefore, further research is needed within existing technologies to accomplish these objectives. Likewise, research will continue to seek new materials and devices.