Puneet Gupta
SunEdison
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Publication
Featured researches published by Puneet Gupta.
Silicon materials science and technology. Conference | 2006
Puneet Gupta; Milind S. Kulkarni
The slicing of wafers from a silicon ingot by the wiresaw process involves the cutting action of the fine slurry particles trapped between the wire and the ingot surface being cut. The heat generated from the cutting action of the slurry is partly convected away by the fast moving slurry at the point of cut. The remainder of the heat leads to differential thermal expansion of the ingot depending on the local conditions at the instant and location of cut. It is conjectured that the non-uniform heat generation and partition is responsible for the warp observed in wafers as cut by the wiresaw process. In this study, a coupled thermal and structural finite element based approach is utilized to model and simulate warp of sliced wafers. Within the constraints and assumptions of the coupled FE model, excellent comparison of simulation results with experimental warp data is observed.
Archive | 2009
Milind S. Kulkarni; Puneet Gupta; Balaji Devulapalli; Jameel Ibrahim; Vithal Revankar; Kwasi Foli
Archive | 2006
Puneet Gupta; Larry W. Shive; Brian Lawrence Gilmore
Archive | 2007
Puneet Gupta; Milind S. Kulkarni; Carlo Zavattari; Roland R. Vandamme
Archive | 2012
Satish Bhusarapu; Puneet Gupta; Yue Huang
Archive | 2009
Satish Bhusarapu; Puneet Gupta
Archive | 2005
Milind S. Bhagavat; Puneet Gupta; Roland R. Vandamme; Takuto Kazama; Noriyuki Tachi
Archive | 2011
Puneet Gupta; Yue Huang; Satish Bhusarapu
Archive | 2010
Zhihui Gu; Timothy Dinh Truong; Puneet Gupta
Archive | 2014
Puneet Gupta; Henry F. Erk; Alexis Grabbe