Qi Ming

High-breakdown-voltage submicron InGaAs/InP double heterojunction bipolar transistor with f(t)=170 GHz and f(max)=253GHz

The layer structure of InGaAs/InP double heterojunction bipolar transistor (DHBT) is designed to enhance the frequency performance and breakdown voltage. The composition-graded base structure is used to decrease the base transit time. The InGaAs setback layer and two highly doped InGaAsP layers are used to eliminate the conduction band spike of the collector. The submicron-emitter InGaAs/InP DHBT is fabricated successfully. The base contact resistance is greatly decreased by optimization of contact metals. The breakdown voltage is more than 6 V. The current gain cutoff frequency is as high as 170 GHz and the maximum oscillation frequency reached 253 GHz. The DHBT with such high performances can be used to make W-band power amplifier.

High-Speed InGaAs/InP Double Heterostructure Bipolar Transistor with High Breakdown Voltage

We design and fabricate an InGaAs/InP double heterostructure bipolar transistor (DHBT). The spike of the conduction band discontinuity between InGaAs base and InP collector is successfully eliminated by insertion of an InGaAs layer and two InGaAsP layers. The current gain cutoff frequency and maximum oscillation frequency are as high as 155 and 144 GHz. The breakdown voltage in common-emitter configuration is more than 7 V. The high cutoff frequency and high breakdown voltage make high-speed and high-power circuits possible.

High current multi-finger InGaAs/InP double heterojunction bipolar transistor with the maximum oscillation frequency 253 GHz

A four-finger InGaAs/InP double heterojunction bipolar transistor is designed and fabricated successfully by using planarization technology. The emitter area of each finger is 1 ? 15?m2. The breakdown voltage is more than 7 V, the maximum collector current could be more than 100 mA. The current gain cutoff frequency is as high as 155 GHz and the maximum oscillation frequency reaches 253 GHz. The heterostructure bipolar transistor can offer more than 70mW class-A maximum output power at W band and the maximum power density can be as high as 1.2W/mm.

Composite-Collector InGaAs/InP Double Heterostructure Bipolar Transistors with Current-Gain Cutoff Frequency of 242 GHz

To eliminate the conduction band spike at the base-collector interface, an InP/InGaAs double heterostructure bipolar transistor (DHBT) with an InGaAsP composite collector is designed and fabricated using the conventional mesa structure. The DHBT with emitter area of 1.6 × 15 μm2 exhibits current-gain cutoff frequency ft = 242 GHz at the high collector current density Jc = 2.1 mA/μm2, which is to our knowledge the highest ft reported for the mesa InP DHBT in China. The breakdown voltage in common-emitter configuration is more than 5 V. The high-speed InP/InGaAs DHBT with high current density is very suitable for the application in ultra high-speed digital circuits.

Ultra high-speed InP/InGaAs SHBTs with/t and/max of 185 GHz

An InP/InGaAs single heterojunction bipolar transistor (SHBT) with high maximum oscillation frequency (fmax) and high cutoff frequency (ft) is reported. Efforts have been made to maximize fmax and ft simultaneously including optimizing the epitaxial structure, base-collector mesa over-etching and base surface preparation. The measured ft and fmax both reached 185 GHz with an emitter size of 1 × 20 μm2, which is the highest fmax for SHBTs in mainland China. The device is suitable for ultra-high speed digital circuits and low power analog applications.

Ultra high-speed InP/InGaAs DHBTs with ft of 203 GHz

InP/InGaAs/InP double heterojunction bipolar transistors (DHBTs) were designed for wide band digital and analog circuits, and fabricated using a conventional mesa structure with benzocyclobutene (BCB) passivation and planarization process techniques. Our devices exhibit a maximum ft of 203 GHz, which is the highest ft for DHBTs in mainland China. The emitter size is 1.0 × 20 μm2. The DC current gain β is 166, and BVCEO = 4.34 V. The devices reported here employ a 40 nm highly doped InGaAs base region and a 203 nm InGaAsP composite structure. They are suitable for high speed and intermediate power applications.

Growth and Characterization of GaAs/AlGaAs Thue–Morse Quasicrystal Photonic Bandgap Structures

One-dimensional quasicrystal structures composed of III-V semiconductor GaAs/AlGaAs multilayers in deterministic Thue–Morse (TM) sequences have been grown by using gas-source molecular beam epitaxy to investigate both the structural and the photonic bandgap properties. The x-ray measurements show that this aperiodic system exhibits obvious periodic spatial correlations, from which the precise thickness of the constitutive layers could be determined. Transmission and reflection measurements experimentally demonstrated plenty of photonic bandgaps with traditional or fractal features existing in those quasicrystal structures, which are in good agreement with the transfer matrix simulations. The diversity of this TM system makes it a good candidate for photonic device applications.

Effects of Si δ-Doping Condition and Growth Interruption on Electrical Properties of InP-Based High Electron Mobility Transistor Structures *

The InGaAs/InAlAs/InP high electron mobility transistor (HEMT) structures with lattice-matched and pseudomorphic channels are grown by gas source molecular beam epitaxy. Effects of Si δ-doping condition and growth interruption on the electrical properties are investigated by changing the Si-cell temperature, doping time and growth process. It is found that the optimal Si δ-doping concentration (Nd) is about 5.0 × 1012 cm−2 and the use of growth interruption has a dramatic effect on the improvement of electrical properties. The material structure and crystal interface are analyzed by secondary ion mass spectroscopy and high resolution transmission electron microscopy. An InGaAs/InAlAs/InP HEMT device with a gate length of 100 nm is fabricated. The device presents good pinch-off characteristics and the kink-effect of the device is trifling. In addition, the device exhibits fT = 249 GHz and fmax > 400 GHz.

Phonon-induced magnetoresistance oscillations in a high-mobility quantum well

We examine the temperature dependence of acoustic-phonon-induced magnetoresistance oscillations in a high-mobility GaAs-based quantum well with conventional transverse and longitudinal phonon modes, using a model in which the temperature increase of the Landau level broadening or the single-particle scattering rate 1/τs is attributed to the enhancement of electron-phonon scattering with rising temperature. The non-monotonic temperature behavior, showing an optimal temperature at which a given order of oscillation amplitude exhibits a maximum and the shift of the main resistance peak to higher magnetic field with rising temperature, is produced, in agreement with recent experimental findings.

High-Current Multi-Finger Mesa InGaAs/InP DHBTs

Characteristics of single- and multi-finger mesa InGaAs/InP double heterojunction bipolar transistors (DHBTs) are compared. The current gain decreases with the increasing number nf of the emitter fingers due to the mutual thermal interaction between the fingers. The Kirk current can be as high as 150 mA for four-finger DHBT. No degradation of the peak of the current gain cutoff frequency ft is found for multi-finger DHBTs. The peak of the maximum oscillation frequency fmax decreases with an increase of nf due to the increasing parasitic resistance of the base. The results are very helpful for applications of the common-base DHBTs in power amplifiers operating at very high frequencies.