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Dive into the research topics where Qing Shun Bai is active.

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Featured researches published by Qing Shun Bai.


Key Engineering Materials | 2007

Mechanism of Material Removal and the Generation of Defects by MD Analysis in Three-Dimensional Simulation in Abrasive Processes

Jia Xuan Chen; Ying Chun Liang; Qing Shun Bai; Yu Lan Tang; Ming Jun Chen

Molecular dynamics (MD) simulations of nanometric scratching with diamond tip are conducted on single crystal copper crystal plane (010), and MD simulations are carried out to investigate the mechanism of material removal and the generation of defects on the surface, subsurface and inner of material. During the process of diamond tip scratching the surface of single crystal copper on conditions of different scratching speeds, depths and widths. We achieved the forming details of the chip. While the generation and moving process of defects, such as dislocation, are recorded. The different times of atomic displacement and interaction force are also shown through MD simulation. The evolvement of the lattice pattern in the abrasive processes are analysed by radial distribution function (RDF) and computing the changes of workpiece’s atomic displaces and forces. At the same time, the lattice reconfiguration and the onset and the evolvement process of defects and are analysed by RDF and atomic perspective method, respectively. The simulation results show that scratching speed play role in the course of the form of removing chips, and that different scratching widths and depths of tool have effect on onset and evolvement of lattice defects of workpiece in abrasive processes. This study can give more fundamental understanding of nanosconstruction from atomistic motions and contribute to the design, manufacture and manipulation of nano-devices


Key Engineering Materials | 2007

Molecular Dynamic Simulation Study of AFM Single-Wall Carbon Nanotube Tip-Surface Interactions

Ying Chun Liang; J.H. Dou; Qing Shun Bai

Carbon nanotubes (CNTs) represent ideal Atomic Force Microscope (AFM) tip materials due to their remarkable mechanical properties. Dynamic interactions of a Single-wall Carbon nanotube (SWCNT) indenting towards a monocrystalline hydrogen-free Silicon surface (001) are investigated using molecular dynamic simulation. The critical strain and strain force along the axis of the tube from elastic to plastic regimes are calculated. The simulation shows the deform process in elastic regimes is similar to the process of two ends inward compressed. The atoms of nanotube tip adsorption to the Silicon surface has been observed in the plastic regimes. The mechanical microprocess of AFM’s single-wall Carbon nanotube tip and Silicon surface interactions from elastic to plastic regimes can be well comprehended from the view of nanoscale energetic evolution.


Advanced Materials Research | 2010

Numerical Simulation and Experimental Investigation of Tool Edge Radius Effect on Micro-Cutter Wear in Micro-End-Milling Process

Kai Yang; Qing Shun Bai; Ying Chun Liang

The micro-end-milling process of aluminum alloy Al2024-T6 has been investigated by numerical simulations and experimental approach. The effects of different tool edge radii on the micro-cutter wear were investigated. A three-dimensional finite element model is adopted to determine the effects of tool edge radii on the effective stress and micro-cutter wear during the micro-end-milling process. It is observed that the the tool nose wears out much more quickly due to the high maximal effective stress occurring in this zone. The experimental verification of the simulation model is carried out on a micro-end-milling process of aluminum alloy 2024-T6. The experimental results of the micro-cutter morphologies are in a good agreement with the simulation results. The experimental results show that the model is suitable for studying the mechanism of micro-cutter wear.


Materials Science Forum | 2009

Quasicontinuum Method Simulation of Nanometric Cutting of Single Crystal Copper

Ying Chun Liang; Hong Min Pen; Qing Shun Bai

A multiscale simulation model was built to study the nanometric cutting process of single crystal copper. This multiscale model distinctly reduces the degree of freedom of the whole system compared with full atomistic simulations. Through analyzing the fluctuations of tangential cutting force and strain energy with cutting distance, we confirm that the deformation mechanism of single crystal copper is plastic deformation caused by generation and evolution dislocation. The highest compressive stress locates in shear zone and highest tensile stress locates in the machined surface and subsurface. Simulation results show that there exists a high value of stress around dislocations, which reveals the local high value of stress is the main reason for the generation and evolution of dislocations in the workpiece material.


Key Engineering Materials | 2010

Quasicontinuum Simulation of Effect of Crystal Orientation and Cutting Direction of on Nanometric Cutting of Single Crystal Copper

Hong Min Pen; Qing Shun Bai; Ying Chun Liang

Quasicontinuum simulation of nanometric cutting was conducted on single crystal copper to investigate the effect of crystal orientation and cutting direction on nature of deformation of this material. The model reduces the degrees of freedom in simulations of nanometric cutting process without sacrificing important physics. The simulation results show the crystal orientation and cutting direction have a significant effect on the nature of deformation of nanometric cutting process. In addition, the variations of strain energy of workpiece atoms in different crystal set-ups are investigated.


Advanced Materials Research | 2010

Modeling and Experimental Analysis the Effect of Minimum Chip Thickness on Cutting Temperature in Micro-End-Milling Process

Ying Chun Liang; Kai Yang; Qing Shun Bai; Wanqun Chen

In this paper, the effect of minimum chip thickness on cutting temperature in micro-end- milling of aluminum alloy Al2024-T6 using a tungsten-carbide cutter are investigated and analyzed. The three-dimensional coupled thermal-mechanical finite element model is adopted to determine the effects of varying depth of cut on cutting temperature considering size effects. The simulation results show that the cutting temperature in micro-end-milling is lower than those occurring in conventional milling processes. When the depth of cut is approximately 40% of the cutting edge radius, there is no chip formation. The maximum temperature occurs at the contact region between micro cutting edge and workpiece, which shows an obvious size effect. The experimental verification of the simulation model is carried out on a micro-end-milling process of aluminum alloy 2024-T6 with a high precision infrared camera. The influence of various cutting depths on cutting temperature has been verified in experiments. The experimental measurements results are in a good agreement with the simulation results.


Key Engineering Materials | 2007

Surface Roughness Prediction Based on Cutting Parameters and Nose Radius in Precision Turning

Ying Chun Liang; Yuan Sheng Zhai; H.X. Wang; Qing Shun Bai; Ying Kai Zhao

In precision turning, the quality of surface finish is an important requirement for machined workpiece. Thus, the choice of optimal cutting parameters is very important for controlling the required surface quality. The focus of the present study is to find a correlation between surface roughness and cutting parameters (feed rate, depth of cut) and nose radius in turning 3J33 maraging steel, and to derive mathematical models for the predicted surface roughness based on both of cutting parameters and nose radius. The experimental design is carried out using the quadratic rotary combination design. The regression analysis shows feed rate and nose radius influence surface roughness significantly. With F-ratio test the proposed model is adequate. The method could be useful in predicting roughness parameters as a function of cutting parameters and nose radius.


Key Engineering Materials | 2010

Modeling and Micro-Milling Experiments on Complex 3D Micro-Mould Parts

Qing Shun Bai; Ying Chun Liang; Kai Yang; Zhi Luo; Xiao Yan Fang

Micro-mould is a necessary and productive component for the development of MEMS. However, the machining of micro-mould parts with complex 3D surfaces becomes the key problem for the development of micro machinery. In the paper, a new machining technique was introduced to manufacture micro-mould parts. With a reverse engineering technique, point cloud data were acquired and reconstructed into a 3D model of micro mould part in a computer. The numeral control code for micro-machining was also processed with the help of micro-machining simulation. The machining experiment on micro-parts with complex 3D surfaces was conducted on self-developed micro machine tools with micro-diameter ball-end cutter. High quality micro mould parts with complex 3D surfaces were obtained under these micro-milling experiments. The results will provide a perspective resolution on the manufacturing of micro-mould parts with complex surfaces.


Key Engineering Materials | 2008

Wear Characteristics of Micro-Diameter Cutter in High Speed Machining Micro Parts

Qing Shun Bai; Chun Li Yang; Ying Chun Liang; Li Dong Tong; Yan Zhao

The minimization of mechanical parts is one of important research direction in micro machine or MEMS area. Milling experiments of micro part were conducted on micro machine by using TiAlN-coating micro-diameter cutter. Three kinds of typical workpiece materials (LY12, stainless steel and high-elastic alloy 3J21) were adopted and the wear properties of micro-diameter cutter were investigated carefully. The main reasons for tool wear and breakage were analyzed. It is shown that the common wear characteristics of TiAlN-coating micro-diameter cutter are falling off of coating, breakage of tool nose, diffusion and adhesion wear while machining the three materials. Adhesion and diffusion effects are much obvious in machining 3J21 alloy and stainless steel, leading to coarse wear region of tool.


Materials Science Forum | 2006

Research on Nano-Cutting Processes Based on Parallel Molecular Dynamics

Ying Chun Liang; De Gang Li; Qing Shun Bai; Yu Lan Tang

To investigate the effect of tool geometry on single-crystal silicon nano-cutting, parallel molecular dynamics (MD) simulations are carried out with different tool rake angles. In this study, a parallel arithmetic based on mechanism of spatial decomposition together with MD is applied to simulate nano-cutting processes of single-crystal silicon (100) plane by using a single-crystal diamond tool. The simulation results show that tool rake angle has great effects on cutting forces and subsurface stress, and the effect of tool rake angle variation on work-piece potential energy is not evident while cutting single-crystal Silicon (100) plane. Moreover, the analysis of cutting forces and potential energy show that there is not evident dislocation in the nano-cutting.

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Ying Chun Liang

Harbin Institute of Technology

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Kai Yang

Harbin Institute of Technology

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Hong Min Pen

Harbin Institute of Technology

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Chun Li Yang

Harbin Institute of Technology

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H.X. Wang

Harbin Institute of Technology

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J.H. Dou

Harbin Engineering University

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Jia Xuan Chen

Harbin Institute of Technology

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Li Dong Tong

Harbin Institute of Technology

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Ming Jun Chen

Harbin Institute of Technology

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Wanqun Chen

Harbin Institute of Technology

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