Rachid Daineche

Mn segregation in Ge/Mn5Ge3 heterostructures: The role of surface carbon adsorption

Mn5Ge3 compound, with its room-temperature ferromagnetism and possibility to epitaxially grow on Ge, acts as a potential spin injector into group-IV semiconductors. However, the realization of Ge/Mn5Ge3 multilayers is highly hampered by Mn segregation toward the Ge growing surface. Here, we show that adsorption of some monolayers of carbon on top of the Mn5Ge3 surface prior to Ge deposition allows to greatly reduce Mn segregation. In addition, a fraction of deposited carbon can diffuse down to the underneath Mn5Ge3 layers, resulting in an enhancement of the Curie temperature up to ∼360 K. The obtained results will be discussed in terms of the formation of a diffusion barrier by filling interstitial sites of Mn5Ge3 by carbon.

Surface-interface exploration of Mg deposited on Si(100) and oxidation effect on interfacial layer

Using scanning tunneling microscopy and spectroscopy, Auger electron spectroscopy, and low energy electron diffraction, we have studied the growth of Mg deposited on Si(100)-(2 x 1). Coverage from 0.05 monolayer (ML) to 3 ML was investigated at room temperature. The growth mode of the magnesium is a two steps process. At very low coverage, there is formation of an amorphous ultrathin silicide layer with a band gap of 0.74 eV, followed by a layer-by-layer growth of Mg on top of this silicide layer. Topographic images reveal that each metallic Mg layer is formed by 2D islands coalescence process on top of the silicide interfacial layer. During oxidation of the Mg monolayer, the interfacial silicide layer acts as diffusion barrier for the oxygen atoms with a decomposition of the silicide film to a magnesium oxide as function of O2 exposure.

Atom Redistribution during co-Doped Amorphous Silicon Crystallization

Atom redistribution during crystallization of a B and P co-doped amorphous Si layer produced by Si and P chemical vapor co-deposition and B implantation has been investigated. The crystallization of the entire layer is quasi-instantaneous for annealing temperature greater than 650 °C. The crystallization rate is well reproduced by the Avrami-Johnson-Mehl-Kolmogorov model of transformation. The Avrami n is found equal to 4, which is corresponding to 3D bulk crystallization. Crystallization promotes a non-Fickian redistribution of B atoms, allowing for an abrupt interface between B-doped and B-undoped regions. After crystallization, B diffuses in the polycrystalline Si layer for concentrations lower than 1.5  1020 at cm3 via the type B kinetic regime. Crystallization has no significant (or detectable) influence on the P profile. For temperatures higher than 750 °C, P diffuses in the poly-Si layer towards the region of highest B concentration via the type B kinetic regime, leading to P uphill diffusion. This phenomenon can be simulated considering chemical interactions between B and P atoms in both grains and grain boundaries.

A perfect wetting of Mg monolayer on Ag(111) under atomic scale investigation: first principles calculations, scanning tunneling microscopy and Auger spectroscopy

First principles calculations, scanning tunneling microscopy, and Auger spectroscopy experiments of the adsorption of Mg on Ag(111) substrate are conducted. This detailed study reveals that an atomic scale controlled deposition of a metallic Mg monolayer perfectly wets the silver substrate without any alloy formation at the interface at room temperature. A liquid-like behavior of the Mg species on the Ag substrate is highlighted as no dot formation is observed when coverage increases. Finally a layer-by-layer growth mode of Mg on Ag(111) can be predicted, thanks to density functional theory calculations as observed experimentally.

Plasma Immersion Ion Implantation Applied To N+P Junction Realisation In 4H‐SiC

This paper focuses on the process giving rise to Nitrogen introduction into SiC p‐type epitaxial layers. Standard ion implantation and PULSION™ processes are performed at two distinct energies (700 eV and 7 keV), followed by an annealing at 1600 °C in a furnace specifically adapted to SiC material, aiming at creating thin n+p junctions. The doping profiles issued from the implantations show an important channeling effect for all samples. Surface roughness and Nitrogen activation after annealing are studied using AFM and Micro‐Four Point Probe means, respectively. A better surface morphology is found on plasma‐implanted samples, with a higher sheet resistance (in comparison with standard samples) which could either be related to a lower implanted dose and/or to a lower dopant activation.

Electrical Characteristics of SiC UV-Photodetector Device from the P-I-N Structure Behaviour to the Junction Barrier Schottky Structure Behaviour

In this paper, we deal with the study of Ultra Violet (UV) photodetector device based on SiC material undergoing a p-i-n structure process. Current density-voltage (J-V) measurements in reverse and forward bias, are performed on the UV photodetector device. Due to a very thin p+-type doping layer, a high reactivation annealing and the metallic contact deposit, experimental measurements point out Junction Barrier Schottky (JBS) device behaviour in spite of the p-i-n structure device process. To understand this involuntary phenomenon, these experimental characteristics are accompanied with an experimental study by the SIMS analysis.

Implantation of Nitrogen Atoms in 4H-SiC Epitaxial Layers: A Comparison between Standard and Plasma Immersion Processes

This paper focuses on the formation of thin n+p junctions in p-type Silicon Carbide (SiC) epitaxial layers using two kinds of Nitrogen implantations. The standard beam ion implantations and PULSIONTM processes were performed at two distinct energies (700 eV and 7 keV), and the subsequent annealing was held at 1600°C in a resistive furnace specifically adapted to SiC material. No measurable electrical activity was obtained for both implantations performed at 700 eV, due to some outdiffusion of N dopants during the annealing despite a low surface roughness (rms ~ 1.4 nm) and no residual damage detected by RBS/C. A higher sheet resistance was measured in plasma-implanted samples at 7 keV (in comparison with beam-line implanted samples), which is partly related to N outdiffusion. The profiles of N atoms beam-implanted at 7 keV are not affected by the annealing. The corresponding electrical activation is fully completed.

Simultaneous Measurements of Lattice and Grain Boundary Diffusion Coefficients via 2-Dimensional Simulations

A method is presented to measure lattice and grain boundary diffusion coefficients using secondary ion mass spectroscopy and 2-dimensional diffusion simulations. SIMS is used to measure concentration profiles of implanted species before and after annealing. The as-implanted concentration profile is used as the initial condition for 2-dimensional diffusion simulations using the finite element method. The geometry of the simulation is based on the microstructure of the sample observed by transmission electron microscopy. Both lattice and grain boundary diffusion are simulated. The final 2-dimensional concentration distribution is projected on the depth axis to obtain a simulated depth profile. The diffusion coefficients are adjusted to fit the profiles measured after annealing. We find that this method allows to determine simultaneously and independently the lattice and grain boundary diffusion coefficients from the same profiles. This method is used to measure the diffusion coefficients of As in polycrystalline Ni2Si thin films. The simulations are found to fit the measured profiles with accuracy. The coefficients are measured between 550 and 700°C. An activation energy ratio Qgb/Qv is found greater than one. This result is corroborated by existing data in silicides and is compared to results in other materials for discussion.