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Dive into the research topics where Radu Reit is active.

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Featured researches published by Radu Reit.


Journal of Biomedical Materials Research Part A | 2017

Design and demonstration of an intracortical probe technology with tunable modulus.

Dustin Simon; Hamid Charkhkar; Conan St. John; Sakthi Rajendran; Tong Kang; Radu Reit; David Arreaga-Salas; Daniel G. McHail; Gretchen L. Knaack; Andrew M. Sloan; Dane Grasse; Theodore C. Dumas; Robert L. Rennaker; Joseph J. Pancrazio; Walter Voit

Intracortical probe technology, consisting of arrays of microelectrodes, offers a means of recording the bioelectrical activity from neural tissue. A major limitation of existing intracortical probe technology pertains to limited lifetime of 6 months to a year of recording after implantation. A major contributor to device failure is widely believed to be the interfacial mechanical mismatch of conventional stiff intracortical devices and the surrounding brain tissue. We describe the design, development, and demonstration of a novel functional intracortical probe technology that has a tunable Youngs modulus from ∼2 GPa to ∼50 MPa. This technology leverages advances in dynamically softening materials, specifically thiol-ene/acrylate thermoset polymers, which exhibit minimal swelling of < 3% weight upon softening in vitro. We demonstrate that a shape memory polymer-based multichannel intracortical probe can be fabricated, that the mechanical properties are stable for at least 2 months and that the device is capable of single unit recordings for durations up to 77 days in vivo. This novel technology, which is amenable to processes suitable for manufacturing via standard semiconductor fabrication techniques, offers the capability of softening in vivo to reduce the tissue-device modulus mismatch to ultimately improve long term viability of neural recordings.


ACS Applied Materials & Interfaces | 2015

Integration of High-Charge-Injection-Capacity Electrodes onto Polymer Softening Neural Interfaces

David Arreaga-Salas; Adrian Avendano-Bolivar; Dustin Simon; Radu Reit; Aldo Garcia-Sandoval; Robert L. Rennaker; Walter Voit

Softening neural interfaces are implanted stiff to enable precise insertion, and they soften in physiological conditions to minimize modulus mismatch with tissue. In this work, a high-charge-injection-capacity iridium electrode fabrication process is detailed. For the first time, this process enables integration of iridium electrodes onto softening substrates using photolithography to define all features in the device. Importantly, no electroplated layers are utilized, leading to a highly scalable method for consistent device fabrication. The iridium electrode is metallically bonded to the gold conductor layer, which is covalently bonded to the softening substrate via sulfur-based click chemistry. The resulting shape-memory polymer neural interfaces can deliver more than 2 billion symmetric biphasic pulses (100 μs/phase), with a charge of 200 μC/cm(2) and geometric surface area (GSA) of 300 μm(2). A transfer-by-polymerization method is used in combination with standard semiconductor processing techniques to fabricate functional neural probes onto a thiol-ene-based, thin film substrate. Electrical stability is tested under simulated physiological conditions in an accelerated electrical aging paradigm with periodic measurement of electrochemical impedance spectra (EIS) and charge storage capacity (CSC) at various intervals. Electrochemical characterization and both optical and scanning electron microscopy suggest significant breakdown of the 600 nm-thick parylene-C insulation, although no delamination of the conductors or of the final electrode interface was observed. Minor cracking at the edges of the thin film iridium electrodes was occasionally observed. The resulting devices will provide electrical recording and stimulation of the nervous system to better understand neural wiring and timing, to target treatments for debilitating diseases, and to give neuroscientists spatially selective and specific tools to interact with the body. This approach has uses for cochlear implants, nerve cuff electrodes, penetrating cortical probes, spinal stimulators, blanket electrodes for the gut, stomach, and visceral organs and a host of other custom nerve-interfacing devices.


ACS Applied Materials & Interfaces | 2015

Hydrolytically Stable Thiol–ene Networks for Flexible Bioelectronics

Radu Reit; Daniel Zamorano; Shelbi Parker; Dustin Simon; Benjamin R. Lund; Walter Voit; Taylor Ware

Hydrolytically stable, tunable modulus polymer networks are demonstrated to survive harsh alkaline environments and offer promise for use in long-term implantable bioelectronic medicines known as electroceuticals. Todays polymer networks (such as polyimides or polysiloxanes) succeed in providing either stiff or soft substrates for bioelectronics devices; however, the capability to significantly tune the modulus of such materials is lacking. Within the space of materials with easily modified elastic moduli, thiol-ene copolymers are a subset of materials that offer a promising solution to build next generation flexible bioelectronics but have typically been susceptible to hydrolytic degradation chronically. In this inquiry, we demonstrate a materials space capable of tuning the substrate modulus and explore the mechanical behavior of such networks. Furthermore, we fabricate an array of microelectrodes that can withstand accelerated aging environments shown to destroy conventional flexible bioelectronics.


Advances in Polymer Science | 2014

Shape Memory Polymer–Inorganic Hybrid Nanocomposites

Radu Reit; Benjamin R. Lund; Walter Voit

Shape memory polymers (SMPs) have been the focus of much research over the last few decades. From the novelty of temporarily fixing a three-dimensional shape from a planar polymer sheet, to the uses that SMPs are seeing today as softening biomedical implants and self-deploying hinges, this class of smart materials has successfully been used to tackle a variety of biological, electrical, and mechanical problems. However, the properties of these networks are limited by the organic nature of the SMPs. To enhance their properties, researchers across the globe have looked into imparting the desirable properties of inorganic composite materials to these polymer networks. As the field of shape memory polymer composites began to grow, researchers quantified the unique enhancements that came at varying filler loading levels as a result of controlled material interface interactions. Specifically, the incorporation of nanofillers of various shapes and sizes leads to increased internal interfacial area relative to micro- and macrocomposites at identical loading fractions and imparts interesting mechanical, optical, electrical, thermal, and magnetic properties to these emerging nanocomposites. This new class of material, referred to in this review as shape memory polymer–inorganic nanocomposites (SMPINCs), allows a host of new interactions between the smart polymer and its surrounding environment as a result of the ability to control the internal environment of the polymer network and nanofiller. In this work, the reader is introduced to both the methods of preparing these composites and the effects the fillers have on the biological, electromagnetic, and mechanical properties of the resulting composite.


Organic Electronics | 2015

Organic light-emitting diodes on shape memory polymer substrates for wearable electronics

Michael P. Gaj; Andrew Wei; Canek Fuentes-Hernandez; Yadong Zhang; Radu Reit; Walter Voit; Seth R. Marder; Bernard Kippelen


Journal of Materials Chemistry B | 2016

Thiol–epoxy/maleimide ternary networks as softening substrates for flexible electronics

Radu Reit; Haley Abitz; Neel Reddy; Shelbi Parker; Andrew Wei; Nicole Aragon; Milan Ho; Aaron Weittenhiller; Tong Kang; Melanie Ecker; Walter Voit


MRS Proceedings | 2015

Investigating thiol-epoxy composites for semiconductor die attach adhesives

Andrew Wei; Radu Reit; Walter Voit


SID Symposium Digest of Technical Papers | 2018

82-3: Temporary Bonding Alternative to Laser Lift-Off for Flexible Displays

Radu Reit; Jesus Espinoza; Abraham Vega; Tolis Voutsas; Adrian Avendano-Bolivar; David Arreaga-Salas


Archive | 2017

Overview of Mechanical Behavior of Materials

Radu Reit; Matthew Di Prima; Walter Voit


MRS Advances | 2016

Robotic Insertion Aid for Self-Coiling Cochlear Implants

Hans Ajieren; Radu Reit; Roxanne Lee; Tiffany Pham; Dongmei Shao; Kenneth Lee; Walter Voit

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Walter Voit

University of Texas at Dallas

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Andrew Wei

University of Texas at Dallas

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David Arreaga-Salas

University of Texas at Dallas

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Dustin Simon

University of Texas at Dallas

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Benjamin R. Lund

University of Texas at Dallas

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Robert L. Rennaker

University of Texas at Dallas

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Shelbi Parker

University of Texas at Dallas

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Tong Kang

University of Texas at Dallas

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Aaron Weittenhiller

University of Texas at Dallas

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