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Richard D. Nelson

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Publication

Featured researches published by Richard D. Nelson.

Archive | 1995

Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same

Ernest R. Nolan; Diana Carter Duane; Todd H. Herder; Thomas A. Bishop; Kimcuc T. Tran; Robert W. Froehlich; Randy L. German; Richard D. Nelson; Chung J. Lee; Mark R. Breen; Kathryn V. Keswick

Archive | 1991

Liquid metal paste for thermal and electrical connections

Thomas P. Dolbear; Colin A. MacKay; Richard D. Nelson

Archive | 1993

Thermally and electrically conductive adhesive material and method of bonding with same

Richard D. Nelson; Thomas P. Dolbear; Robert W. Froehlich

Archive | 1989

Low pressure high heat transfer fluid heat exchanger

Richard D. Nelson; Dennis J. Herrell

Archive | 1994

Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal

Richard D. Nelson; Thomas P. Dolbear; Robert W. Froehlich

Archive | 1992

Method for encapsulating an integrated circuit using a removable heatsink support block

Seyed H. Hashemi; Michael A. Olla; Thomas P. Dolbear; Richard D. Nelson

Archive | 1988

Fluid heat exchanger for an electronic component

Richard D. Nelson; Omkarnath R. Gupta; Dennis J. Herrell

Archive | 1988

End fed liquid heat exchanger for an electronic component

Richard D. Nelson; Omkarnath Ramnath Gupta

Archive | 1990

Coiled spring heat transfer element

Thomas P. Dolbear; Richard D. Nelson; David A. Gibson; Omkarnath R. Gupta

Archive | 1989

Method and apparatus for adjustably mounting a heat exchanger for an electronic component.

Richard D. Nelson; Omkarnath R. Gupta; Dennis J. Herrell

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