Richard D. Nelson

Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same

Liquid metal paste for thermal and electrical connections

Thermally and electrically conductive adhesive material and method of bonding with same

Low pressure high heat transfer fluid heat exchanger

Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal

Method for encapsulating an integrated circuit using a removable heatsink support block

Fluid heat exchanger for an electronic component

End fed liquid heat exchanger for an electronic component

Coiled spring heat transfer element

Method and apparatus for adjustably mounting a heat exchanger for an electronic component.