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Dive into the research topics where Richard F. Hill is active.

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Featured researches published by Richard F. Hill.


IEEE Transactions on Components and Packaging Technologies | 2007

Rudimentary Finite Element Thermal Modeling of Platelet-Filled Polymer-Ceramic Composites

Richard F. Hill; Jason L. Strader

In order to improve the thermal performance of polymeric materials, they can be filled with intrinsically high thermal conductivity fillers that provide heat-conducting paths through the resulting composite. The thermal performance of polymers loaded with platelet-shaped fillers was modeled using finite element analysis in order to provide a prediction of thermal conductivity as a function of variables such as filler thermal conductivity, orientation, and polymer matrix thermal conductivity. Modeling results were compared to experimental data. An unexpectedly strong effect that the matrix conductivity has on the conductivity of the polymer-ceramic composite was predicted by modeling and confirmed experimentally.


semiconductor thermal measurement and management symposium | 2005

Rudimentary finite element thermal modeling of platelet-filled polymer-ceramic composites

Richard F. Hill; Jason L. Strader

In order to improve the thermal performance of polymeric materials, they can be filled with intrinsically high thermal conductivity fillers that provide heat-conducting paths through the resulting composite. The thermal performance of polymers loaded with platelet-shaped fillers was modeled using finite element analysis in order to provide a prediction of thermal conductivity as a function of variables such as filler thermal conductivity, orientation, and polymer matrix thermal conductivity. Modeling results were compared to experimental data. An unexpectedly strong effect that the matrix conductivity has on the conductivity of the polymer-ceramic composite was predicted by modeling and confirmed experimentally.


Archive | 2004

Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink

Richard F. Hill; Jason L. Strader


Archive | 2011

Thermal interface material assemblies and related methods

Jason L. Strader; Richard F. Hill


Archive | 2004

Heat spreading thermal interface structure

Richard F. Hill; Jason L. Strader; James Latham


Archive | 2004

Heat sink and heat spreader assembly

Richard F. Hill; Jason L. Strader


semiconductor thermal measurement and management symposium | 2006

Practical utilization of low melting alloy thermal interface materials

Richard F. Hill; Jason L. Strader


Archive | 2002

Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink

Richard F. Hill; Jason L. Strader


Archive | 2013

Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials

Jason L. Strader; Richard F. Hill


Archive | 2016

REUSABLE THERMOPLASTIC THERMAL INTERFACE MATERIALS AND METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SOURCES AND HEAT DISSIPATING/REMOVAL STRUCTURES

Jason L. Strader; Richard F. Hill

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