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Dive into the research topics where Rika Nomura is active.

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Featured researches published by Rika Nomura.


optical interconnects conference | 2014

7.2-Tb/s compact optical backplane using ribbon fiber sheet and high-density connector

Norio Chujo; Rika Nomura; Toru Yazaki; Toshiaki Takai; Naoki Matsushima

A compact optical backplane was developed, and a ribbon fiber sheet and high-density connector were used to reduce the cost and wiring area. A bandwidth of 7.2-Tb/s was achieved within a 288 × 53 mm2 area inside the network equipment.


international conference on electronic packaging and imaps all asia conference | 2015

Effect of adherend surface morphology on adhesive strength

Yoshio Oozeki; Hiroaki Furuichi; Rika Nomura; Satoshi Arai

UV-curing acrylic adhesives characterized by relatively high elastic modulus at room temperature and high Tg are prone to provide inadequate adhesive strength because of the stress concentration at the interface between the adhesive and the adherend. We used two types of metal adherend (Zn), one with a flat surface structure and the other with a sawtooth surface structure, to verify the effect of the surface morphology of the adherend on the initial adhesiveness and reliability [1]. The results showed that, by employing the sawtooth structure for the adherends surface morphology, the initial adhesive strength increased significantly regardless of the adhesive type, and that the fracture mode shifted from the dominant interfacial failure mode to the mixed mode of interfacial failure accompanied with cohesive failure. On the other hand, the adhesive strength after reliability tests had different tendencies depending on the adhesive types. It was found that, for adhesives having a higher crosslink density, coupled with the effect of the sawtooth structure, the rate of deterioration accelerated to cause the adhesive strength to decrease significantly, and that the fracture mode transitioned only to the interfacial fracture mode over storage time under reliability test storage conditions of 60°C/90%RH. Accordingly, to simultaneously achieve higher reliability and increased adhesive strength, it is essential to apply the sawtooth structure for the adherends surface morphology and use adhesives having a lowered crosslink density.


cpmt symposium japan | 2014

3.3-Tb/s compact optical fiber package using pre-formed optical fiber

Rika Nomura; Norio Chujo; Akiko Mizushima; Naoki Matsushima; Kouichi Fukumiya; Itoe Akutsu; Koji Hata

We developed a compact optical fiber package for rack-to-rack transmission in information communication technology. Using pre-formed optical fiber instead of optical fiber strands and ribbon fiber, we achieved a reduction in the routing area and protection of the optical fiber. We fabricated a prototype mock-up board with optical modules and achieved a bandwidth of 3.3 Tb/s and an area of 4500 mm2. We confirmed a good transmission performance board-to-board with 5 m of optical cable at 25 Gb/s (PRBS: 231-1).


Archive | 2007

Optical pickup device and optical disc drive

Satoshi Arai; Hiroaki Furuichi; Yoshio Oozeki; Rika Nomura; Kazumi Takahashi


Archive | 2007

OPTICAL PICKUP DEVICE AND OPTICAL DISC DRIVE APPARATUS

Satoshi Arai; Hiroaki Furuichi; Yoshio Oozeki; Rika Nomura; Masayuki Okamura; Kazumi Takahashi; Mitsuo Satake


Archive | 2006

Optical disc drive apparatus, flexible printed circuit board joint structure, and joint structure of flexible printed circuit boards for optical pickup

Hiromichi Hiramatsu; Hiroaki Furuichi; Satoshi Arai; Rika Nomura; Mitsuo Satake


Archive | 2014

Housing for a connector

Rika Nomura; Koji Nakagawa; Norio Chujo; Yuichi Koreeda


Archive | 2009

CONNECTION STRUCTURE OF FLEXIBLE PRINTED CIRCUITS AND OPTICAL PICKUP DEVICE INCLUDING THE CONNECTION STRUCTURE

Rika Nomura; Hiroaki Furuichi; Yoshio Oozeki; Kazuhiko Ito; Fumihito Ichikawa


Archive | 2009

OPTICAL PICKUP DEVICE AND OPTICAL DISK DRIVE APPARATUS

Yoshio Oozeki; Rika Nomura; Taketoshi Moriyama; Katsumi Kuroguchi; Kazumi Takahashi


Archive | 2013

Optical Pickup Device and Method for Manufacturing the Same

Rika Nomura; Hidenao Saito; Yoshiro Konishi

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