Robert W. Pennisi

Overmolded plastic pad array carriers (OMPAC): a low cost, high interconnect density IC packaging solution for consumer and industrial electronics

A novel surface mount leadless semiconductor packaging technology, OMPAC, has been developed to meet the requirements of next-generation portable electronic products. Benefits of OMPAC compared to convenient surface mount leaded plastic packages such as plastic leaded chip carriers and quad flat packs, include smaller size, higher package interconnect density, higher test and solder assembly yields due to the use of pre-applied solder bumps, and greater technology extendability in the areas of high-speed integrated circuits, multichip modules and fine pitch soldering. Component-level qualification of OMPAC was successfully completed using industry standard environmental tests. C-mode scanning acoustical microscopy was extensively used to optimize package design and processing.<<ETX>>

A new liquid encapsulant for IC packaging

The new SYCAR resin is shown to have the desirable characteristics for a liquid encapsulant. Unlike epoxy-based encapsulants, this resin consists of a silicon-carbon backbone which is highly crosslinked during the cure reaction. The desirable characteristics of this resin include a low level of ionic contamination, low moisture absorption, high glass transition temperature, excellent dispensability, and long shelf life. Package level reliability results indicated that the SYCAR encapsulant outperformed the leading domestic and Japanese encapsulants and met the 144 h of autoclave, 1000 h of bias humidity, and 1000 cycles of thermal shock requirements for mold compounds.<<ETX>>