Rocco A. Orsini

Laser-produced plasma light source for extreme ultraviolet lithography

Pulsed Nd:YAG lasers have been developed to achieve high peak power and high pulse repetition rate. These systems are being used as drivers for laser-produced plasmas which efficiently convert the 1064-nm laser output to extreme ultraviolet (EUV) light at 13.5 nm for future microlithography systems. The requirements for laser-produced plasma EUV light sources and their integration in lithography tools for high-volume manufacturing are reviewed to establish the key design issues for high-power lasers and plasma targets. Xenon has been identified as a leading target material to realize the goals of intense EUV emission and clean operation. Recent progress in high-power diode-pumped Nd:YAG lasers and xenon targets for EUV generation is reviewed, showing that laser-produced plasma sources meet the needs for current EUV lithography development tools. Future directions to meet EUV source requirements for high-volume manufacturing tools are discussed.

Xenon Target and High-Power Laser Module Development for LPP Sources

This chapter gives an overview of LPP EUV source development work at Northrop Grumman Corporation (NGC). The chapter covers development of the laser module, xenon target, and overall system. The volume editor (V. Bakshi) prepared this chapter as a summary of information provided to him by NGC. Lasers for LPP EUV sources are expected to produce tens of kilowatts of high-pulse-rate, high-pulse-energy, short-pulse-width, near-diffraction-limited output. Such lasers will be focused onto a condensed jet of cryogenic xenon or tin targets to produce a plasma with sufficient temperature to generate EUV radiation. For the generation of the EUV-producing plasma, pulse widths of around 10 ns and pulse energies in the range of 0.5 to 1 J are required. High beam quality and low pointing error are required to maintain constant high intensity on the EUV source target so that the radiated EUV power and consequent exposure doses on the semiconductor wafer are uniform. Depending on the choice of target material, eventually pulse rates of at least 7500 Hz and laser powers of 10–30 kW will be required to ensure the required power collection at the intermediate focus (IF). In 1999, NGC constructed a 1700-W diode-pumped Nd:YAG phase-conjugated master oscillator-power amplifier (MOPA) laser, designated EUV-Alpha, which was used in a lithography testbed at Sandia Labs in Livermore (see Chapter 24 for further description). Later NGC built an EUV-Beta laser (Fig. 25.1) that produced 4500 W and was operated at NGCs EUV source development facility at Cutting Edge Optronics (CEO). The Beta laser, a modular design for better maintainability, was twice as efficient and had two-thirds the footprint of the Alpha laser. For this laser, NGC selected a MOPA architecture (Fig. 25.2) using stimulated Brillouin scattering (SBS) phase conjugation to compensate for aberrations, figure error, and thermal distortions in the Nd:YAG gain media. The output of a custom 12-W master oscillator (MO) was split in two with a polarizer and directed to two amplifier trains. Each amplifier train consisted of two diode-pumped zigzag slab amplifiers, image relay telescopes, shaping optics, and an SBS cell. After round trips through the two slab amplifiers, the two MO beams were brought to their full 750-W power in each train, and then polarization-combined for a total of 1500 W. In the Beta laser, there were three such 1500-W modules, which yielded a system total of 4500 W at 7500 Hz.