Roger M. Ruuspakka

Haptics using a smart material for eyes free interaction in mobile devices

We present a proof of concept (POC) for haptic interaction when audio or visual feedback is not practical. The POC includes addressable arrays of two-way Shape Memory Alloy (SMA) springs which can operate at a lower voltage and temperature compatible with mobile devices. They will form different shapes due to the thermal effect as current travels through the springs. The POC can simultaneously realize multiple methods for conveying haptic information such as dimension, force, texture and temperature due to the flexible array design. The haptic interface can go back to the original shape by itself after the current is off due to the advance of two way SMA. We are developing applications with different POC designs for tangible interactions.