Is this you? Create Your Porfile
Avatar

Roman Schlosser

Bosch

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Roman Schlosser is active.

Explore More

Publication

Featured researches published by Roman Schlosser.

Journal of the Acoustical Society of America | 2011

Micromechanical structure for receiving and/or generating acoustic signals, method for producing a micromechanical structure, and use of a micromechanical structure

Roman Schlosser; Stefan Weiss; Frank Fischer; Christoph Schelling

Archive | 2005

Micromechanical structure for use as e.g. microphone, has counter units forming respective sides of structure, where counter units have respective electrodes, and closed diaphragm is arranged between counter units

Frank Fischer; Christoph Schelling; Roman Schlosser; Stefan Weiss

Archive | 2007

Method for producing a micromechanical component and mircomechanical component

Roman Schlosser; Heribert Weber; Christoph Schelling

Archive | 2015

Component Having a Via and Method for Manufacturing It

Julian Gonska; Jens Frey; Heribert Weber; Eckhard Graf; Roman Schlosser

Archive | 2008

METHOD FOR PRODUCTION OF A MICROMECHANICAL COMPONENT

Heribert Weber; Christoph Schelling; Stefan Weiss; Nicolaus Ulbrich; Roman Schlosser

Archive | 2011

Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches

Jens Frey; Heribert Weber; Eckhard Graf; Roman Schlosser

Archive | 2011

Component with a via and method for producing it

Julian Gonska; Roman Schlosser; Jens Frey; Heribert Weber; Eckhard Graf

Archive | 2015

COMPONENT WITH VIA CONTACT AND METHOD FOR PRODUCING THE SAME

Gonska Julian; Roman Schlosser; Frey Jens; Heribert Weber; Eckhard Graf

Archive | 2012

Wafer system processing method, involves extending electrical plated through-hole from one semiconductor layer into another semiconductor layer through insulation layer, where latter semiconductor layer is partially removed to expose hole

Roman Schlosser; Heribert Weber

Archive | 2011

Bauelement mit einer Durchkontaktierung und Verfahren zu dessen Herstellung

Julian Gonska; Roman Schlosser; Jens Frey; Heribert Weber; Eckhard Graf

Explore More

Collaboration

Dive into the Roman Schlosser's collaboration.

Top Co-Authors
Avatar

Heribert Weber

Bosch

View shared research outputs
Top Co-Authors
Avatar

Christoph Schelling

Bosch

View shared research outputs
Top Co-Authors
Avatar

Eckhard Graf

Bosch

View shared research outputs
Top Co-Authors
Avatar

Jens Frey

Bosch

View shared research outputs
Top Co-Authors
Avatar

Stefan Weiss

Bosch

View shared research outputs
Top Co-Authors
Avatar

Julian Gonska

Bosch

View shared research outputs
Top Co-Authors
Avatar

Frank Fischer

Bosch

View shared research outputs
Top Co-Authors
Avatar

Frey Jens

Bosch

View shared research outputs
Top Co-Authors
Avatar

Gonska Julian

Bosch

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge