Roman Schlosser

Micromechanical structure for receiving and/or generating acoustic signals, method for producing a micromechanical structure, and use of a micromechanical structure

Micromechanical structure for use as e.g. microphone, has counter units forming respective sides of structure, where counter units have respective electrodes, and closed diaphragm is arranged between counter units

Method for producing a micromechanical component and mircomechanical component

Component Having a Via and Method for Manufacturing It

METHOD FOR PRODUCTION OF A MICROMECHANICAL COMPONENT

Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches

Component with a via and method for producing it

COMPONENT WITH VIA CONTACT AND METHOD FOR PRODUCING THE SAME

Wafer system processing method, involves extending electrical plated through-hole from one semiconductor layer into another semiconductor layer through insulation layer, where latter semiconductor layer is partially removed to expose hole

Bauelement mit einer Durchkontaktierung und Verfahren zu dessen Herstellung