Rong Fa Chen

Effect of DC-Plasma Arc Behavior on Growth of Diamond Film

DC-Plasma arc behavior is one of the key factors on growth of diamond film. The results show that keeping steady DC-Plasma arc can grow better quality diamond film. In a long-time growth of diamond film, there is sediment carbon on about 5mm border-entad anode annulus, which was proved to be graphite. It results in fluctuating and instability of DC-Plasma arc and in the DC-Plasma density, which causes graphite generation and much stress in the film. By means of adjusting anode annulus assembly, pausing the supply of carbon source and increasing H2, the problem of sediment carbon cab be effectively resolved. Finally, the mechanism of the effect of arc behavior on growth of diamond film is discussed.

Study on Mechanical Polishing for CVD Diamond Films of Forming Nucleus Surface and Growing Surface

In the present work, high power DC arc plasma jet chemical vapor deposition (CVD) is used to prepare diamond films with full width half magnitude (FWHM) less than 10 wave numbers at 1332 cm−1 Raman peak. During the polishing process, diamond film is hold against the stainless steel holder, which rotates and swings when the sample comes into contact with the cast-iron plate. Average surface roughness of the forming nucleus polished surface and growing polished surface is 560nm, 90nm respectively. And the materials removal rate is quite different. Fine crystal grain of the forming nucleus surface and the thick column crystal of growing surface are dominant in structure. In the meantime, effects of the size of the abrasive power, the applied force and polishing direction are also discussed. A profilometer, an Raman spectroscopy, X-ray diffraction and a scanning electron microscope have been used to evaluate the surface states of diamond films before and after polishing. This result reveals an. improvement of polishing efficiency and a great potential for commercial application.

Mechanism of Brittle-Ductile Transition of Single Silicon Wafer Using Nanoindentation Techniques

Hardness, elastic modulus and scratch resistance of single silicon wafer are measured by nanoindentation and nanoscratching using a nanoindenter. Fracture toughness is measured by indentation using a Vickers indenter. The results show that the hardness and elastic modulus at a peak indentation depth of 100 nm are 12.6 and 166.5 GPa respectively. These values reflect the properties of the silicon wafer, the bulk material. The fracture toughness value of the silicon wafer is 0.74 Mpa·m1/2. The material removal mechanisms are seen to be directly related to the normal force on the tip. The critical load and scratch depth estimated from the scratch depth profile after the scratching and the friction profile are 138.64 mN and 54.63 nm respectively. If the load and scratch depth are under the critical values, the silicon wafer will undergo plastic flow rather than fracture. The critical scratch depth is different from that calculated from the formula of critical-depth-of-cut described by Bifnao et al and some reasons are given.

The Design of Noncircular Gear of Constant Pressure Angle and the Realization of Its Wire-Electrode Cutting

This paper brings forward a new type of the tooth profile of noncircular gear—constant pressure angle involute tooth profile, and realizes its wire-electrode cutting. By the design of CAD and CAM, this paper shortens the design time of the noncircular gear and improved the design accuracy of the noncircular gear. By the research of the constant pressure angle involute tooth profile of noncircular gear, this paper has improved the transmission accuracy of the noncircular gear. By the research of the technology of wire-electrode cutting, this paper has improved the manufacturing accuracy of the noncircular gear.

Effects of Methane Concentration on Growth of Carbon Balls in Anode Nozzle and Arc Stability of DCPJ CVD Plasma Torch

High quality diamond film wafers with different thickness are prepared by high power DC arc plasma jet CVD (DCPJ CVD) method using a CH4/Ar/H2 gas mixture. The effects of methane concentration on the growth of carbon balls in anode nozzle and arc stability are studied with theoretical analysis and experimental investigation. The results indicate that different sizes of carbon balls may rapidly grow in the anode nozzle with methane concentration higher than 2 Vol-%, symmetry and uniformity of the rotating arc are strongly affected with the occurrence of carbon balls, which will result in non-uniform deposition of diamond films over a large substrate area. The methane concentration should be controlled at a low level to keep diamond film wafers growth stable. Characterization by X-ray diffraction, Raman spectroscopy and SEM analysis are also carried out.

Investigation on Strain Films in the Thin Film Resistance Strain Gauge

Strain films in the thin film resistance strain gauge are prepared by magnetron sputtering method. Some results concerning the electromechanical and structural properties of nichrome (Ni80Cr20 wt.%) thin films are presented. As compared to the well-known Ni-Cu (constantan) alloy film, which are widely used for manufacturing pressure and force sensors, nichrome (Ni80Cr20 wt.%) thin films exhibit gauge factor values of the same order of magnitude, but they are much more corrosion resistant and adherent to the substrate. The influences of composition and post-deposition annealing on the electrical resistance, temperature coefficient of resistance (TCR) and gauge factor of nichrome (Ni80Cr20 wt.%) thin films are discussed.

Investigation of Technology and Analysis of Residual Stress in Large Area Diamond Films

We investigated the residual stress in diamond films grown on molybdenum substrates as a function of different places in the same large sample. The diamond film wafers of Ф60 mm diameter were deposited at 900°C by high power DC arc plasma jet CVD method using a gas mixture of methane (1.8% vol.) and hydrogen ( 90% vol.). The grain sizes, obtained from the top view scanning electron microscopy (SEM) images, were found to become larger from center to the border in the same sample, and the x-ray diffraction indicated that the intensity of characteristic spectroscopy in same diamond film was changed from (220) to (111) with the increases of (311). Profile curves presented the appreciable difference of surface texture from center to edge. The film had 4.3GPa of residual compressive stress. Examination of the Raman spectra of the film revealed that residual stress in the film of up to approximately 0.70GPa, and the Raman spectroscopy shifts from 1332.99cm-1 at the center to 1331.17cm-1 at the border, which means the stress mode changed from compressive to tensile. These demonstrated a significant inhomogeneity of stress in diamond films. The differences have been attributed partly to high temperature inhomogeneity arc jet during growth and morphological aspects of the film growth. The relationships between stress and methane concentration, and substrate temperature are discussed in detail.

Research on Thickness of the Free Confinement Medium in Laser Shock Processing

In this paper, it has been studied that the thickness of the free confinement medium in the Laser Shock Processing. Then the relationships are analyzed between the peak pressure induced by laser shock and the properties of the free confinement medium. On the basis, the optimum thickness of the free confinement medium is obtained, which ensure not only the optimum LSP effect but also the elimination of the remains of free confinement medium at a time. In the experiments, a kind of materials of free confinement medium was invented successfully, which is applicable to laser shock processing. The estimation of the free confinement medium theoretical thickness is accorded with the result of the experimental.

Research on High-Speed Preparation of Micro-Nanocrystalline Diamond Film

Micro-nanocrystalline diamond (M-NCD) Film may be successfully prepared on Mo substrate with DC arc plasmas jet deposition device. This paper studies the influences of carbon source concentration on the shape of M-NCD Film particles under circumstances of stable electric arc, and characterizes the grain size and quality of samples through SEM, AFM and Raman spectrum. The research result shows that, in the state of stable electric arc, relatively low carbon source concentration (1%) could deposit high-quality microcrystalline diamond film on the substrate, with a growth rate of up to 8.3μm/h and grain size of about 2～4μm; relatively high carbon source concentration (10% or 15%) could deposit high-quality nanocrystalline diamond(NCD) film on the microcrystalline diamond film at high speed, with a growth rate of up to above 12.6μm/h or 19.7μm/h, grain size of about 4～80nm and average grain size of 27.4nm.

Temperature Field during CMP GaAs Wafer Using an AID

The abrasive ice disc chemical mechanical polishing (AID-CMP) is a potential polishing process in the semiconductor industry to realize superior surface finish and planarity for semiconductor wafers. In this paper we investigated the temperature field during GaAs wafer AID-CMP process for a better understanding of AID-CMP. The results show that the AID outer temperature is higher than the inner, and the highest temperature in AID is at the wafer/AID contact zone. The increases of Pc, v, eh and tp will generate more energy and cause more local melting during GaAs wafer AID-CMP process. The AID temperature and the area of highest temperature zone increase with increasing Pc, v, and eh. The nodes temperature increase in every conditions adopted as tp increases. The area of melted zone and thickness of melted ice increase with increasing Pc, v, eh and tp.