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Rongfu Wen

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Publication

Featured researches published by Rongfu Wen.

Archive | 2006

Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same

Jerry Liang; Jieren Xie; Xinchao Wang; Xiekang Yu; Yujuan Tao; Rongfu Wen; Fushou Li; Zhengwei Zhou; Da Wang; Haibo Ge; Qiang Zheng; Zhen Gong; Weijun Yang

Archive | 2006

Package structure with flat bumps for integrate circuit or discrete device and method of manufacture the same

Jerry Liang; Jieren Xie; Xinchao Wang; Xiekang Yu; Yujuan Tao; Rongfu Wen; Fushou Li; Zhengwei Zhou; Da Wang; Haibo Ge; Qiang Zheng; Zhen Gong; Weijun Yang

Archive | 2006

Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same

Jerry Liang; Jieren Xie; Xinchao Wang; Xiekang Yu; Yujuan Tao; Rongfu Wen; Fushou Li; Zhengwei Zhou; Da Wang; Haibo Ge; Qiang Zheng; Zhen Gong; Weijun Yang

Archive | 2007

Effective packaging method for improving component-device sub-layer of semiconductor plastic package

Zhizhong Liang; Xinchao Wang; Xiekang Yu; Liqing Mao; Mingdong Pan; Yujuan Tao; Rongfu Wen; Zhengwei Zhaou; Fushou Li

Archive | 2006

Electronic component plane button ultra-thin packed substrate and making method thereof

Zhizhong Liang; Xinchao Wang; Xiekang Yu; Jieren Xie; Yujuan Tao; Rongfu Wen

Archive | 2008

Packing method capable of preventing component delamination in semiconductor plastic package

Zhizhong Liang; Xinchao Wang; Xiekang Yu; Liqing Mao; Mingdong Pan; Yujuan Tao; Rongfu Wen; Zhengwei Zhou; Fushou Li

Archive | 2008

Effective packing method for improving component delamination in semiconductor plastic package

Zhizhong Liang; Xinchao Wang; Xiekang Yu; Liqing Mao; Mingdong Pan; Yujuan Tao; Rongfu Wen; Zhengwei Zhou; Fushou Li

Archive | 2008

Package method for preventing element lamination in semiconductor plastic package

Zhizhong Liang; Xinchao Wang; Xiekang Yu; Liqing Mao; Mingdong Pan; Yujuan Tao; Rongfu Wen; Zhengwei Zhou; Fushou Li

Archive | 2007

Method for improving device lamination inside semiconductor plastic packer efficiently

Zhizhong Liang; Xinchao Wang; Xiekang Yu; Liqing Mao; Mingdong Pan; Yujuan Tao; Rongfu Wen; Zhengwei Zhou; Fushou Li

Archive | 2006

Semiconductor component plane button type ultra-thin packed substrate and making method thereof

Zhizhong Liang; Xinchao Wang; Xiekang Yu; Jieren Xie; Yujuan Tao; Rongfu Wen

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