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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Roy H. Magnuson is active.

Publication


Featured researches published by Roy H. Magnuson.


Archive | 1994

Method for making printed circuit boards with selectivity filled plated through holes

Anilkumar Chinuprasad Bhatt; Roy H. Magnuson; Voya R. Markovich; Konstantinos I. Papathomas; Douglas O. Powell


Archive | 1986

Method of preparing a printed circuit board

Anilkumar Chinuprasad Bhatt; Roy H. Magnuson; Voya R. Markovich; Konstantinos I. Papathomas; Douglas O. Powell


Archive | 1998

Two signal one power plane circuit board

Kenneth Michael Fallon; Miguel A. Jimarez; Ross W. Keesler; John M. Lauffer; Roy H. Magnuson; Voya R. Markovich; Irv Memis; Jim P. Paoletti; Marybeth Perrino; John A. Welsh; William E. Wilson


Archive | 2004

Circuitized substrate and method of making same

John M. Lauffer; Roy H. Magnuson; Voya R. Markovich; James P. Paoletti; Kostas Papathomas; Rajinder S. Rai


Archive | 2001

Manufacturing computer systems with fine line circuitized substrates

Anilkumar Chinuprasad Bhatt; Roy H. Magnuson; Thomas R. Miller; Voya R. Markovich; Carlos Juan Sambucetti; Stephen L. Tisdale


Archive | 2001

Copper plated PTH barrels and methods for fabricating

Roy H. Magnuson; Voya R. Markovich; Thomas R. Miller; Michael Wozniak


Archive | 1988

Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon

Robert W Johnson; William Howell Lawrence; Gary Kevin Lemon; Roy H. Magnuson; Voya R. Markovich; Ralph Elliott Parsons; Carlos Juan Sambucetti


Archive | 2007

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

Benson Chan; Frank D. Egitto; How T. Lin; Roy H. Magnuson; Voya R. Markovich; David L. Thomas


Archive | 1998

Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric

John M. Lauffer; Roy H. Magnuson; Voya R. Markovich; John A. Welsh


Archive | 2005

Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate

Rabindra N. Das; John M. Lauffer; Roy H. Magnuson; Voya R. Markovich

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