Is this you? Create Your Porfile
Avatar

Roy H. Magnuson

IBM

Network

Latest external collaboration on country level. Dive into details by clicking on the dots.

Explore More

Hotspot

Dive into the research topics where Roy H. Magnuson is active.

Explore More

Publication

Featured researches published by Roy H. Magnuson.

Archive | 1994

Method for making printed circuit boards with selectivity filled plated through holes

Anilkumar Chinuprasad Bhatt; Roy H. Magnuson; Voya R. Markovich; Konstantinos I. Papathomas; Douglas O. Powell

Archive | 1986

Method of preparing a printed circuit board

Anilkumar Chinuprasad Bhatt; Roy H. Magnuson; Voya R. Markovich; Konstantinos I. Papathomas; Douglas O. Powell

Archive | 1998

Two signal one power plane circuit board

Kenneth Michael Fallon; Miguel A. Jimarez; Ross W. Keesler; John M. Lauffer; Roy H. Magnuson; Voya R. Markovich; Irv Memis; Jim P. Paoletti; Marybeth Perrino; John A. Welsh; William E. Wilson

Archive | 2004

Circuitized substrate and method of making same

John M. Lauffer; Roy H. Magnuson; Voya R. Markovich; James P. Paoletti; Kostas Papathomas; Rajinder S. Rai

Archive | 2001

Manufacturing computer systems with fine line circuitized substrates

Anilkumar Chinuprasad Bhatt; Roy H. Magnuson; Thomas R. Miller; Voya R. Markovich; Carlos Juan Sambucetti; Stephen L. Tisdale

Archive | 2001

Copper plated PTH barrels and methods for fabricating

Roy H. Magnuson; Voya R. Markovich; Thomas R. Miller; Michael Wozniak

Archive | 1988

Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon

Robert W Johnson; William Howell Lawrence; Gary Kevin Lemon; Roy H. Magnuson; Voya R. Markovich; Ralph Elliott Parsons; Carlos Juan Sambucetti

Archive | 2007

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

Benson Chan; Frank D. Egitto; How T. Lin; Roy H. Magnuson; Voya R. Markovich; David L. Thomas

Archive | 1998

Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric

John M. Lauffer; Roy H. Magnuson; Voya R. Markovich; John A. Welsh

Archive | 2005

Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate

Rabindra N. Das; John M. Lauffer; Roy H. Magnuson; Voya R. Markovich

Explore More

Collaboration

Dive into the Roy H. Magnuson's collaboration.

Top Co-Authors
Avatar

Voya R. Markovich

IBM

View shared research outputs
Top Co-Authors
Avatar

Ronald Anthony Kaschak

IBM

View shared research outputs
Top Co-Authors
Avatar

Benson Chan

IBM

View shared research outputs
Top Co-Authors
Avatar

John M. Lauffer

IBM

View shared research outputs
Top Co-Authors
Avatar

Anilkumar Chinuprasad Bhatt

IBM

View shared research outputs
Top Co-Authors
Avatar

Dae Young Jung

IBM

View shared research outputs
Top Co-Authors
Avatar

Edmond Otto Fey

IBM

View shared research outputs
Top Co-Authors
Avatar

Hans-Dieter Kilthau

IBM

View shared research outputs
Top Co-Authors
Avatar

John A. Welsh

IBM

View shared research outputs
Top Co-Authors
Avatar

Peter Haselbauer

IBM

View shared research outputs
Explore More
Researchain Logo
Decentralizing Knowledge