Ryan R. Dehoff

The metallurgy and processing science of metal additive manufacturing

Additive manufacturing (AM), widely known as 3D printing, is a method of manufacturing that forms parts from powder, wire or sheets in a process that proceeds layer by layer. Many techniques (using many different names) have been developed to accomplish this via melting or solid-state joining. In this review, these techniques for producing metal parts are explored, with a focus on the science of metal AM: processing defects, heat transfer, solidification, solid-state precipitation, mechanical properties and post-processing metallurgy. The various metal AM techniques are compared, with analysis of the strengths and limitations of each. Only a few alloys have been developed for commercial production, but recent efforts are presented as a path for the ongoing development of new materials for AM processes.

Site specific control of crystallographic grain orientation through electron beam additive manufacturing

Abstract Site specific control of the crystallographic orientation of grains within metal components has been unachievable before the advent of metals additive manufacturing (AM) technologies. To demonstrate the capability, the growth of highly misoriented micron scale grains outlining the letters D, O and E, through the thickness of a 25·4 mm tall bulk block comprised of primarily columnar [001] oriented grains made of the nickel base superalloy Inconel 718 was promoted. To accomplish this, electron beam scan strategies were developed based on principles of columnar to equiaxed transitions during solidification. Through changes in scan strategy, the electron beam heat source can rapidly change between point and line heat source modes to promote steady state and/or transient thermal gradients and liquid/solid interface velocity. With this approach, an equiaxed solidification in the regions bounding the letters D, O and E was achieved. The through thickness existence of the equiaxed grain structure outlining the letters within a highly columnar [001] oriented bulk was confirmed through characterizing the bulk specimen with energy selective neutron radiography and confirming with an electron backscatter detection. Ultimately, this demonstration promotes the ability to build metal components with site specific control on crystallographic orientation of grains using the electron beam melting process.

Control and elimination of nucleation-related defects in GaP/Si(001) heteroepitaxy

GaP films were grown on offcut Si(001) substrates using migration enhanced epitaxy nucleation followed by molecular beam epitaxy, with the intent of controlling and eliminating the formation of heterovalent (III-V/IV) nucleation-related defects—antiphase domains, stacking faults, and microtwins. Analysis of these films via reflection high-energy electron diffraction, atomic force microscopy, and both cross-sectional and plan-view transmission electron microscopies indicate high-quality GaP layers on Si that portend a virtual GaP substrate technology, in which the aforementioned extended defects are simultaneously eliminated. The only prevalent remaining defects are the expected misfit dislocations due to the GaP–Si lattice mismatch.

Characterization of Metamorphic GaAsP/Si Materials and Devices for Photovoltaic Applications

GaAsyP1-y anion-sublattice compositionally graded buffers and device structures were grown directly on Si(100) substrates by way of a high-quality GaP integration layer, yielding GaAsP target layers having band gaps of photovoltaic interest (1.65-1.8 eV), free of antiphase domains/borders, stacking faults, and microtwins. GaAsyP1-y growths on both Si and GaP substrates were compared via high-resolution X-ray diffractometry of the metamorphic buffers and deep-level transient spectroscopy (DLTS) of p+-n diodes that are lattice matched to the final buffer layer. Structural analysis indicates highly efficient epitaxial relaxation throughout the entire growth structure for both types of samples and suggests no significant difference in physical behavior between the two types of samples. DLTS measurements performed on GaAsP diodes fabricated on both Si and GaP substrates reveal the existence of identical sets of traps residing in the n-type GaAsP layers in both types of samples: a single majority carrier (electron) trap, which is located at EC - 0.18 eV, and a single minority carrier (hole) trap, which is located at EV + 0.71 eV. Prototype 1.75-eV GaAsP solar cell test devices grown on GaAsyP1-y/Si buffers show good preliminary performance characteristics and offer great promise for future high-efficiency III-V photovoltaics integrated with Si substrates and devices.

Comparison of residual stresses in Inconel 718 simple parts made by electron beam melting and direct laser metal sintering

Residual stress profiles were mapped using neutron diffraction in two simple prism builds of Inconel 718: one fabricated with electron beam melting (EBM) and the other with direct laser metal sintering. Spatially indexed stress-free cubes were obtained by electrical discharge machining (EDM) equivalent prisms of similar shape. The (311) interplanar spacings from the EDM sectioned sample were compared to the interplanar spacings calculated to fulfill stress and moment balance. We have shown that applying stress and moment balance is a necessary supplement to the measurements for the stress-free cubes with respect to accurate stress calculations in additively manufactured components. In addition, our work has shown that residual stresses in electron beam melted parts are much smaller than that of direct laser metal sintered parts most likely due to the powder preheating step in the EBM process.

Crystallographic texture engineering through novel melt strategies via electron beam melting: Inconel 718

Abstract Preliminary research has demonstrated the ability to utilise novel scan strategies in the electron beam melting (EBM) process to establish control of crystallographic texture within Inconel 718 deposits. Conventional EBM scan strategies and process parameters yield coarse columnar grains aligned parallel to the build direction. Through varying process parameters such as beam power, beam velocity, beam focus and scan strategy, the behaviour of the electron beam can be manipulated from a line source to a point source. The net effect of these variations is that the resulting crystallographic texture is controlled in a manner to produce either epitaxial deposits or fully equiaxed deposits. This research demonstrates the ability to change the crystallographic texture on the macroscale indicating that EBM technology can be used to create complex geometric components with both site-specific microstructures and material properties.

Thermographic In-Situ Process Monitoring of the Electron Beam Melting Technology used in Additive Manufacturing

Oak Ridge National Laboratory (ORNL) has been utilizing the ARCAM electron beam melting technology to additively manufacture complex geometric structures directly from powder. Although the technology has demonstrated the ability to decrease costs, decrease manufacturing lead-time and fabricate complex structures that are impossible to fabricate through conventional processing techniques, certification of the component quality can be challenging. Because the process involves the continuous deposition of successive layers of material, each layer can be examined without destructively testing the component. However, in-situ process monitoring is difficult due to metallization on inside surfaces caused by evaporation and condensation of metal from the melt pool. This work describes a solution to one of the challenges to continuously imaging inside of the chamber during the EBM process. Here, the utilization of a continuously moving Mylar film canister is described. Results will be presented related to in-situ process monitoring and how this technique results in improved mechanical properties and reliability of the process.

Recyclability study on Inconel 718 and Ti-6Al-4V powders for use in electron beam melting

Powder bed-based additive manufacturing technologies offer a big advantage in terms of reusability of the powders over multiple cycles that result in cost savings. However, currently there are no standards to determine the factors that govern the powder reuse times. This work presents the results from a recyclability study conducted on Inconel 718 and Ti-6Al-4V powders. It has been found that the Inconel 718 powders are chemically stable over a large number of cycles and their reuse time is limited by physical characteristics of powders such as flowability. Ti-6Al-4V, on the other hand, finds its reuse time governed by the oxygen pick up that occurs during and in between build cycles. The detailed results have been presented.

Direct digital additive manufacturing technologies: Path towards hybrid integration

In the past decade, additive manufacturing and printed electronics technologies have expanded rapidly on a global scale. As the additive manufacturing techniques have become more capable and affordable, and able to work with a broader range of materials, the machines are increasingly being used to make advanced products at significantly lower costs and risks. The additive manufacturing industry is populated by a broad family of technologies, and the present paper provides an overview of key additive manufacturing technologies and their impact on materials processing, device applications, and future markets. Our R&D efforts on the development of core technologies for the realization of flexible electronics, and 3D microscale structures are also highlighted.

Thermographic Microstructure Monitoring in Electron Beam Additive Manufacturing

To reduce the uncertainty of build performance in metal additive manufacturing, robust process monitoring systems that can detect imperfections and improve repeatability are desired. One of the most promising methods for in situ monitoring is thermographic imaging. However, there is a challenge in using this technology due to the difference in surface emittance between the metal powder and solidified part being observed that affects the accuracy of the temperature data collected. The purpose of the present study was to develop a method for properly calibrating temperature profiles from thermographic data to account for this emittance change and to determine important characteristics of the build through additional processing. The thermographic data was analyzed to identify the transition of material from metal powder to a solid as-printed part. A corrected temperature profile was then assembled for each point using calibrations for these surface conditions. Using this data, the thermal gradient and solid-liquid interface velocity were approximated and correlated to experimentally observed microstructural variation within the part. This work shows that by using a method of process monitoring, repeatability of a build could be monitored specifically in relation to microstructure control.