S. Akbulut

Solid–liquid interfacial energy of aminomethylpropanediol

The grain boundary groove shapes for equilibrated solid aminomethylpropanediol, 2-amino-2 methyl-1.3 propanediol (AMPD) with its melt were directly observed by using a horizontal temperature gradient stage. From the observed grain boundary groove shapes, the Gibbs?Thomson coefficient (?), solid?liquid interfacial energy (?SL) and grain boundary energy (?gb) of AMPD have been determined to be (5.4 ? 0.5) ? 10?8?K?m, (8.5 ? 1.3) ? 10?3?J?m?2 and (16.5 ? 2.8) ? 10?3?J?m?2, respectively. The ratio of thermal conductivity of equilibrated liquid phase to solid phase for the AMPD has also been measured to be 1.12 at the melting temperature.

Solid-liquid interfacial energy of pyrene

The equilibrated grain boundary groove shapes for commercial purity pyrene (PY) were directly observed by using a temperature gradient stage. From the observed grain boundary groove shapes, the Gibbs-Thomson coefficient and solid-liquid interfacial energy of PY have been determined to be (8.9±0.9)×10−8Km and (21.9±3.3)×10−3Jm−2 with the present numerical model and Gibbs-Thomson equation, respectively. The grain boundary energy of PY phase has been determined to be (42.8±7.3)×10−3Jm−2 from the observed grain boundary groove shapes. Thermal conductivity ratio of liquid phase to solid phase has also been measured to be 0.89.

Solid-liquid interfacial energy of neopentylglycol

The grain boundary groove shapes for equilibrated solid neopentylglycol (2,2-dimethyl-1,3-propanediol) (NPG) with its melt were directly observed by using a horizontal temperature gradient stage. From the observed grain boundary groove shapes, the Gibbs-Thomson coefficient (Gamma), solid-liquid interfacial energy (sigma(SL)), and grain boundary energy (sigma(gb)) of NPG have been determined to be (7.4+/-0.7)x10(-8) Km, (7.9+/-1.2)x10(-3) Jm(-2), and (15.4+/-2.5)x10(-3) Jm(-2), respectively. The ratio of thermal conductivity of equilibrated liquid phase to solid phase for the NPG has also been measured to be 1.07 at the melting temperature.

Experimental determination of interfacial energies for Ag2Al solid solution in the CuAl2?Ag2Al system

The equilibrated grain boundary groove shapes of solid solution Ag2Al in equilibrium with an Al—Cu—Ag liquid were observed from a quenched sample with a radial heat flow apparatus. The Gibbs–Thomson coefficient, solid—liquid interfacial energy and grain boundary energy of the solid solution Ag2Al have been determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase and the thermal conductivity ratio of the liquid phase to solid phase for Ag2Al — 28.3 at the % CuAl2 alloy at the melting temperature have also been measured with a radial heat flow apparatus and Bridgman type growth apparatus, separately.

Measurement of solid-liquid interfacial energy in the In-Bi eutectic alloy at low melting temperature

The Gibbs‐Thomson coefficient and solid‐liquid interfacial energy of the solid In solution in equilibrium with In Bi eutectic liquid have been determined to be (1.46 ± 0.07) × 10 −7 Kma nd(40.4 ± 4.0) × 10 −3 Jm −2 by observing the equilibrated grain boundary groove shapes. The grain boundary energy of the solid In solution phase has been calculated to be (79.0 ± 8.7) × 10 −3 Jm −2 by considering force balance at the grain boundary grooves. The thermal conductivities of the In‐12.4 at.% Bi eutectic liquid phase and the solid In solution phase and their ratio at the eutectic melting temperature (72 ◦ C) have also been measured with radial heat flow apparatus and Bridgman-type growth apparatus.

Determination of solid–liquid interfacial energies in the In–Bi–Sn ternary alloy

The equilibrated grain boundary groove shapes of solid In2Bi solution in equilibrium with the In–Bi–Sn eutectic liquid were observed from a quenched sample at 59 °C. The Gibbs–Thomson coefficient, solid–liquid interfacial energy and grain boundary energy of the solid In2Bi solution have been determined to be (1.42 ± 0.07) × 10−7 K m, (49.6 ± 5.0) × 10−3 J m−2 and (97.1 ± 10.7) × 10−3 J m−2, respectively, from the observed grain boundary groove shapes. The thermal conductivities of the solid phases for In–21.23 at% Bi–19.04 at% Sn and In–30.5 at% Bi–3 at% Sn alloys and the thermal conductivity ratio of the liquid phase to the solid phase for In–21.23 at% Bi–19.04 at% Sn have also been measured with a radial heat flow apparatus and a Bridgman type growth apparatus, respectively, at their melting temperature.