S. Gall

Improved electrical transport in Al-doped zinc oxide by thermal treatment

A postdeposition thermal treatment has been applied to sputtered Al-doped zinc oxide films and shown to strongly decrease the resistivity of the films. While high temperature annealing usually leads to deterioration of electrical transport properties, a silicon capping layer successfully prevented the degradation of carrier concentration during the annealing step. The effect of annealing time and temperature has been studied in detail. A mobility increase from values of around 40 cm2/Vs up to 67 cm2/Vs, resulting in a resistivity of 1.4×10−4 Ω cm has been obtained for annealing at temperatures of 650 °C. The high mobility increase is most likely obtained by reduced grain boundary scattering. Changes in carrier concentration in the films caused by the thermal treatment are the result of two competing processes. For short annealing procedures we observed an increase in carrier concentration that we attribute to hydrogen diffusing into the zinc oxide film from a silicon nitride barrier layer between the zinc...

Aluminum-induced crystallization of amorphous silicon

We investigated the aluminum-induced crystallization of amorphous silicon (a-Si) during the aluminum-induced layer exchange (ALILE) process, in which a stack of glass/Al/a-Si is transformed into a glass/polycrystalline silicon (poly-Si)/Al(Si) structure by an annealing step well below the eutectic temperature of the Al/Si system. Our experiments resulted in continuous large-grained poly-Si films on glass substrates. The nucleation and the growth of the crystalline phase during the ALILE process was observed using an optical microscope. We found an activation energy of 1.8 eV for the nucleation process and we related this energy to a large barrier at the a-Si/Al interface.

Microstructure and photovoltaic performance of polycrystalline silicon thin films on temperature-stable ZnO:Al layers

Polycrystalline silicon (poly-Si) thin films have been prepared by electron-beam evaporation and thermal annealing for the development of thin-film solar cells on glass coated with ZnO:Al as a transparent, conductive layer. The poly-Si microstructure and photovoltaic performance were investigated as functions of the deposition temperature by Raman spectroscopy, scanning and transmission electron microscopies including defect analysis, x-ray diffraction, external quantum efficiency, and open circuit measurements. It is found that two temperature regimes can be distinguished: Poly-Si films fabricated by deposition at low temperatures (Tdep 400 °C) directly in crystalline phase reveal columnar, up to 300 nm big crystals with a strong ⟨110⟩ orientation and much better solar cell parameters. It ...

A kinetic simulation study of the mechanisms of aluminum induced layer exchange process

The aluminum induced layer exchange (ALILE) process allows the formation of thin polycrystalline Si (poly-Si) layers of large grain size on foreign substrates such as glass at low process temperatures. This paper is devoted to a computer simulation study of the kinetics of the ALILE process taking into account the mechanisms of its separate stages: Si diffusion in the AlOx membrane, nucleation and growth of grains, and the formation of preferential (100) orientation. The characteristics of the ALILE process are explained based on the evolution of the Si concentration within the Al layer. In particular it is demonstrated that the characteristic suppression of nucleation after short annealing times results from a decrease in the Si concentration in the Al layer due to the growth of existing grains. A number of important parameters of ALILE process are estimated comparing the results of simulation to the experimental data.

Temperature stability of ZnO:Al film properties for poly-Si thin-film devices

The crystallization of thin silicon films at temperatures between 425 and 600°C was investigated on glass substrates coated with Al-doped zinc oxide (ZnO:Al). Bare ZnO:Al layers degrade at the crystallization temperatures used. A silicon layer on top, however, efficiently prevents deterioration. The resistivity was even found to drop from 4.3×10−4Ωcm for the as deposited ZnO:Al to 2.2×10−4Ωcm in the case of aluminium induced crystallization and to 3.4×10−4Ωcm for solid phase crystallization. The temperature-stable conductivity of ZnO:Al films coated with Si opens up appealing options for the production of polycrystalline silicon thin-film solar cells with transparent front contacts.

Crystallization kinetics in electron-beam evaporated amorphous silicon on ZnO:Al-coated glass for thin film solar cells

To systematically study the crystallization process of electron-beam evaporated amorphous silicon on ZnO:Al-coated glass for polycrystalline silicon thin film solar cells, transmission electron microscopy and optical microscopy were employed. A time and temperature dependent analysis allowed the individual investigation of the growth and nucleation processes. The growth velocities of Si-crystals on ZnO:Al and SiN-coated glass were found to be identical within the investigated temperature regime of 500–600 °C. However, with a high steady state nucleation rate and a low activation energy, the nucleation process of Si on ZnO:Al-coated glass has shown to differ significantly from nucleation on glass.

PECVD Intermediate and Absorber Layers Applied in Liquid-Phase Crystallized Silicon Solar Cells on Glass Substrates

Liquid-phase crystallized silicon absorber layers have been applied in heterojunction solar cells on glass substrates with 10.8% conversion efficiency and an open-circuit voltage of 600 mV. Intermediate layers of SiOx, SiNx, and SiOxNy, as well as the a-Si:H precursor layer, were deposited on 30 cm × 30 cm glass substrates using industrial-type plasma-enhanced chemical vapor deposition equipment. After crystallization on 3cm × 5cm area using a continuous-wave infrared laser line, the resulting polysilicon material showed high material quality with large grain sizes.

Preparation of thin polycrystalline silicon films on glass by aluminium-induced crystallisation: an electron microscopy study

Abstract Polycrystalline silicon (poly-Si) films on glass were prepared by aluminium-induced crystallisation of amorphous silicon (a-Si). During an annealing step at temperatures well below the eutectic temperature of the Al/Si system ( T eu =577 °C) a glass/Al/a-Si stack is transformed into a glass/poly-Si/Al+Si stack. In this aluminium-induced layer exchange process the oxidation of the Al layer during the preparation of the initial glass/Al/a-Si stack plays an important role. Here we show that the aluminium oxide layer, which was formed during the preparation of the initial stack, is still present after the annealing step. The Al 2 O 3 layer has corundum structure. The thickness of this layer is laterally inhomogeneous. The nucleation of the poly-Si layer starts at the Al/Al 2 O 3 interface.

Depletion regions in the aluminum-induced layer exchange process crystallizing amorphous Si

Annealing of aluminum/amorphous silicon bilayers below the eutectic temperature of the aluminum/silicon system leads to an exchange of the layer positions and a concurrent crystallization of silicon (aluminum-induced layer exchange). This letter discusses a model for the self-limited suppression of nucleation during the process. This characteristic feature is the reason why large grain sizes can be obtained. In our experiments, we combine nucleation caused by supersaturation and undercooling. Si depletion regions around existing grains are made visible. These experiments give direct proof of the idea that the suppression of nucleation occurs by Si depletion in the aluminum-induced layer exchange process.

Liquid-Phase Crystallized Silicon Solar Cells on Glass: Increasing the Open-Circuit Voltage by Optimized Interlayers for n- and p-Type Absorbers

Liquid-phase crystallization (LPC) has proven to be a suitable method to grow large-grained silicon films on commercially well-available glass substrates. Zone-melting crystallization with high-energy-density line sources such as lasers or electron beams enabled polycrystalline grain growth with wafer equivalent morphology. However, the electronic quality is strongly affected by the material used as the interlayer between the glass and the silicon absorber. Open-circuit voltages above 630 mV, and efficiencies up to 11.8% were demonstrated using n-type absorbers on a sputtered interlayer comprising a triple stack of SiO2/SiNx/SiO2. In this study, we present our results to further improve the device performance by investigating the influence of the interlayer on the open-circuit voltage of the devices and characterize the properties of the absorber and interface using bias light-dependent quantum efficiency data and transmission electron microscopy (TEM) images. Finally, we investigate the applicability of aluminum oxide (Al2O3) for passivation of p-type LPC absorbers.