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Featured researches published by S. Lüftl.


Microelectronics Reliability | 2009

Processing procedures for the realization of fine structured channel arrays and bridging elements by LTCC-Technology

Walter Smetana; Bruno Balluch; G. Stangl; S. Lüftl; Sabine Seidler

This report deals with technological procedures to provide channel partition walls of minimum width inside of Low Temperature Co-fired Ceramics (LTCC) micro fluidic devices demonstrated by means of the fabrication of parallel closely-spaced channels which may act as a specific functional part of a fluidic heat exchanger. Furthermore, the realization of single layer bridging elements inside of channels is discussed. Such an element may be introduced as a delicate sensor substrate providing adequate thermal insulation and low thermal mass as well. The technological processing steps under consideration start with laser micromachining of green ceramic tapes using Nd-YAG-laser equipment and are followed by a modified low-pressure lamination step comprising the application of appropriate adhesives and the incorporation of polymer sacrificial volume materials (SVMs). Consequently, the increased fraction of involved organics requires an adequate adaptation of the firing process to provide a residue-free burnout. Great attention is paid to the prevention of channel cross-section distortion and to the integrity of structures, verified by optical inspection of microsectioned samples. The optimized processing procedures enable the fabrication of channel arrays with a partition wall thickness as small as 100 μm, while single layer bridging elements may span a channel width of 4 mm.


Materials | 2013

Developing a Sealing Material: Effect of Epoxy Modification on Specific Physical and Mechanical Properties

Christoph Schoberleitner; Vasiliki-Maria Archodoulaki; Thomas Koch; S. Lüftl; Markus Werderitsch; Gerhard Kuschnig

To develop a matched sealing material for socket rehabilitation of grey cast iron pipes, an epoxy resin is modified by the addition of different components to improve the flexibility. Three different modifications are made by adding ethylene-propylene diene monomer (EPDM) rubber powder, reactive liquid polymer (ATBN) and epoxidized modifier. In this paper the effect of the modification method as well as the influence of absorption of water on the mechanical and physical properties are analyzed in terms of: tensile strength, modulus of elasticity, adhesion performance, pressure resistance, glass transition temperature and water content. A comparison with neat epoxy shows for all materials that the modulus of elasticity and strength decrease. Unlike other tested modification methods, the modification with rubber powder did not enhance the flexibility. All materials absorb water and a plasticization effect arises with further changes of mechanical and physical properties. The application of the sealant on the grey cast iron leads to a reduction of the strain at break (in comparison to the common tensile test of the pure materials) and has to be evaluated. The main requirement of pressure resistance up to 1 MPa was tested on two chosen materials. Both materials fulfill this requirement.


international spring seminar on electronics technology | 2013

Characterization and binder burnout studies of ferrite LTCC tapes

Manuela Franz; Kostja Makarovič; S. Lüftl; Andrea Marić; Ibrahim Atassi; Marko Hrovat; Nelu Blaz; Goran Radosavljevic

This publication provides the results of material characterization and binder burnout studies of the commercially available ferrite LTCC (Low Temperature Co-fired Ceramics) tape ESL 40012 used for integrated passive components in LTCC packages. The investigations comprised surface roughness measurements of the fired tape and chemical analysis of the green tapes as well as tapes fired at different peak temperatures by X-ray powder diffraction (XRD) and energy dispersive X-ray spectroscopy (EDXS) analysis. Furthermore, thermogravimetric analysis (TGA) in air and binder burnout studies of different unlaminated stacking heights and different heating rates were performed.


Polymer Degradation and Stability | 2006

Thermal-oxidative induced degradation behaviour of polyoxymethylene (POM) copolymer detected by TGA/MS ☆

S. Lüftl; Vasiliki-Maria Archodoulaki; Sabine Seidler


Polymer Degradation and Stability | 2004

Thermal degradation behaviour of poly(oxymethylene) : 1. Degradation and stabilizer consumption

Vasiliki-Maria Archodoulaki; S. Lüftl; Sabine Seidler


Polymer Testing | 2006

Oxidation induction time studies on the thermal degradation behaviour of polyoxymethylene

Vasiliki-Maria Archodoulaki; S. Lüftl; Sabine Seidler


Polymer Degradation and Stability | 2007

Property changes in polyoxymethylene (POM) resulting from processing, ageing and recycling

Vasiliki-Maria Archodoulaki; S. Lüftl; Thomas Koch; Sabine Seidler


Journal of Applied Polymer Science | 2007

Degradation behavior of polyoxymethylene: Influence of different stabilizer packages

Vasiliki-Maria Archodoulaki; S. Lüftl; Sabine Seidler


Polymer Engineering and Science | 2009

Nonisothermal Thermophysical Evaluation of Polypropylene/Natural Rubber Based TPEs: Effect of Blend Ratio and Dynamic Vulcanization

Aju Joseph; S. Lüftl; Sabine Seidler; Sabu Thomas; Kuruvilla Joseph


Journal of Thermal Analysis and Calorimetry | 2011

Kinetic study of the polymeric binder burnout in green low temperature co-fired ceramic tapes

S. Lüftl; Bruno Balluch; Walter Smetana; Sabine Seidler

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Sabine Seidler

Vienna University of Technology

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Thomas Koch

Vienna University of Technology

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Bruno Balluch

Vienna University of Technology

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Walter Smetana

Vienna University of Technology

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C. Schoberleitner

Vienna University of Technology

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G. Stangl

Vienna University of Technology

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Goran Radosavljevic

Vienna University of Technology

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Ibrahim Atassi

Vienna University of Technology

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L. A. Mateos

Vienna University of Technology

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