S. Mattiazzo

Monolithic active pixel sensor development for the upgrade of the ALICE inner tracking system

ALICE plans an upgrade of its Inner Tracking System for 2018. The development of a monolithic active pixel sensor for this upgrade is described. The TowerJazz 180 nm CMOS imaging sensor process has been chosen as it is possible to use full CMOS in the pixel due to the offering of a deep pwell and also to use different starting materials. The ALPIDE development is an alternative to approaches based on a rolling shutter architecture, and aims to reduce power consumption and integration time by an order of magnitude below the ALICE specifications, which would be quite beneficial in terms of material budget and background. The approach is based on an in-pixel binary front-end combined with a hit-driven architecture. Several prototypes have already been designed, submitted for fabrication and some of them tested with X-ray sources and particles in a beam. Analog power consumption has been limited by optimizing the Q/C of the sensor using Explorer chips. Promising but preliminary first results have also been obtained with a prototype ALPIDE. Radiation tolerance up to the ALICE requirements has also been verified.

CHIPIX65: Developments on a new generation pixel readout ASIC in CMOS 65 nm for HEP experiments

Pixel detectors at HL-LHC experiments or other future experiments are facing new challenges, especially in terms of unprecedented levels of radiation and particle flux. This paper describes the progress made by the CHIPIX65 project of INFN for the development of a new generation readout ASIC using CMOS 65 nm technology.

Radiation hardness and detector performance of new 180nm CMOS MAPS prototype test structures developed for the upgrade of the ALICE Inner Tracking System

The features of the 180nm TowerJazz1 CMOS technology allow for the first time the use of CMOS Monolithic Active Pixel Sensors (MAPS) under the harsh operational conditions of the LHC experiments. The stringent requirements of the ALICE Inner Tracking System (ITS) in terms of material budget, radiation hardness, readout speed and a low power consumption have thus lead to the choice of MAPS as baseline technology option for the recently approved upgrade of the ITS and are the key drivers for R&D efforts on basic transistor and Explorer and MIMOSA pixel sensor prototypes produced in TowerJazz technology. Though the radiation loads expected for the ITS are below those of ATLAS and CMS, it is however necessary to assess the radiation hardness for ITS MAPS prototypes. Total Ionizing Dose (TID) radiation hardness has been established for basic transistor structures using a 60keV X-ray machine. The main operational characteristics and detection properties such as noise, charge collection efficiency and signal over noise ratio of Explorer-0 and MIMOSA32 and MIMOSA34 pixel sensor prototypes have been studied using X-rays (55Fe) and test beams at CERN and DESY before and after Non Ionizing Energy Loss (NIEL) and TID irradiation. In this paper the results of these R&D activities will be presented and discussed.

Impact of GigaRad Ionizing Dose on 28 nm bulk MOSFETs for future HL-LHC

The Large Hadron Collider (LHC) running at CERN will soon be upgraded to increase its luminosity giving rise to radiations reaching the level of GigaRad Total Ionizing Dose (TID). This paper investigates the impact of such high radiation on transistors fabricated in a commercial 28 nm bulk CMOS process with the perspective of using it for the future silicon-based detectors. The DC electrical behavior of nMOSFETs is studied up to 1 Grad TID. All tested devices demonstrate to withstand that dose without any radiation-hard layout techniques. In spite of that, they experience a significant drain leakage current increase which may affect normal device operation. In addition, a moderate threshold voltage shift and subthreshold slope degradation is observed. These phenomena have been linked to radiation-induced effects like interface and switching oxide traps, together with parasitic side-wall transistors.

RD53 Collaboration and CHIPIX65 Project for the development of an innovative Pixel Front End Chip for HL-LHC

Natale Demaria∗† INFN Sezione di Torino, Torino, Italy E-mail: demaria@to.infn.it F.Ciciriello, F.Corsi, C.Marzocca Politecnico di Bari, Bari, Italy G.De Robertis, F.Loddo, C.Tamma INFN Sezione di Bari, Bari, Italy V.Liberali, S.Shojaii, A.Stabile INFN Sezione di Milano and Universita degli Studi di Milano, Milano, Italy M.Bagatin, D.Bisello, S.Gerardin, S.Mattiazzo, L.Ding, P.Giubilato, A.Paccagnella INFN Sezione di Padova and Universita di Padova, Padova, Italy F.De Canio, L.Gaioni, M.Manghisoni, V.Re, G.Traversi, E.Riceputi INFN Sezione di Pavia and Universita di Bergamo, Bergamo, Italy L.Ratti, C.Vacchi INFN Sezione di Pavia and Universita di Pavia, Pavia, Italy R.Beccherle, G.Magazzu, F.Morsani, F.Palla INFN Sezione di Pisa, Pisa, Italy G.M.Bilei, M.Menichelli INFN Sezione di Perugia, Perugia, Italy E.Conti, S.Marconi, D.Passeri, P.Placidi INFN Sezione di Perugia and Department of Engineering, Universita di Perugia, Italy G.Dellacasa, G.Mazza, A.Rivetti, M.D.Da Rocha Rolo INFN Sezione di Torino, Torino, Italy E.Monteil, L.Pacher INFN Sezione di Torino and University of Torino, Torino, Italy

Characterization of new FBK double-sided 3D sensors with improved breakdown voltage

We report on the characterization of a new version of double-sided 3D sensors fabricated at FBK (Trento, Italy). Owing to a modified design and improved technology, the new devices feature a sizable increase of the breakdown voltage with respect to the ones previously fabricated at FBK. Before irradiation, the breakdown voltage is in the range from ~70 V to ~ 130 V, after irradiation up to large fluences, it is typically larger than 200 V, that is high enough for proper 3D sensor biasing even after very high radiation fluences like those foreseen at the High Luminosity LHC.

Total Dose Effects on a FD-SOI Technology for Monolithic Pixel Sensors

Monolithic pixel detectors in deep-submicron Fully Depleted (FD) Silicon On Insulator (SOI) technology have been developed and characterized. This summary presents the first assessments of the total dose effect from ionizing radiation performed on such detectors. This work, performed on single transistor test structures, shows how the substrate bias condition during irradiation plays a dramatic role on the resulting radiation damage.

GigaRad total ionizing dose and post-irradiation effects on 28 nm bulk MOSFETs

The DC performance of both n- and pMOSFETs fabricated in a commercial-grade 28 nm bulk CMOS process has been studied up to 1 Grad of total ionizing dose and at post-irradiation annealing. The aim is to assess the potential use of such an advanced CMOS technology in the forthcoming upgrade of the Large Hadron Collider at CERN. The total ionizing dose effects show limited influence in the drive current of all the tested nMOSFETs. Nonetheless, the leakage current increases significantly, affecting the normal device operation of the nMOSFETs. These phenomena can be linked to the charge trapping in the oxides and at the Si/oxide interfaces, related to both the gate oxide and the shallow trench isolation oxide. In addition, it has been observed that the radiation-induced effects are partly recovered by the long-term post-irradiation annealing. To quantify the total ionizing dose effects on DC characteristics, the threshold voltage, subthreshold swing, and drain induced barrier lowering have also been extracted for nMOSFETs.

Design of a 10-bit segmented current-steering digital-to-analog converter in CMOS 65 nm technology for the bias of new generation readout chips in high radiation environment

A new pixel front end chip for HL-LHC experiments in CMOS 65nm technology is under development by the CERN RD53 collaboration together with the Chipix65 INFN project. This work describes the design of a 10-bit segmented current-steering Digital-to-Analog Converter (DAC) to provide a programmable bias current to the analog blocks of the circuit. The main requirements are monotonicity, good linearity, limited area consumption and radiation hardness up to 10 MGy. The DAC was prototyped and electrically tested, while irradiation tests will be performed in Autumn 2015.

Ion Impact Detection and Micromapping With a SDRAM for IEEM Diagnostics and Applications

Ion electron emission microscopy (IEEM) can provide an alternative approach to microbeams for micrometric characterization of the sensitivity map to single event effects (SEE) of an electronic device. In IEEM technique, a broad (not focused) ion beam is sent onto the device under test (DUT). Secondary electrons emitted by the target surface during each ion impact are collected and focused by a system of electrostatic lenses and finally imaged by a high-rate and high-resolution position detector. We will report on the IEEM working at the SIRAD irradiation facility located at the 15 MV Tandem of INFN Legnaro National Laboratories. To estimate the IEEM resolution, a SDRAM is a good candidate to be used as a reference target, thanks to the micrometric feature size of the array of memory cells and the precise knowledge of their physical locations. Since an electronic device is not a good secondary electrons emitter, to ensure a copious and uniform emission of secondary electrons from the DUT, a very thin (100 nm) self-standing silicon nitride (Si3N4) membrane with a Au deposition (40 nm) is mounted on the top of the SDRAM. The Au/Si3N4 membrane and the underlying SDRAM are irradiated with a heavy ion beam. The physical map of ion impacts detected by the SDRAM is then compared with the one reconstructed by the IEEM in the same 500 ms time interval.