S.Y. Chang
National Yunlin University of Science and Technology
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Publication
Featured researches published by S.Y. Chang.
Journal of Materials Science: Materials in Electronics | 2012
L.C. Tsao; M. W. Wu; S.Y. Chang
This study investigated the effects of TiO2 nanoparticles on the interfacial microstructures and bonding strength of Sn0.7Cu (SC) composite solder joints in ball grid array packages with immersion Sn surface finishes. The addition of TiO2 nanoparticles to SC solders resulted in significant changes in the interfacial microstructure. The nanoparticle addition suppressed the growth of the Cu6Sn5 IMC layer, significantly improving shear strength and reliability of solder joints after multiple reflows. The fracture surfaces of the SC solder exhibited a semi-brittle fracture mode with a relatively smooth surface, while those of the SC composite solder showed typical ductile failures with very refined dimpled surfaces.
Materials & Design | 2011
S.Y. Chang; C.C. Jain; Trees-Juen Chuang; L.P. Feng; L.C. Tsao
Journal of Materials Science: Materials in Electronics | 2011
Trees-Juen Chuang; M. W. Wu; S.Y. Chang; S. F. Ping; L.C. Tsao
Journal of Materials Processing Technology | 2012
S.Y. Chang; L.C. Tsao; Y.H. Lei; S.M. Mao; C.H. Huang
Journal of Alloys and Compounds | 2009
S.Y. Chang; L.C. Tsao; T.Y. Li; Trees-Juen Chuang
Materials & Design | 2012
Trees-Juen Chuang; L.C. Tsao; Chien-Han Chung; S.Y. Chang
Journal of Electronic Materials | 2007
S.Y. Chang; Trees-Juen Chuang; C.L. Yang
Journal of Materials Processing Technology | 2008
S.Y. Chang; Trees-Juen Chuang; L. C. Tsao; C.L. Yang; Z.S. Yang
Journal of Materials Science: Materials in Electronics | 2012
S.Y. Chang; L.C. Tsao; M. W. Wu; Chieh-Chang Chen
Journal of Materials Science: Materials in Electronics | 2011
Ray-Wen Wu; L. C. Tsao; S.Y. Chang; C.C. Jain; Rong-Sheng Chen
Collaboration
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