S. Y. Chang

Active Soldering of Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce, Ga) Filler

Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investigated. Electron probe microanalyzer (EPMA) analyses reveal that the element oxygen distributes uniformly within the solder matrix after soldering, while Ti segregates effectively at the ITO/solder and Cu/solder interfaces at such a low temperature, giving satisfactory joining results of Cu/Cu, ITO/ITO, and ITO/Cu in air.

Morphology and growth kinetics of Ag3Sn during soldering reaction between liquid Sn and an Ag substrate

For the soldering of recycled Ag sputtering targets, the interfacial reaction between liquid Sn and an Ag substrate at temperatures ranging from 250 –425°C has been investigated. Experimental results show that a scallop-shaped layer of Ag3Sn intermetallic compounds formed during the soldering reaction. Kinetics analysis indicated that the growth of such interfacial Ag3Sn intermetallic compounds is diffusion-controlled with activation energy of 70.3kJ/mol. During the reaction, the Ag substrate dissolves into the molten Sn solder and causes the appearance of needle-shaped Ag3Sn precipitates in the Sn matrix.

Joining alumina to inconel 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal

Alumina ceramics were brazed to Inconel 600 and UMCo-50 superalloys at 900 °C for 10 min using an Sn10Ag4Ti active filler metal. The brazing filler showed good wettability on alumina and superalloys. The flexural strengths were 69 and 57 MPa for alumina/Inconel 600 and alumina/UMCo-50 joints, respectively. In both cases, the brazed specimens fractured along the Sn10Ag4Ti/superalloy interfaces after four-point bending tests. Electron probe microanalysis (EPMA) elemental mapping revealed that the Ni of Inconel 600 and the Co of UMCo-50 dissolved into Sn10Ag4Ti filler metal, which serves to reinforce the weak Sn10Ag4Ti matrix.

Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films

The interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films are investigated in the temperature range from 250–325 °C, and the morphology of intermetallic compounds formed after such soldering reactions is observed. In kinetics analysis of the growths of intermetallic compounds, it was found that both Sn/Ag and Sn-3.5Ag/Ag reactions were interfacial-controlled, and the growth rates for both cases were similar. The rate of Ag dissolution into liquid solder attendant on the formation of interfacial intermetallic compounds after Sn/Ag reaction was about four times higher than that after Sn-3.5Ag/Ag reaction, as evidenced by experimental results.

Corrosion behaviors of Al-Si-Cu-based filler metals and 6061-T6 brazements

The corrosion behaviors of a series of Al-Si-Cu-based filler metals and the 6061-T6 butt joints brazed with these filler metals are evaluated by polarization tests and immersion tests in a 3.5% NaCl aqueous solution. For comparison, a traditional Al-12Si filler metal is also employed. The results indicate that the Al-Si-Cu-based filler metals before brazing possess much higher corrosion current densities and pitting tendencies than the Al-12Si filler metal. However, brazing of the 6061-T6 alloy with an Al-12Si filler metal produces a wider butt joint, which, in this case, creates a more extensive corrosion region. Severe galvanic corrosion occurs at the 6061-T6 joints when brazed with Al-Si-Cu-based filler metals. However, in the case of the 6061-T6/Al-12Si brazements, selective corrosion of the Al-12Si eutectic phase can be observed. The bonding strengths of the 6061-T6 butt joints brazed with various filler metals are also measured before and after the immersion tests.