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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Sadahito Misumi is active.

Publication


Featured researches published by Sadahito Misumi.


Archive | 2009

DICING DIE-BONDING FILM

Takeshi Matsumura; Masaki Mizutani; Sadahito Misumi


Archive | 2010

Thermosetting die bonding film

Yuki Sugo; Sadahito Misumi; Takeshi Matsumura


Archive | 2008

Thermoset die bond film

Yasuhiro Amano; Asami Arai; Takeshi Matsumura; Tasuku Miki; Sadahito Misumi; Hisahide Takamoto; 翼 三木; 貞仁 三隅; 康弘 天野; 健 松村; 麻美 荒井; 尚英 高本


Archive | 2008

Heat curing die bond film

Yasuhiro Amano; Takeshi Matsumura; Tasuku Miki; Sadahito Misumi; Asami Oikawa; Hisahide Takamoto; 翼 三木; 貞仁 三隅; 麻美 及川; 康弘 天野; 健 松村; 尚英 高本


Archive | 2003

Epoxy resin composition and semiconductor device using the same

Tadaaki Harada; Toshitsugu Hosokawa; Kazuhiro Ikemura; Sadahito Misumi; Tsutomu Nishioka; Takashi Taniguchi; 貞仁 三隅; 忠昭 原田; 和弘 池村; 敏嗣 細川; 務 西岡; 剛史 谷口


Archive | 2002

Process for producing semiconductor wafer with adhesive film

Akiko Matsumura; Yuji Hotta; Sadahito Misumi


Archive | 2007

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

Yasuhiro Amano; Takeshi Matsumura; Sadahito Misumi; Hisahide Takamoto; 貞仁 三隅; 康弘 天野; 健 松村; 尚英 高本


Archive | 1999

Semiconductor sealing epoxy resin composition and semiconductor device using the same

Takashi Taniguchi; Minoru Yamane; Tsutomu Nishioka; Tadaaki Harada; Toshitsugu Hosokawa; Kazuhiro Ikemura; Sadahito Misumi; Shinichi Ohizumi


Archive | 2003

Adhesives composition, adhesive film, and semiconductor apparatus using the same

Sadahito Misumi; Takeshi Matsumura; Masaki Mizutani


Archive | 2002

Process of producing semiconductor device and resin composition sheet used therefor

Akiko Matsumura; Sadahito Misumi; Yuji Hotta

Collaboration


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